Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Edge AI Inference System
AIR-101
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Edge AI Inference System powered by Intel Atom® E3940 QC SoC and two Intel MA2485 VPUs. Intel Atom E3940 Quad Core SoC turbo burst up to 1.8 GHz. Intel® Movidius™ Myriad™ X VPU MA2485 x 2 Built-in.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Sharp Edge Tester
UI-T03
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Sharp Edge Tester is used to test if toy or other test sample has hazardous sharp edge or not.
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Product
Automated Control System for Veneer Edge Gluing Line
Vikat
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The automated veneer splicing line control system is designed to identify defective veneer areas, control the scrap trimming, bonding of suitable areas and the formation of output sheets of a given size.
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Product
Graphics Cards And Edge AI Acceleration Modules
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Advantech offers the first industrial-grade PCIe GPU cards powered by Intel® Arc™ GPUs, as well as Nvidia Quadro and AMD Radeon.
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Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
IoT Edge Computer With Intel® Celeron® J3455
UNO-247
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Intel® Celeron® J3455 processorRobust design with high stability2 x GbE, 2 x USB3.0, 2 x USB2.0, 4 x RS232, 2 x RS485, 1 x HDMI, 1 x VGACompact size with fanless designRubber stopper design for stand mount and optional kit for DIN-rail mountThreaded DC Jack design for more steady power supplyOptimized mechanical design for easier RAM swapping
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Product
NVIDIA® Jetson Nano™ Edge Inference Platform
DLAP-211-Nano
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- Deep learning acceleration with NVIDIA® Jetson Nano™- Compact fanless system 148(W)x120(D)x49.1(H)mm- Wide temperature range from -20°C to 70°C
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Product
UHD Edge Video Server
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The VEGA 7000 is a family of highly configurable video processing servers which has been optimized to scale throughput of live video applications.
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Product
Edge Applications
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Provide more powerful digital experiences with less overhead, using pre-built edge applications integrated with your CDN.
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Product
Equipment Front End Module Wafer Handler
Sigma EFEM
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Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Product
Signage & Edge Computers UBX Zero Series
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Compact ARM-based edge computer with full Google Mobile Services, security updates, and device management for smart retail and kiosks.
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
MiniPCIe Edge AI Module
VEGA-330
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miniPCIe Edge AI Module with two Intel® Movidius™ Myriad™ X VPUs onboard. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Signage & Edge Computers UBX-500 Series
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Mini edge servers are designed for compact spaces, efficiently storing and processing large data volumes for local computing and real-time AI.
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Product
Compact 2U Edge Server
SKY-8232DV2
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Compact 2U edge server with dual 3rd Gen Intel® Xeon® Scalable processors, ideal for dense AI inference and advanced edge analytics.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Wafer Analysis Systems
Tropel®
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Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Product
Edge Gateway
EPC-R6410
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EPC-R6410 is the RISC based box computer which integrated NXP i.MX6D/Q Cortex-A9 1.0GHz high performance processor. It is designed for the applications that require high performance and rich I/O but low power consumption. It supports dual display via HDMI and VGA up to 1080p, 1 Gigabit Ethernet, 6 USB 2.0 and 4 serials, as well as mini-PCIE for 4G/3G and M.2 for WiFi/BT. With wall mount brackets, fanless and dust-proof design, you can easy install in rugged environment.
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Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
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The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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Product
5G NR Powerful Edge Computing Gateways - ICR-4400
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5G ultra-high-speed 5G NR routers & powerful edge computing gateways with a variety of interfaces focused on complex router and IoT tasks.
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2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7211
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The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
Universal Edge Finder
BORDO
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No matter what surface condition may be given, our easy to use BORDO detects various edges in incident light and measures their position. The results of the measurement are transmitted with 1/10 mm resolution via a digital or serial interface to a PC or a PLC which now can place the object into the desired position. This makes BORDO being the perfect tool in many lay-down processes such as the alignment of tiles or other pressed goods. Other applications are checks of alignment. BORDO succeeds even under hard onditions e.g. with missing background, if a thickness of at least 5 mm is given. With its lasercross BORDO is fast and simple adjusted. Another ighlight are the selfregulating algorithms , which optimize parameters of easurement while processing.
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
Compact Size Mid Tower GPU Server AMD® EPYC™ 8004 Series Processor For Edge AI Inference, Industrial Automation, And Compact GPU Workloads.
SKY-602E3
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Processor: Single AMD® EPYC™8004 Series Server ProcessorMemory: 6 x DDR5-4800 MHz ECC RDIMM, up to 576GBRemote Management: IPMI function supportExpansion: Supports 4 x PCIe x16 double-deck FH/10.5" cards or 2 x PCIe x16 double deck FH/10.5" cards + 4 x PCIe x8 single deck FH/10.5" cardsPSU: 800 Watt 1+1 redundant power supply with 80+ platinum level certification
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Signage & Edge Computers USM-200 Series
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Rich IO edge computer suitable for connecting standard/customized peripherals.
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Wafer Test Solutions
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Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.





























