Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Edge Gateway
EPC-R3710
EPC-R3710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI/LVDS/eDP and rich IO as dual GbE/2serials/3USB/12GPIO. EPC-R4710 also features Mini-PCIe slot for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for HMI, IoT gateway, healthcare application.
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Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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Manual Contactless Wafer Detector
HS-NCS-300
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Universal Edge Finder
BORDO
No matter what surface condition may be given, our easy to use BORDO detects various edges in incident light and measures their position. The results of the measurement are transmitted with 1/10 mm resolution via a digital or serial interface to a PC or a PLC which now can place the object into the desired position. This makes BORDO being the perfect tool in many lay-down processes such as the alignment of tiles or other pressed goods. Other applications are checks of alignment. BORDO succeeds even under hard onditions e.g. with missing background, if a thickness of at least 5 mm is given. With its lasercross BORDO is fast and simple adjusted. Another ighlight are the selfregulating algorithms , which optimize parameters of easurement while processing.
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Wafer Level Test Handler
Kronos
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Ultra-Compact, Fanless, Low-Power Edge Computing Platform Powered By Intel® Processor N Series Or Atom® Processor X Series
MXE-230 Series
The MXE-230 Series computers, powered by the Intel® Processor N Series or Atom® Processor X Series, deliver low power consumption at just 12W. With an ultra-compact size of 165 x 120 x 62 mm (1.2L), they are ideal for space-constrained environments. The system supports up to 16GB DDR5 4800MHz memory, operates in temperatures from -20°C to 60°C, and offers two independent 4K 60fps display outputs. It also includes multiple I/O expansion options, such as M.2 and adaptive function modules, along with built-in TPM 2.0 for enhanced security.
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Industrial IoT Edge Gateway
Advantech IoT Edge Gateways help bridge data from edge devices to cloud, acting as protocol converters, data collectors, or data loggers.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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GC100, Edge AI, NVIDIA® Jetson Xavier™ NX, Wi-Fi & WWAN, PCIe® Optical Cabling
EKF-GC100
The GC100 Single-Board-Computer is intended for AI and real-time edge computing. Equipped with the Nvidia® Jetson Xavier™ NX SoM, the board was designed for rugged industrial applications such as IIoT or image processing
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Fanless Edge AI System With NVIDIA® JETSON™ Xavier NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL-NX
*NVIDIA® Jetson™ Xavier NX with Volta™ architecture with 384 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +50°C*JetPack supported
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Edge Analytics Applicance
REA-C1000
Grab your audience’s attention and increase their engagement with intelligent video analytics technology. No matter where the speaker is standing, the handwriting extraction feature ensures that any words and diagrams written on a board or screen remain in full view to the audience — via AR (augmented reality). The Chromakey-less CG Overlay feature enables the presenter to deliver impactful supporting content, in real-time without a dedicated studio or specialized content creators.
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NVIDIA® Jetson™ Xavier NX-based Industrial AI Smart Camera for the Edge
NEON-2000-JNX Series
ADLINK NEON-2000 series is the NVIDIA® Jetson™ based industrial AI cameras, which integrates the Jetson Xavier NX or Jetson™ TX2, Image Sensor, Optimized OS, Rich I/O for vision applications in a compact chassis and verified thermal performance, that saves not only users' TCO (Total Cost Ownership) on the integration and trouble shooting, but also the dimension and cables on the installation.
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Fanless Scalable Railway Edge AI Platform
AVA-7200
- EN 50155:2021 certified Edge AI platform.- NVIDIA Ampere GPGPU (A2000/A4500) and Intel® 13th Gen Raptor Lake mobile processor.- Isolated DC 24-110V (200W) or 72-110V (300W) input, configurable by BOM.- Operates at -25°C to 55°C (OT1, ST1) or -25°C to 70°C (OT3, ST1).- 8x 10GbE/2.5GbE M12 X-coded Ethernet, 5x USB, 4x SATA, 4x DI/DO, 2x Serial ports, audio, and DP.- Internal expansion for 1x NVME M.2 slot, 1x 5G M.2 slot with 2x SIM slots, 1x Wifi/BT M.2 slot, 1x mPCIe, accessible by lid opening- QMA antenna on the rear side- Fanless rugged design, conformal-coated for durability, flexibility, and longevity support
