Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
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Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Product
AIR Edge AI HPC
AIR-530
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AIR-530 is based on NVIDIA IGX platform which provides 200GbE Ethernet bandwidth and 32 TFLPOS AI computing power with NVIDIA safety design. Edge AI workstation with NVIDIA IGX Platform.
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Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Edge AI Platform Powered by NVIDIA® Jetson AGX Xavier™
DLAP-401-Xavier
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- Deep learning acceleration with NVIDIA Jetson AGX Xavier- Compact system 150(W) x 145(D) x 85(H) mm- 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG- Internal function expansions by M.2 E key 2230, M.2 B key 3042- 24V DC input- Additional storage by M.2 B key 2242
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Edge AI Platforms
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ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.
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Product
8K UHD Fanless Edge Computer
UBX-110H
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The UBX-110H is an 8K UHD fanless edge computer powered by an Intel® Celeron® 6305E or 11th generation Core™ i3/i5/i7 processor. Built-in an Intel® Celeron® 6305E or 11th gen Core™ i3/ i5/ i7 processor, Built-in a TPM 2.0 chip for data encryption enhancement.
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Product
M.2 Edge AI Module With One Intel® Movidius
VEGA-320
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m.2 Edge AI Module with one Intel® Movidius™ Myriad™ X VPU onboard. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks. Scalable for multi video streams edge inference.
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Product
1U 19” Edge Server With 4th Gen Intel® Xeon® Processor Scalable Family Processor
MECS-7120
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- 1U 19” Edge Server with 4th Gen Intel® Xeon® Processor Scalable Family Processor- 6x DDR5 DIMMs, 4800MT/s (6 channels, 1DPC)- On-board 2x 25G SFP28 Ethernet ports- 1U 19’’ rackmount form factor for telecom infrastructure deployment- RunBMC with AST2600, IPMI v2.0/Redfish compliant- Optional clock module to provide time sync from GNSS- Designed for 5G: DU, DU+CU, DU+CU+MEC, MEC, uCPE, industrial edge computing
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Product
Dual-System Rugged Edge AI Platform
TREK-60N
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Dual-System Rugged Edge AI Platform for In-Vehicle & Harsh Environments. Intel® & NVIDIA® dual-system to provide excellent vehicle edge AI computing performance. 4ch PoE support video streams for AI capacity, In-vehicle specialized design: 12/24V certified car power (E-Mark, ISO-7637-2), dual CANbus.
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
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*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Product
iBMC Edge Intelligent Solution
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Intelligent board management controller (iBMC) is embedded hardware-based technology that allows administrators to conduct power management remotely.
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Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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1U OTII-Compliant Edge Server
SKY-7120S
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1U OTII-compliant edge server with Intel® Xeon® D-2100 CPU. Short-depth, front I/O, and wide temp design for 5G vRAN and mission-critical telecom.
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Product
Wafer Prober Networking System
PN-300
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The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Product
SQFlash ER-1 U.2 2.5" SSD (SFF-8639) PCIe/NVMe Gen.4 X4, Edge Grade
SQF-CU2 ER-1
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U.2 (SFF-8639) PCIe/NVMe 2.5" SSD, Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4, AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC, Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution, SMART and GUI management tool.
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Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
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The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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Signage & Edge Computers UBX-300 Series
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NUC-sized edge computers equipped with Intel® Core™ Ultra Processors provide flexible I/O expansion and AI computing power.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Edge AI HPC
AIR-410
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Edge AI HPC powered by AMD Ryzen 8040 series processor with 39TOPS supporting one 3-slot GPU. Ryzen 8040 processor up to 54W with 39TOPS AI computing (CPU+iGPU+iNPU) Dual channel memory up to 96GB DDR5 5600MT/s.
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Wafer Demounting And Cleaning Machines
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Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Product
Compact DIN-Rail Edge Controller With 11th Gen Intel® Core™ I CPU
UNO-148
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Port isolation for 8 x DI, 8 x DO, 4 x COMSupports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modulesDual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technologyRemote out-of-band (OOB) power management with Advantech iBMC technologyMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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Compact IoT Edge Computer With Intel® 12th Gen. Core™ I Processor
UNO-238 V2
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12th Gen Intel® Core™ i Processor up to 10 CoresDual Channel DDR5-4800 up to 64GBM.2 E-Key, B-Key, M-Key (support NVMe) expansion for storage/wirelessEquipped with CANBus for reliable communicationDC-in terminal block for wiring flexibilitySupports multiple displays for ThinManager solutionSupports software APIs, WISE DeviceOn, WISE Edge365
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Edge Mini Server System
UBX-510SL
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Edge Mini Server System with Intel® 13/14th Gen Core™ i7/i5/i3 Series Processor. Built-in an Intel® 13/14th Gen Core™ i3/i5/i7 processor, Support Windows Server 2022 or Windows 10/11. Plentiful I/O ports for various apploications, Supports pre-certified Intel®/NVIDIA® graphics, Advantech DVP, VEGA, and PCIe add-on cards for retail AI applications.
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Edge AI Inference System
AIR-030
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Edge AI Inference system powered by NVIDIA® Jetson AGX Orin™ and 3 x 2.5GbE Lan. Compact and high performance AI box. NVIDIA® Jetson AGX Orin™ 64GB and 32GB Modules.
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Product
Pocket-Size DIN-Rail Edge IPC With Intel® Atom® X6413E
UNO-127
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Intel® Quad core x6413E processor with 4GB/8GB DDR4 onboard memoryCompact, robust, fanless and cable-free system with high stabilityOptimized basic unit with 2 x GbE, 2 x USB, 1 x HDMIOn-board full-size mPCIe port for various expansion capabilityBuilt-in TPM2.0 for hardware-based securitySystem ground isolation designCertified with IEC 61010-2-201 for industrial applicationUbuntu Core 20 certified hardwareSupport Windows 11 IoT Enterprise LTSC
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1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
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- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Product
NVIDIA® Jetson Orin™ NX Edge AI Computer
TREK-50N
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NVIDIA® Jetson Orin™ NX Edge AI Computer for In-Vehicle & Harsh Environments. 12V/24V certified car power (E-Mark, ISO-7637-2), 4ch PoE port or 4ch GMSL2 port input. Rugged platform with IP67, 5M3 (100g/6ms shock, 3 Grms vibration), and -20 to 70°C fanless operation w/o airflow.
