Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Wafer Auto Line Integration
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Ultrasonic Wall Thickness
UTG
The PosiTector UTG measures the wall thickness of materials such as steel, plastic and more using ultrasonic technology. Ideal for measuring the effects of corrosion or erosion on tanks, pipes or any structure where access is limited to one side. Multiple echo (UTG M) Thru-Paint models measure the metal thickness of a painted structure without having to remove the coating.
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ECHO 9 Advanced Corrosion Thickness Gages
ECHO 9
ECHO 9 offers a 3.5” high resolution sunlight readable color display with live A-Scan, echo to echo to ignore coatings, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 9 is available in 4 models including the ECHO 9, ECHO 9DL, ECHO 9W and ECHO 9DLW.
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Compact Coating Thickness Gauges
MP0 Series
The small all-rounders for mobile coating thickness measurement. Leading industrial instrument series for fast and easy coating thickness measurement in corrosion protection and industrial applications.
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Mechanical Coating Thickness Gauge
211
This is one of the most popular mechanical coating thickness gauges in the world.Factory calibrated - with user calibration adjustmentFoils supplied to check calibration on siteIdeal for cold surfaces and underwater useSmall and portable with an accuracy ±5%The “V” grooved base, ideal for pipeline inspectionAvailable in either Metric or Imperial versions, the Elcometer 211 measures coatings up to 6mm (250mils)
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Asphalt Layer Thickness Measurement Devices
ElektroPhysik Dr. Steingroever GmbH & Co. KG
Non-destructive road layer thickness measuring gauge to measure bituminous road layers or other electrically insulating road layers.
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Thick Film Divider
GBR-391
GBR-391 series high-voltage resistive dividers are made in a thick film technology on ceramic substrates (Al2O3 - 96%) with leads for through-hole mounting. Dividers are characterized by very high maximum voltage, and standard voltage division.
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Inline OEM High Resolution Thickness & Resistivity Module for PV / Solar Sorters
MX 152
To allow three thickness scans during belt transport at different wafer sizes, two measuring bars, one from top and one from bottom, hold 3 sensors each.
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Layer Thickness Meter
CHY 113
It is usded to measure the thickness of metallic coatings (eg paint) only on substrates with ferromagnetic alloys (eg steel). The meter is designed to provide easy operation in one hand.
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EMAT Thickness Gauges
The EMAT thickness gauge uses advanced electromagnetic-acoustic technology to measure metal thickness, even in cases where traditional methods like piezo-ultrasonic or laser-optical are not applicable.
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Probe Needles for Wafer Sort and Test Applications
Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Surveyor Thickness Gauge
Multigauge 5650
The Multigauge 5650 Surveyor Thickness Gauge is a simple, robust ultrasonic thickness gauge designed specifically for ship and small craft surveyors, but can also be used in applications where different measurement modes are required. The user has a choice of Multiple Echo, Echo to Echo or Single Echo to cover all requirements. The gauge can be used for metal, GRP or plastic measurement and it automatically switches modes and settings depending on the type of probe fitted. The easy to use keypad on the Surveyor Thickness Gauge allows operator interface whilst the bright LCD display can be used in all light conditions. All probes have Intelligent Probe Recognition (IPR), which automatically adjusts settings in the gauge at the same time as transmitting recognition data the result is a perfectly matched probe and gauge for enhanced performance. Additionally, the Automatic Measurement Verification System (AMVS) used with multiple echo ensures only true measurements are displayed, even on the most heavily corroded metals.
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Thick Film Inspection
785
For thicker coatings such as coal tars, extruded and tape coatings, the Model 785 has a range of infinite voltage settings from 1,000 to 15,000 volts.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Drone Thickness Gauge
Multigauge 6000
The Multigauge 6000 Drone Thickness Gauge has been designed specifically to mount onto a drone or UAV. This new technology has already had many successful installations on various models of drone and this is the first dedicated drone thickness gauge available worldwide.
