Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
-
Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
-
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
-
Product
Edge AI HPC
AIR-420
-
Edge AI HPC powered by AMD EPYC & Ryzen processors and NVIDIA Qualified RTX™ PRO 6000 Blackwell Max-Q WS Edition. AMD Ryzen 7000/9000 & EYPC 4005 series processor provides up to 16 cores. NVIDIA Qualified with RTX™ PRO 6000 Blackwell Max-Q WS Edition graphic card.
-
Product
Edge Mini Server System
UBX-510SZ
-
Edge Mini Server System with Intel® Xeon® W-12xx or 10th Gen. Core™ i7/i5/i3 Series Processor. Built-in an Intel® Xeon® W-12xx or 10th Gen Core™ i3/i5/i7 processor, Supports Windows Server 2019/2022 or Windows 10/11. Plentiful I/O ports for various apploications, Easy-maintenance hard drive cage for large storage (RAID) capability, Flexible PCIe expansion.
-
Product
Tunable Edge Filters
-
Tunable edge filter is a customized product. It usually belongs to 2-port optical tunable filter product platform. Instead of using narrow bandpass filter in the 2-port tunable optical filter, the tunable edge filter utilizes a low-pass or long-pass interference filter. By changing the incident angle of the light beam, the cut-off wavelength will be tuned. Standard Tunable edge filters support C-band or L-band wavelength range.
-
Product
360° Edge Analytics
-
360° Edge Analytics fills the gap between location data and the individual business application. The Location Data Analytics technology leverages precise position data augmented by application context information to gain business insights from complex processes. Assessment, optimization as well as process restructuring will be possible with nanotron’s complete solutions based on its Location-Aware IoT Platform with Location Data Analytics.
-
Product
Rugged In-Vehicle Edge AI Platform
TREK-60
-
Rugged In-Vehicle Edge AI Platform with 8 Channel PoE for In-Vehicle & Harsh Environments. 8ch PoE support for commercial vehicles and heavy duty machinery, In-vehicle specialized design: 12V/24V certified car power (E-Mark, ISO-7637-2), dual CANbus.
-
Product
PCI Edge Connector Card
PMC239/F
-
The PMC239/F also comes with a fan. The fan can be disconnected from its power if not needed.
-
Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
-
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
-
Product
Bare Wafer Inspection System
LS-6700
-
Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
-
Product
Single Wafer Transfer Tools
-
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
-
Product
Long Edge Wet Film Combs (Stainless Steel)
3238
-
Each comb has 24 measurement steps (teeth) providing a more accurate wet film thickness value.
-
Product
System to Handle Wafer Levels
AMI AW Series
-
Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
-
Product
VUltra-Short 1U Edge Server
SKY-8134S-11
-
vUltra-short 1U edge server with 4th Gen Intel® Xeon® Scalable processor, optimized for Open RAN, MEC, and low-latency edge workloads.
-
Product
Wafer Chucks
-
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
-
Product
Wafer Thickness Measurement System
MPT1000
-
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
-
Product
Operation Support System for Wafer Prober
N-PAF
-
N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
-
Product
Wafer Test
-
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
-
Product
Leading Edge Sensors
-
The LaserGauge® Leading Edge Profiling System consists of a handheld or benchtop sensor and the Leading Edge software application. Designed to scan both sides of the blade simultaneously, the sensor returns a complete profile around the radius of the blade, which allows accurate measurements of the thickness and the plotting of the blade profile for comparison to its engineering design.
-
Product
Deep Observability For Critical Edge Software
DevAlert
-
Get cloud-based observability on anomalies in edge devices and embedded software. Detect and analyse issues remotely, during testing and in deployed devices. Use your familiar desktop tools for secure remote debugging.
-
Product
Solar Wafer Transfer Tool
-
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
-
Product
Wafer Defect observing instrument
HS-WDI
-
Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
-
Product
Edge AI Software
-
Advantech understands the bottlenecks in developing AI applications and offers full software support to accelerate deployment.
-
Product
Wafer Probe Heads
-
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
-
Product
Wafer Thickness, TTV, Bow and Warpage
-
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
-
Product
BT Imagine New wafer Thickness System
IS-T1
-
Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
-
Product
Ultrasonic Wafer Scanner
AutoWafer
-
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
-
Product
2D/3D Wafer Metrology System
7980
-
Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
-
Product
In-Process Wafer Inspection System
7945
-
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
-
Product
Edge Gateway
UBC-330
-
UBC-330 is a RISC computing box powered by a TI Sitara™ AM3352 Cortex®-A8 processor and equipped with 2 Gigabit Ethernet, 5 serial, 4 GPI, and 4 GPO ports. For industrial applications, the serial and GPIO ports feature rugged ESD and isolation protection to prevent system damage from power fluctuations. UBC-330 also supports multiple power input voltages and a wide operating temperature, making it the ideal solution for automation control in smart grid, industrial, and machinery automation applications.
-
Product
2U Short-Depth Optimized Chassis For ASMB-62 Series Edge Server Board For Edge Computing.
HPC-6240
-
Supports ASMB-62 edge series motherboardFour 2.5" hot-swappable SATA drive bays (2 NVMe drives in option)Four FH/10.5"L and four FH/HL expansion slots1200W 1+1 redundant power supply with 80 Plus platinum level certificateUltra Slim ODD support in option2U Front Bezel in option
