Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Layer Thickness Meter
CHY 113
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It is usded to measure the thickness of metallic coatings (eg paint) only on substrates with ferromagnetic alloys (eg steel). The meter is designed to provide easy operation in one hand.
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Product
System to Handle Wafer Levels
AMI AW Series
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Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Product
Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Product
Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Product
WDXRF Wafer Analyzer
2830 ZT
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The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
SENSOR FOR THICK & CURVED MATERIALS
S3
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The smallest, simplest, most affordable high-precision non-contact sheet resistance sensor availableNon-contact measurement of Ohms/sq, Ohms-cm, resistivity, thickness, and moreChoose a sensor in one of four ranges, from .005 Ohms/sq to 100,000 Ohms/sqadd other sensors laterReads any conductive coatingon even the thickest nonconductive substratesOptions include PC-based productivity software, stage, and morePerformance limited by "lift off" phenomenonelevation of sensor above conductive layer must be carefully controlled
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
Photonics Wafer Probing Test System
58635
Test System
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Surface Thickness Gauges
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The Cygnus range of ultrasonic surface thickness gauges are non-destructive testing (NDT) instruments that enable an accurate metal thickness measurement to be obtained from one side only, without the removal of protective coatings or damage to test materials.
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Product
Ultrasonic Thickness Gauge
72DL PLUS
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The Olympus 72DL PLUS™ ultrasonic thickness gauge delivers precision thickness measurements at high speed in a portable, easy-to-use device. With fast scanning, advanced algorithms, and our lowest-ever minimum thickness capability, you can confidently measure the thickness of very thin layers in the most challenging applications.
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Product
COATING THICKNESS GAGES
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Coating thickness or dry film thickness (DFT) is an important variable that plays a role in product quality, process control, and cost control. Measurement of film thickness can be accomplished by selecting the best mil gage for the particular application.
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Product
Metal Thickness Measurement
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Micro-Epsilon offers innovative measurement and inspection systems for the metals industry. Latest technologies are used for thickness, profile and surface measurements. Performance and quality, as well as reliability of products and services have made Micro-Epsilon one of the leading suppliers of inspection systems for optical thickness measurement used in the metals industry. Numerous, successful installations in 13 countries around the world in milling lines and processing lines speak for themselves.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
UPG-07 Ultrasonic Precision Thickness Gages - Color
UPG-07
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100K thickness datalogger with export to Excel 8 0z. Operates on 2 AA batteries Measures all engineering material Store and Recall setup for use with multiple materials All software options are field-upgradeable Vibrate and color change on alarm Illuminate the keypad on alarm condition Inform the operator when to replace the transducer Simple user-interface
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Product
Ultrasonic Material and Coating Thickness Gauge
CMX Series
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Ultrasonic Material and Coating Thickness Gauge - CMX Series is a full function ultrasonic thickness and coating gauge with a widest variety of modes and features for extra versatility.
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Product
Epi Thickness & Composition System
Element
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The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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Product
Coating Thickness Gauges
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Coating thickness gauges are used to test the dry film thickness of most metals, plus concrete, fibreglass, glass, and plastic. The gauges can measure coatings on ferrous substrates, such as steel, and non-ferrous substrates, such as stainless steel and aluminium and non-metals such as concrete, fibreglass, glass, plastic, gyprock and timber.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Thickness Gauges
CMX DL+
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The CMX DL+ has all the features of the CMX DL, plus a full featured A-Scan presentation with RF and Rectified viewing options. The CMX DL+ is equipped with 3 fully adjustable gates (start, stop, width, & Threshold). Equipped with a 20dB boost/cut attenuator, which offers added flexibility for transducer types and applications. Selectable 50 volt pulser boost or cut (100 200 volts). Truly the Cadillac of the CMX series.
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Product
Wafer Level Test Handler
Kronos
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Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Product
Thickness and Flaw Inspection
OmniScan MX2
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The result of over 10 years of proven leadership in modular NDT test platforms, the OmniScan MX has been the most successful portable and modular phased array test instrument produced by Olympus to date, with thousands of units in use throughout the world.
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Product
Thickness Gauge
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Hildebrand Prüf- und Meßtechnik GmbH
You can select a Thickness Gauge based on a specific standard, a specifiy material or foot diameter and weight/pressure.
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Product
Coating Thickness Gauge for Ferrous and Non-Ferrous Materials
CM8856
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* It meets the standards of both ISO2178 and ISO 2361 as well as DIN, ASTM and BS. It can be used both in the laboratory and in harsh field conditions.* The F probes measure the thickness of non-magnetic materials (e.g. paint,plastic, porcelain enamel, copper, zinc,aluminum , chrome etc.) on magnetic materials (e.g. iron, nickel etc.) . often used to measure the thickness ofgalvanizing layer, lacquer layer, porcelain enamel layer, phosphide layer, copper tile, aluminum tile, somealloy tile, paper etc.The N probes measure the thickness of non - magnetic coatings on non-magnetic metals .It is used on anodizing, varnish, paint, enamel,plastic coatings, powder, etc. appliedto aluminum, brass, non-magnetic stainless steel, etc.* Automatic substrate recognition.* Manual or automatic shut down.* Two measurement mode: Single andContinuous* Wide measuring range and highresolution.* Metric/Imperial conversion.* Digital backlit display gives exactreading with no guessing or errors.* Can communicate with PC computerfor statistics and printing by theoptional cable.* Can store 99 groups of measurements.* Statistics is available.2.SPECIFICATIONSDisplay: 4 digits LCD, backlitRange: 0~1250 μm/0~50mil(other ranges can be specified )Min.radius workpiece: F: Convex 1.5mm/Concave 25mmN: Convex 3mm/ Concave 50mmMin. measuring area: 6mmMin.Sample thickness : 0.3mmResolution: 0.1 μm (0~99.9μm);1 μm (over 100μm)Accuracy: ±1~3%n or 2.5 μm or 0.1mil(Whichever is the greater)Bttery Indicator: Low batter indicator.PC interface: with RS-232C interfacePower supply: 2x1.5 AAA(UM-4) batteryOperating condition: Temp. 0~50℃ .Humidity <95% .Size: 126x65x35 mm; 5.0x2.6x1.6 inchWeight: about 81g(not including batteries)Standard accessories:Carrying case ...................1 pc.Operation manual ............ 1 pc.F probe in built .................1 pc.NF probe in built...............1 pc.Calibration foils ..............1set.Substrate (Iron) ................1 pc.Substrate (Aluminium)......1 pc.Optional accessories: RS-232C cable & software:1.USB adaptor for RS-232C2.Bluetooth interface
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Thickness and Flaw Inspection
NORTEC 600
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Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