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Anti-Sulfurated Thick Film Type Resistors, Precision Type
ERJ-U2R/ERJ-U3R/ERJ-U6R Series
Panasonic Industrial Devices Sales Company of America
High Precision And High Resistance To Sulfurization In One Resistor!Panasonic's ERJ-U2R, ERJ-U3R, ERJ-U6R (ERJ-U*R Series) offers high precision and also provides anti-sulfurization characteristics that avoid an open circuit caused by a sulfide disconnection. High resistance to sulfurization is achieved through the use of an anti-sulfurated electrode structure and material in the manufacture of ERJ-U*R Series Resistors. AEC-Q200 Compliance and IEC 60115-8, JIS C 5201-8 and JEITA RC-2134C Reference Standards for the entire ERJ-U*R Series of High Precision, Thick Film Chip Resistors from Panasonic ensures optimal quality and reliability.
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Ultrasonic Thickness Gauge
High-precision ultrasonic thickness gauge, suitable for various materials high-precision measurement needs, can be applied to steel, cast iron, aluminum, copper, zinc, etc.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Hand Held Ultrasonic Thickness Meter
Multigauge 5600
On screen user information such as probe frequency and remaining battery. Colour LCD display. Easy to use keypad and menu system.
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ROV Thickness Gauges & Probe Handlers
ROV Thickness Gauges & Probe HandlersCompleting the Cygnus ROV Mountable thickness gauges, a range of ROV Probe Handlers have been developed to offer an engineered probe handling solution. Each probe handler will work with a thickness gauge of the Cygnus ROV Mountable range listed below.
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Current Sensing Resistors, Thick Film Type
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Carpet Thickness Tester
TF620
TESTEX Testing Equipment Systems Ltd.
Digital Thickness Tester, to determine the thickness of carpets, underlays, nonwovens and geotextiles, this thickness tester is easily adapted to meet different test standards.
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Advanced Ultrasonic Thickness Gage
The 45MG is an advanced ultrasonic thickness gage packed with standard measurement features and software options. This unique instrument is compatible with the complete range of Olympus dual element and single element thickness gage transducers.
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Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Wall Measurement Thickness Gauge Wall Thickness Test Instrument
HS160
Shenzhen Chuangxin Instruments Co., Ltd.
HS160 Wall measurement thickness gauge, wall thickness measuring equipment apply to measure the thickness of all kinds of material, through which the ultrasonic wave can propagate at a constant speed and can get reflection from the back. This instrument can be used for a variety of plate and all kinds of machining parts for accurate measurement. Another important function of this gauge is to monitor all kinds of pipelines and pressure vessels used in the production equipment, monitoring their degree of corroded thinning during the using process. It's widely used in petroleum, chemical industry, metallurgy, shipbuilding, aviation, aerospace and other fields.
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Coating Thickness Meter for Ferrous and Non-Ferrous Materials
CM8826FN
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 鍗?-3%n or 鍗?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45閳?/span>(32閳?/span>-104閳?/span>),閳?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Coating Thickness Gauge
NOVOTEST TP-1M
Portable Coating Thickness Gauge NOVOTEST TP-1M – device for operative non-destructive measuring of coating thickness in compliance with ISO 2808 with high measurement accuracy.Coating thickness gauge is designed to test:thickness of various thick protective coatings on various metals and alloys;thickness of paint and other dielectrics – radioabsorbing, mastic, teflon, plastic, electroplating coatings on steel;thickness of electroplating and paint coatings on non-ferromagnetic alloys and non-ferrous metals;thickness of bitumen and other thick coatings on various metals and alloys;as well as relative humidity, air temperature, surface temperature, dew point temperature and difference between surface and dew point temperatures, estimate the depth of grooves and the surface roughnessElectronic thickness gauge – device which widely used in shipbuilding and automotive industries for measuring of the thickness of paint, in order to test the quality of products, also it used for determining technical condition of the tested objects.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
