Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
AI Inference System Based On NVIDIA Nova Orin For AMR Applications
MIC-732-AO
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Fanless and ultra-compact design. Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS. Supports 1 x 10GbE, 1 x 2.5GbE, 3 x USB 3.2 Gen 2 (10 Gbit/s). Supports 2 x CANbus, 1 x mPCIe, 2 x Nano SIM slots. Support Total 8-ch GMSL3.0/2.0 with FAKRA connectors.
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Product
Wafer and Cells PL System
HS-PL
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Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Product
Fanless Edge AI System With NVIDIA® JETSON™ TX2 Series SoM, 1 HDMI, 2 GbE LAN, 2 USB, 2 COM Or 2 CAN And 12 Or 24 VDC
AIE500-901-FL
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The AIE500-901-FL is an advanced Artificial Intelligence embedded system for edge AI computing and deep learning applications. The high-performance embedded system employs an NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM® A57 processor; NVIDIA® Pascal™ GPU with 256 CUDA cores; and 8GB of 128-bit LPDDR4 memory. To withstand the rigors of day-to-day operation, the AIE500-901-FL has an extended operating temperature range of -30°C to +60°C and vibration of up to 3 Grms with its strong construction. This fanless Artificial Intelligence edge system is dedicated to achieving operational excellence, efficiency, reliability in smart manufacturing and intelligent edge applications. The edge computing device provides solutions as Edge AI embedded system, specifically designed for video analysis, object classification, computer vision, quality control and more. Under the ultra-compact enclosure design, the AIE500-901-FL comes with 32GB eMMC onboard and is equipped with one M.2 Key M 2280 SSD slot with PCIe and SATA signal and one Micro SD slot for massive data processing and AI applications. Besides, this reliable embedded system has one full-size PCI Express Mini Card slot and one SIM slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections.
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Product
Wafer Probe Loadboards/PIB
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DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Product
Fanless Edge System With NVIDIA® JETSON™ TX2, 1 HDMI 2.0,2 GbE LANs And 1 USB 2.0
eBOX560-900-FL
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The eBOX560-900-FL employs a NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor; a 256 CUDA cores with NVIDIA® Pascal™ GPU Architecture; 8GB of LPDDR4 memory; and 802.11ac Wi-Fi with Bluetooth. It also supports NVIDIA JetPack 3.2 SDK including TensorRT, cuDNN, CUDA Toolkit, VisionWorks, GStreamer, and OpenCV, all built on top of L4T with LTS Linux kernel. The extremely compact system is your superb choices for AI, deep learning, and edge computing. Its tough construction is IP40-rated, and it has an extended operating temperature range of -30°C to +60°C (-22°F to +140°F) and up to 3G vibration endurance.
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Product
Compact IoT Edge Computer With Intel® Core™ I CPU
UNO-238
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8th generation Intel® Core™ i processor2 x GbE, 4 x USB3.2, 2 x RS-232/422/485, 1 x HDMI, 1 x DP, 1 x GPIO (8 bit)Compact, fanless designRubber stopper for stand mount and optional kit for DIN-rail mountingThreaded DC jack for reliable power supplyOptimized mechanical design for easy RAM swapping
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Product
Fanless Scalable Railway Edge AI Platform
AVA-7200
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- EN 50155:2021 certified Edge AI platform.- NVIDIA Ampere GPGPU (A2000/A4500) and Intel® 13th Gen Raptor Lake mobile processor.- Isolated DC 24-110V (200W) or 72-110V (300W) input, configurable by BOM.- Operates at -25°C to 55°C (OT1, ST1) or -25°C to 70°C (OT3, ST1).- 8x 10GbE/2.5GbE M12 X-coded Ethernet, 5x USB, 4x SATA, 4x DI/DO, 2x Serial ports, audio, and DP.- Internal expansion for 1x NVME M.2 slot, 1x 5G M.2 slot with 2x SIM slots, 1x Wifi/BT M.2 slot, 1x mPCIe, accessible by lid opening- QMA antenna on the rear side- Fanless rugged design, conformal-coated for durability, flexibility, and longevity support
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4U 4GPU High Performance Edge Server With Dual AMD EPYC 9004/9005 Processors
SKY-641E3
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Support all AMD EPYC 9004/9005 family CPU up to 400W TDP24x DDR5 5600Mhz RDIMMSupport PCIe Switch Backplane, Up to 10 FHFL x16, 4 FHHL x8 PCIe Gen48 2.5" NVMe and 2 M.2 2280 NVMe SSD support1 OCP 3.0 PCIe Gen5 x16 NIC support
