Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Wafer Thickness Measurement System
MPT1000
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Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Wafer Thickness, TTV, Bow and Warpage
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ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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BT Imagine New wafer Thickness System
IS-T1
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Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Wide Measurement Range Model Of Semi-automatic 4 Point Probe Sheet Resistance/resistivity Measurement
RT-3000/RG-2000 (RG-3000)
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*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
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Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Contactless One-Point Wafer Thickness Gauge
MX 30x
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The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Product
Backgrinding & Stress Relief
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Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Wafer Chucks
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American Probe & Technologies, Inc.
A precision testing fixture used in the semiconductor industry to hold, position, and thermally regulate silicon wafers during testing on analytical probers and autoprobers.
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Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Wafer Test
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Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Thickness Gauges
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Our digital thickness gauges offer a range of features for advanced performance. Explore different options to suit your application needs, from simple handheld gauges to advanced models. All Olympus ultrasonic thickness gauges can measure thickness from one side of a part.
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Thickness Meter
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Shenzhen Graigar Technology Co.,Ltd.
An ultrasonic thickness gauge is a measuring instrument for the non-destructive investigation of a material's thickness using ultrasonic waves.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Thickness Gauges
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Bristol Instruments'' optical thickness gauges are a simple and non-destructive way to precisely measure thickness of a variety of transparent and semi-transparent materials. Thickness information is critical in the development and production of materials such as contact and intraocular lenses, and medical products including balloon catheters, stents, bags, and tubing. Bristol combines high accuracy with straightforward operation and rugged design to make these instruments ideal for both laboratory and manufacturing environments.
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Thickness Gauges
CMX
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The CMX has all features of the MX & MMX gauges with a ton of advanced features. Measure material and coating thickness simultaneously, while still detecting pits & flaws in a single mode (PECT). Auto probe zero, auto probe recognition, auto temperature compensation are also included. Selectable Large Digits and B-Scan display options, up to 64 custom user definable setups, selectable transducer table for precision linearity, and material and coating calibration options are also available.
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Steel Thickness Meter
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We are actively engaged in offering a wide gamut of high performing Steel Thickness Meter that is used to measure the thickness of any object. Offered thickness meter is manufactured by the skilled professionals using well tested steel and most recent technology with set worldwide principles. Offered thickness meter can be customized as per a variety of specifications of our esteemed clients.
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Metal Thickness Tester
Multigauge 5500 Waist
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Mounts onto a belt or chest harness for hands free use. Bright LED display. Top display for convenient viewing.
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Thickness Gauge
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Hildebrand Prüf- und Meßtechnik GmbH
You can select a Thickness Gauge based on a specific standard, a specifiy material or foot diameter and weight/pressure.
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Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Thickness and Flaw Inspection
OmniScan SX
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Olympus is proud to introduce the OmniScan® SX, a flaw detector that benefits from more than 20 years of phased array experience and shares the OmniScan DNA. For improved ease of use, the OmniScan SX features a new streamlined software interface displayed on an 8.4 in. (21.3 cm) touch screen. A single-group and non-modular instrument, the OmniScan SX is easy to operate and cost-effective for less demanding applications.
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Thickness Gauges
UMX-2
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UMX-2 underwater material and coating thickness gauge, designed for offshore inspections, and rated to a depth of 1000 feet (300 meters). The UMX-2 is very versatile, offering both Dual & Single element transducers. Equipped with multiple measurement mode options, the UMX-2 will meet all your application requirements. Onboard 5,000 point data logger, all UMX-2 settings stored for each measurement, along with an actual A-Scan waveform.
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Single Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Coating Thickness Measurement
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The Calotest instruments from Anton Paar provide quick, simple and inexpensive determination of coating thicknesses. Employing the simple ball-cratering method, the thickness of any kind of single or multi-layered coating stack is accurately checked in a short time, in full compliance with relevant international standards.
