Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
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The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Product
Signage & Edge Computers
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Compact, powerful computers and servers support diverse smart city applications at edge points.
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Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
IoT Edge Computer With Intel® Celeron® J3455
UNO-247
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Intel® Celeron® J3455 processorRobust design with high stability2 x GbE, 2 x USB3.0, 2 x USB2.0, 4 x RS232, 2 x RS485, 1 x HDMI, 1 x VGACompact size with fanless designRubber stopper design for stand mount and optional kit for DIN-rail mountThreaded DC Jack design for more steady power supplyOptimized mechanical design for easier RAM swapping
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Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Product
04 With Pins For PCB | 4 Wafers | 24 Positions
04-4xx3-20/70-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Edge Gateway
EPC-R3220
Edge Gateway
EPC-R3220 is a RISC-based box computer integrated with the TI Sitara AM3352 Cortex-A8 0.8GHz processor. It is designed for applications that require multiple connectivity points and low power consumption. The EPC-R3220 offers dual RS-232/485 serial ports with Modbus/OPC-UA protocol support for date collection, 6GPIOs for indication or device control, dual 10/100/1000 Ethernet ports, one wifi/BT onboard solution and one Mini-PCIE that can expand to an LTE solution. EPC-R3220 supports wide-ranging power input and temperature and supports both DIN-rail and wall mounting.
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Product
Compact Edge AI Platform For Various AI And AMR Applications
DLAP-411-Orin
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ADLNK DLAP-411-Orin Edge AI Inference Platform powered by NVIDIA® Jetson AGX Orin™ is a high-performance platform designed for deployment of AI-powered systems at the edge, providing the computing power needed for demanding AI applications.
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Product
Fanless Edge AI System With NVIDIA® JETSON™ Xavier NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL-NX
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*NVIDIA® Jetson™ Xavier NX with Volta™ architecture with 384 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +50°C*JetPack supported
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Product
Edge AI HPC
AIR-420
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Edge AI HPC powered by AMD EPYC & Ryzen processors and NVIDIA Qualified RTX™ PRO 6000 Blackwell Max-Q WS Edition. AMD Ryzen 7000/9000 & EYPC 4005 series processor provides up to 16 cores. NVIDIA Qualified with RTX™ PRO 6000 Blackwell Max-Q WS Edition graphic card.
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Product
Extreme Performance Edge Servers
Ark-7000 Series
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ARK-7000 series feature Intel Xeon processors and multiple expansion slots, delivering high-speed data transfer rates and enhanced remote management.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
Pocket-Size Edge IoT Gateway With Intel® Celeron®N6210/Pentium® N6415
UNO-2271G V2
IoT Gateway Platform
Intel® Celeron® Dual core N6210/ Pentium® Quad core N6415 processor with 4GB/8GB DDR4 onboard memoryPocket-size, robust, fanless and cable-free system with high stabilityOptional second stack for increasing functionality including POE, COM, wireless connectivity or iDoor expansionSupport Windows 11 IoT Enterprise LTSC, Win10, Ubuntu Classic and Ubuntu Core 20Microsoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
WebAccess Software & Edge SRP
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Advantech’s WebAccess and other IoT software products provide a complete solution for device and data management to enable edge intelligence.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7211
MEC Server
The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
4K UHD Fanless Edge Computer
UBX-110K
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The UBX-110K is a 4K UHD fanless edge computer powered by an Intel® N97 or Core™ i3-N305 processor. Built-in an Intel® N97 or Core™ i3-N305 processor, Built-in a TPM 2.0 chip for data encryption enhancement. Supports triple displays to expand the visible range and provide detailed video content. Supports two M.2 2280 SATA SSD expansions.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Compact 1U Edge Server
SKY-8132S
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Compact 1U edge server with a 3rd Gen Intel® Xeon® CPU and 20.4" depth. A versatile platform for 5G Open RAN, MEC, and AI inference at the edge.
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Rugged In-Vehicle Edge AI Platform
TREK-60
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Rugged In-Vehicle Edge AI Platform with 8 Channel PoE for In-Vehicle & Harsh Environments. 8ch PoE support for commercial vehicles and heavy duty machinery, In-vehicle specialized design: 12V/24V certified car power (E-Mark, ISO-7637-2), dual CANbus.
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Edge AI & Intelligence Solutions
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Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers and IoT gateways to accelerate AIoT development.
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Product
360° Edge Analytics
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360° Edge Analytics fills the gap between location data and the individual business application. The Location Data Analytics technology leverages precise position data augmented by application context information to gain business insights from complex processes. Assessment, optimization as well as process restructuring will be possible with nanotron’s complete solutions based on its Location-Aware IoT Platform with Location Data Analytics.
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Product
Wafer Analysis Systems
Tropel®
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Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Product
Edge AI Box
EPC-R7000
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EPC-R7000 is an ARM-based Edge AI Inference Box Computer powered by NVIDIA® JETSON™ TX2 Dual-Core NVIDIA Denver2 + Quad-core ARM Cortex-A57 processor and NVIDIA Pascal™ 256 CUDA cores GPU which provides high performance computing and supports the AIM-Linux/Edge AI Software Package. It is an ideal solution for AI and Machine Vision applications.
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Product
Universal Edge Finder
BORDO
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No matter what surface condition may be given, our easy to use BORDO detects various edges in incident light and measures their position. The results of the measurement are transmitted with 1/10 mm resolution via a digital or serial interface to a PC or a PLC which now can place the object into the desired position. This makes BORDO being the perfect tool in many lay-down processes such as the alignment of tiles or other pressed goods. Other applications are checks of alignment. BORDO succeeds even under hard onditions e.g. with missing background, if a thickness of at least 5 mm is given. With its lasercross BORDO is fast and simple adjusted. Another ighlight are the selfregulating algorithms , which optimize parameters of easurement while processing.
