Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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The Compact AI GigE Vision Systems for the Edge with Intel Movidius Myriad VPU
EOS-i6000-M Series
System
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform, flexible, scalable solution that delivers business value.
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Wafer and Cells PL System
HS-PL
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Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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04 With Soldering Eyelets | 2 Wafer | 12 Positions
04-2xx4-00/30-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
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The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
AIR Edge AI HPC
AIR-540
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Edge AI HPC Powered by AMD EPYC 8004 series, support 4pcs 2.5-slot GPUs. Powered by the energy-efficient AMD EPYC™ 8004 Series Processor. 4pcs 2.5-slot GPUs for high-density computing. 6x DDR5 ECC-REG RDIMMs for superior reliability and performance.
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1U 19” Edge Server With 4th Gen Intel® Xeon® Processor Scalable Family Processor
MECS-7120
MEC Server
- 1U 19” Edge Server with 4th Gen Intel® Xeon® Processor Scalable Family Processor- 6x DDR5 DIMMs, 4800MT/s (6 channels, 1DPC)- On-board 2x 25G SFP28 Ethernet ports- 1U 19’’ rackmount form factor for telecom infrastructure deployment- RunBMC with AST2600, IPMI v2.0/Redfish compliant- Optional clock module to provide time sync from GNSS- Designed for 5G: DU, DU+CU, DU+CU+MEC, MEC, uCPE, industrial edge computing
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Edge AI Inference System
AIR-055
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Edge AI Inference system powered by Qualcomm Dragonwing™ IQ-9075 processor up to 100 TOPS. Compact and high performance Edge AI box at least 100 TOPS AI computing. Qualcomm ® DragonWing IQ9075 processor built-in.
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Edge AI & Intelligence Solutions
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Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers, and IoT gateways to accelerate AIoT development.
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Edge AI Platforms
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ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.
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Edge Impulse
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The leading development platform for building, optimizing, and deploying machine learning models directly on edge devices.
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04 With Pins For PCB | 3 Wafers | 24 Positions
04-3xx3-20/70-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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NVIDIA® Jetson Nano™ Edge Inference Platform
DLAP-211-Nano
Platform
- Deep learning acceleration with NVIDIA® Jetson Nano™- Compact fanless system 148(W)x120(D)x49.1(H)mm- Wide temperature range from -20°C to 70°C
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Dual-System Rugged Edge AI Platform
TREK-60N
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Dual-System Rugged Edge AI Platform for In-Vehicle & Harsh Environments. Intel® & NVIDIA® dual-system to provide excellent vehicle edge AI computing performance. 4ch PoE support video streams for AI capacity, In-vehicle specialized design: 12/24V certified car power (E-Mark, ISO-7637-2), dual CANbus.
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2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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01 With Soldering Eyelets | 12 Positions | M8 | 2 Wafers
01-2xxx-00/30xx-12-0
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Multi wafer compact selector with 30° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Edge Applications
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Provide more powerful digital experiences with less overhead, using pre-built edge applications integrated with your CDN.
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Intel® Processor N97 IoT Edge Computer With 4x LAN, 6x COM, 4x USB, 1x HDMI, And 1x VGA.
UNO-247 V2
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Intel® Processor N97Flexible iDoor expansion design with sufficient IO port4 x GbE, 2 x USB3.2, 2 x USB2.0, 2 x RS232/422/485, 4 x RS485, 1 x HDMI, 1 x VGA, 2 x GPIOCompact size with fanless designOptional 4G/GPS/GPRS/Wi-Fi communicationTerminal block for wiring capabilityOptimized mechanical design for easier RAM swappingSupport Win11 IoT and Ubuntu 22.04
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Edge AI Inference System
AIR-310
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Edge AI inference system powered by 12th/13th/14th Gen Intel® Core™ processors with MXM GPU support. Support Intel ® 12th/13th/14th Gen. Core™ i3/i5/i7/i9 processor up to 65W. DDR5 SO-DIMM memory support up to 64 GB.
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MiniPCIe Edge AI Module
VEGA-330
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miniPCIe Edge AI Module with two Intel® Movidius™ Myriad™ X VPUs onboard. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks.
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Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Edge AI Inference System
AIR-030
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Edge AI Inference system powered by NVIDIA® Jetson AGX Orin™ and 3 x 2.5GbE Lan. Compact and high performance AI box. NVIDIA® Jetson AGX Orin™ 64GB and 32GB Modules.
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Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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M.2 Edge AI Module With One Intel® Movidius
VEGA-320
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m.2 Edge AI Module with one Intel® Movidius™ Myriad™ X VPU onboard. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks. Scalable for multi video streams edge inference.
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Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