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Product
Full Wafer Contact Test System
Fox 1
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Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Product
Rugged IP67-rated Fanless Edge System With NVIDIA® Jetson™ TX2, HDMI, GbE LAN, 1-CH PoE, USB 2.0 And 100 To 240 VAC Power Input
eBOX800-900-FL
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The Artificial Intelligence (AI) embedded system, eBOX800-900-FL, adopts a full IP67-rated extruded aluminum and heavy-duty steel case for dust protection and water resistance. Moreover, the AI embedded system comes with a wide operating temperature range of -30°C to 60°C (-22°F to +140°F) and a vibration endurance for up to 3Grms. The embedded system is powered by the NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor and 256-core NVIDIA® Pascal GPU. It features M12 type I/O connectors and four N-jack waterproof antenna openings for operational stability in rugged environments. The eBOX800-900-FL is ideal for AI edge computing and deep learning applications, such as smart city, smart manufacturing, smart transportation, and much more. The eBOX800-900-FL has 8GB of LPDDR4 memory and 32GB eMMC onboard. It comes with a wide range of 100 to 240 VAC power input with 10kV surge protection. The rugged edge computer also features one M.2 SSD PCIe 2.0 x4 socket which supports high-performance NVM Express interface for extensive storage needs. Furthermore, the embedded box PC is equipped with a PoE port to support the applications that require the use of IP cameras or any PoE device, i.e., traffic flow monitoring, license plate recognition, vehicle recognition, machine vision.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
GC100, Edge AI, NVIDIA® Jetson Xavier™ NX, Wi-Fi & WWAN, PCIe® Optical Cabling
EKF-GC100
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The GC100 Single-Board-Computer is intended for AI and real-time edge computing. Equipped with the Nvidia® Jetson Xavier™ NX SoM, the board was designed for rugged industrial applications such as IIoT or image processing
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Fanless Edge AI System With NVIDIA® JETSON™ Xavier NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL-NX
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*NVIDIA® Jetson™ Xavier NX with Volta™ architecture with 384 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +50°C*JetPack supported
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NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge with IP67
NEON-2000-JT2-X Series
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ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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Product
Edge AI & Intelligence Solutions
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Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers, and IoT gateways to accelerate AIoT development.
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Product
Fanless Edge AI PC
EPC-R7300
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An industrial Fanless Edge AI PC for the NVIDIA® Jetson Orin™ NX and Jetson Orin™ Nano systems-on-modules delivers 20–100 TOPS of AI performance.
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Product
Fanless Network Appliance For SD-WAN& UCPE Edge Deployment With Coming 5G & Wi-Fi 6 Support. Ideal For SD-WAN Deployments.
FWA-1112VCL
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Intel® Atom® C3000, up to 8 CoresIP40, fanless design, 0 ~ 40°C temperature rangeUp to 4 x 1GbE RJ-45 + 2 x 10GbE SFP slots or 1 x 1GbE SFP and 6 x RJ-45 slots5G LTE and Wi-Fi 6 RF certifiedIntel® QAT integrated2 x PoE+ support (optional)
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NVIDIA® Jetson Xavier™ NX Edge AI Vision Inference System
EOS-JNX Series
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The EOS-JNX series has a built-in Smart PoE feature to control PoE power remotely to reduce maintenance efforts in challenging environments and provides PoE power loss detection to alert of any unexpected PoE disconnection. The EOS-JNX-I is designed as an AI PoE switch for connecting to IP cameras to enable AI inferencing, and also provides an uplink port to connect to a network video recorder (NVR) for recording video streams, making upgrading existing surveillance systems easy. The EOS-JNX-G is designed for industrial AI machine vision applications, providing a dedicated bandwidth of 1Gb per channel with a GigE camera connection, which is crucial for production line and manufacturing applications.
