Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
-
product
Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
-
product
WATOM
Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
-
product
Edge Card Adapter, Universal, for .093 PCB
111107148
VPC provides two types of Edge Card Adapter Kits for 10, 25 and 50 Module ITA Enclosures. Both kits are designed for various sized cards.The Universal Edge Card Adapter Kit’s card guides are hinged and can be folded for storage by releasing the holding latches on either side of the card.
-
product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
-
product
Edge Gateway
The Edge Gateway provides a solution to manage distributed wireless sensors. On the one hand, new sensors can be added to the measurement systems easily and on the other hand, the gateway is powerful enough to evaluate the measurements and detect irregularities.
-
product
Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
-
product
Wafer Prober
Prexa
The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
-
product
Solid Edge
Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
-
product
Edge Applications
Provide more powerful digital experiences with less overhead, using pre-built edge applications integrated with your CDN.
-
product
Edge Compute Solutions
Innovate in real time. With the world’s largest serverless compute platform, Akamai puts your code closer to your users.
-
-
product
Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
-
product
Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
-
-
product
Signage & Edge Computers
Compact, powerful computers and servers support diverse smart city applications at edge points.
-
product
Edge Connector Fixture
EDGE
An edge connector fixture can be a low cost alternative to a bed of nails fixture. The most important features of this Edge Connector Tester is its portablility, ease of use, intuitive control functions, and durability in a production environment.
-
product
Edge AI System
Axiomtek designs, develops and manufactures edge AI (Artificial Intelligence) systems to fulfill AI solution-ready system requirements. The AI embedded systems are ideal for smart manufacturing, machine vision, deep learning, edge computing, and much more.
-
product
Edge Radius Measurement
EDGEINSPECT
NOVACAMTM EDGEINSPECTTM system is a modular, non-contact 3D metrology system that:Measures, down to the micron, any type of edge: cutting edges, inside or outside edges, edges on round holes, straight edges, etc.
-
product
Azure IoT Edge
Azure IoT Edge is a fully managed service built on Azure IoT Hub. Deploy your cloud workloads—artificial intelligence, Azure and third-party services, or your own business logic—to run on Internet of Things (IoT) edge devices via standard containers. By moving certain workloads to the edge of the network, your devices spend less time communicating with the cloud, react more quickly to local changes, and operate reliably even in extended offline periods.
-
product
Manual Contactless Wafer Detector
HS-NCS-300
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
-
product
Leading Edge Sensors
The LaserGauge® Leading Edge Profiling System consists of a handheld or benchtop sensor and the Leading Edge software application. Designed to scan both sides of the blade simultaneously, the sensor returns a complete profile around the radius of the blade, which allows accurate measurements of the thickness and the plotting of the blade profile for comparison to its engineering design.
-
product
Wafer Test
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
-
product
Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
-
product
Wafer Test Solutions
Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
-
product
GPU Edge Computers
AI workstations with GPU computing power are systems designed for industrial image analytic applications e.g. AOI, and medical image applications.
-
product
Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
-
product
Contactless Wafer Geometry Gauge
MX 20x series
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
-
product
MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
-
product
Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
-
product
Edge AI Box
Arm-based edge AI boxes are powered by NXP, NVIDIA and Rockchip. They provide AI inference capabilities in a low-power fanless design.
