Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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LED Tester For Chip And Wafer
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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The Compact AI GigE Vision Systems for the Edge with Intel Movidius Myriad VPU
EOS-i6000-M Series
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform, flexible, scalable solution that delivers business value.
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Contactless Wafer Geometry Gauge
MX 20x series
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Edge AI Platform Powered by NVIDIA® Jetson AGX Xavier™
DLAP-401-Xavier
- Deep learning acceleration with NVIDIA Jetson AGX Xavier- Compact system 150(W) x 145(D) x 85(H) mm- 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG- Internal function expansions by M.2 E key 2230, M.2 B key 3042- 24V DC input- Additional storage by M.2 B key 2242
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CODESYS-Ready Edge Controller
AMAX-600 series are PC-Based edge controllers powered by CODESYS, the software PLC control kernel with Industrial Ethernet for OT applications.
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Edge Connector Fixture
EDGE
An edge connector fixture can be a low cost alternative to a bed of nails fixture. The most important features of this Edge Connector Tester is its portablility, ease of use, intuitive control functions, and durability in a production environment.
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Wafer Thickness, TTV, Bow and Warpage
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Edge Gateway
Arm-based industrial gateways are based on NXP, Qualcomm, Rockchip, and TI, delivering LTE, 5G and Wi-Fi with wide operating temperature range.
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NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge with IP67
NEON-2000-JT2-X Series
ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Contactless One-Point Wafer Thickness Gauge
MX 30x
The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Wafer Chip Inspection System
7940
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Intel® Movidius™ Myriad™-Based Industrial AI Smart Camera for the Edge
NEON-1000-MDX Series
ADLINK's NEON-1000 Series of industrial smart cameras supports the Intel® Movidius™ Myriad™ X VPU and a range of image sensors, providing users the flexibility to handle a wide variety of applications.
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5G Edge Servers
ADLINK is committed to developing industry-leading edge computing platforms to drive the transformation of communications network architectures, and enable customers to explore new services and business models across various market segments. Validated for NGC-Ready and AWS IoT Greengrass, ADLINK’s OTII-compliant Edge Server MECS series provides a versatile, cost effective and scalable white-box solution to facilitate deployment of 5G RAN and private networks, and enable a wide range of 5G use cases, including 5G DU/CU in open RAN and private networks in smart factory, mining, transportation and more.
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Sharp Edge Tester
UI-T03
Sharp Edge Tester is used to test if toy or other test sample has hazardous sharp edge or not.
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NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge
NEON-2000-JT2 Series
ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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16 Channel Leading Edge Discriminator
V895
The Mod. V895 is a 1-unit wide VME module housing a 16 channel leading edge discriminator. The module accepts 16 negative (positive on request) inputs and produces 16 differential ECL outputs with a fan-out of two on four front panel flat cable connectors.
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Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Wafer ESD Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