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Product
Edge Intelligence Server
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Edge Intelligence Server(EIS) accelerates IoT implementation by providing integrated solutions and software modules that enable IoT connectivity, data manageability and analytics from edge computing to cloud.
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Product
Edge Radius Measurement
EDGEINSPECT
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NOVACAMTM EDGEINSPECTTM system is a modular, non-contact 3D metrology system that:Measures, down to the micron, any type of edge: cutting edges, inside or outside edges, edges on round holes, straight edges, etc.
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Pocket-Size Edge IoT Gateway With Intel® Atom™ E3815/E3825
UNO-2271G
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Intel® Atom™ E3815/E3825 processor with 4GB DDR3L onboard memory2 x GbE, 1 x USB 3.0, 1 x HDMI, Option 2 x RS-232/422/485 or 3 x USB2.0Compact Fanless Design and Rubber Stopper Design with internal reserved screws for 2nd layer assemblyDiverse system I/O and Isolated Digital I/O by iDoor TechnologySupports Fieldbus Protocol by iDoor Technology3G/GPS/GPRS/Wi-Fi communication by iDoor technologySupports 30+ iDoor combination with four main categories of smart factory applications32GB eMMC storage onboardRED Compliance for LTE solution
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Product
Wafer Cathodoluminescence Microscope
Säntis 300
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Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Signage & Edge Computers
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Compact, powerful computers and servers support diverse smart city applications at edge points.
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Product
Compact 1U Edge Server
SKY-8132S
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Compact 1U edge server with a 3rd Gen Intel® Xeon® CPU and 20.4" depth. A versatile platform for 5G Open RAN, MEC, and AI inference at the edge.
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Intel® Processor N97 IoT Edge Computer With 4x LAN, 6x COM, 4x USB, 1x HDMI, And 1x VGA.
UNO-247 V2
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Intel® Processor N97Flexible iDoor expansion design with sufficient IO port4 x GbE, 2 x USB3.2, 2 x USB2.0, 2 x RS232/422/485, 4 x RS485, 1 x HDMI, 1 x VGA, 2 x GPIOCompact size with fanless designOptional 4G/GPS/GPRS/Wi-Fi communicationTerminal block for wiring capabilityOptimized mechanical design for easier RAM swappingSupport Win11 IoT and Ubuntu 22.04
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Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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NVIDIA® Jetson™ TX2 Edge Inference Platform
DLAP-201-JT2
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- Deep learning acceleration with NVIDIA® Jetson™ TX2- Compact fanless system 148(W)x105(D)x50(H)mm- Wide temperature range from -20°C to 70°C
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Edge AI Compact Box PC With Intel® Core™ Ultra Processor (Series 3)
UNO-258
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Intel® Core™ Ultra series 3 processors (code name: Panther Lake H) with 25W and 45W TDP supportIntegrated AI acceleration providing up to 180 TOPS total AI performance (120 GPU + 50 NPU + 10 CPU)Xe3 GPU architecture providing up to 2× the graphics performance compared to Arrow Lake-HDual-channel DDR5 SO-DIMM memory supporting up to 128GB (64GB per channel)M.2 E-Key, B-Key, M-Key (supports NVMe) expansion for storage, LTE/5G, and Wi-FiBuilt-in 1000Mbps & 2500Mbps LAN ports with TCC and TSN supportModular I/O board design offering dual LAN or isolated DIO/CANBUS/COM
