Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Non-contact Film Thickness Measurement
ALTO-IRT-7000
ALTO-IRT-7000 (IMPEDANCE RESONANCE TECHNOLOGY ) FILM THICKNESS METROLOGY TOOL UTILIZES NON-CONTACT CAPACITIVE AND EDDY CURRENT TECHNOLOGY TO ANALYZE MICRO SECTORS ON COATED SURFACES THAT ARE 1000 TIMES SMALLER THAN ANY COMPARABLE EDDY CURRENT PRODUCTS. BUT MOST IMPORTANTLY, THIS UNIQUE IRT TECHNOLOGY ALLOWS FOR SOPHISTICATED ANALYSES OF THE CONTINUOUS AND DISCRETE FILMS BELOW 50 ANGSTROMS, DRAMATICALLY IMPROVING THE ACCURACY OF QUALITY CONTROL READINGS.
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Paper Thickness Tester
DRK107A
Shandong Drick Instruments Co., Ltd.
DRK107A Paper Thickness Tester is professionally applied to testing the thickness of paper specimens.
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Distance, Coating and Thickness Meters
PeakTech Prüf- und Messtechnik GmbH
This professional laser distance measuring device with multi-line LCD display, which has a backlight, was specially designed for high-precision distance measurements.
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Wafer Defect observing instrument
HS-WDI
Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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EHC-03 Basic Corrosion Thickness Gages
EHC-03
Danatronics is pleased to welcome our EHC-03 to our corrosion thickness gage family. The EHC-03 is designed to accurately and non-destructively measure metal structures subject to corrosion.
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Thickness and Flaw Inspection
OmniScan MX ECA/ECT
With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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High Voltage Thick Film Chip Resistors
HVTK (HVR)
*Highly reliable multilayer electrode construction*Higher component and equipment reliability*Excellent performance at high voltage*Reduced size of final equipment
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Ultrasonic Thickness Gauge
TI-45 Series
You can instantly measure the thickness of a material simply by positioning a probe. This innovative gauge is widely used and is capable of measuring a variety of materials including iron, stainless steel, glass and ceramics.
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Wall Thickness Measurement Gauges
ElektroPhysik Dr. Steingroever GmbH & Co. KG
Portable wall thickness measuring device for non-destructive measurement of up to 24 mm. Thickness measurement of all non-magnetic materials such as glass, synthetic materials, stainless steel and composites; can also be used for objects with complex geometries.
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Handheld Gauge for Nondestructive Coating Thickness Measurement
PHASCOPE PMP10 DUPLEX
The professional for duplex measuring. The specialist for measuring the thickness of duplex layers from automotive to roof panels.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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EHC-09 Ultrasonic Corrosion Thickness Gage - Color
EHC-09C
Danatronics offers our EHC-09 Color Wave series as the top of the line gages for corrosion applications. The EHC-09 Color Wave offers many standard and practical features including a sunlight readable color display with live A-Scan, echo to echo to ignore coatings, B-Scan, 100K thickness reading datalogger with interface to Microsoft excel. The Color Wave is available in 4 models including the EHC-09C, EHC-09DLC, EHC-09CW and EHC-09DLCW. The vibrate on alarm is a world’s first and is great for loud environments!
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Coating Thickness Gauge for Ferrous and Non-Ferrous Materials
CM8856
* It meets the standards of both ISO2178 and ISO 2361 as well as DIN, ASTM and BS. It can be used both in the laboratory and in harsh field conditions.* The F probes measure the thickness of non-magnetic materials (e.g. paint,plastic, porcelain enamel, copper, zinc,aluminum , chrome etc.) on magnetic materials (e.g. iron, nickel etc.) . often used to measure the thickness ofgalvanizing layer, lacquer layer, porcelain enamel layer, phosphide layer, copper tile, aluminum tile, somealloy tile, paper etc.The N probes measure the thickness of non - magnetic coatings on non-magnetic metals .It is used on anodizing, varnish, paint, enamel,plastic coatings, powder, etc. appliedto aluminum, brass, non-magnetic stainless steel, etc.* Automatic substrate recognition.* Manual or automatic shut down.* Two measurement mode: Single andContinuous* Wide measuring range and highresolution.* Metric/Imperial conversion.* Digital backlit display gives exactreading with no guessing or errors.* Can communicate with PC computerfor statistics and printing by theoptional cable.* Can store 99 groups of measurements.* Statistics is available.2.SPECIFICATIONSDisplay: 4 digits LCD, backlitRange: 0~1250 μm/0~50mil(other ranges can be specified )Min.radius workpiece: F: Convex 1.5mm/Concave 25mmN: Convex 3mm/ Concave 50mmMin. measuring area: 6mmMin.Sample thickness : 0.3mmResolution: 0.1 μm (0~99.9μm);1 μm (over 100μm)Accuracy: ±1~3%n or 2.5 μm or 0.1mil(Whichever is the greater)Bttery Indicator: Low batter indicator.PC interface: with RS-232C interfacePower supply: 2x1.5 AAA(UM-4) batteryOperating condition: Temp. 0~50℃ .Humidity <95% .Size: 126x65x35 mm; 5.0x2.6x1.6 inchWeight: about 81g(not including batteries)Standard accessories:Carrying case ...................1 pc.Operation manual ............ 1 pc.F probe in built .................1 pc.NF probe in built...............1 pc.Calibration foils ..............1set.Substrate (Iron) ................1 pc.Substrate (Aluminium)......1 pc.Optional accessories: RS-232C cable & software:1.USB adaptor for RS-232C2.Bluetooth interface
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Geotextile Thickness Tester (Wet Sieving)
TG040
TESTEX Testing Equipment Systems Ltd.
Geotextile Thinkness Tester, to determine the thickness of geotextile synthetic materials and related products under pressure and in specified time.
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Optics Test Equipment + Flatness, Bow, Warp, Curvature, Glass Thickness
Wedge Angle Scanner For Car Windshields
Optik Elektronik Gerätetechnik GmbH
Scanning of complete car windshields for measurement of wedge angle and thickness distribution, in particular in the HUD area.
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Surveyor Datalogger Thickness Meter
Multigauge 5750
Has a choice of Multiple Echo, Echo to Echo or Single Echo to cover all requirements. Measurements can be stored on the gauge and wirelessly transferred to the PC.
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Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Tooth Thickness Micrometer
Measures the "root tangent length" of gears. Compatible modules differ depending on the model.
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Thickness Gauges
Bristol Instruments'' optical thickness gauges are a simple and non-destructive way to precisely measure thickness of a variety of transparent and semi-transparent materials. Thickness information is critical in the development and production of materials such as contact and intraocular lenses, and medical products including balloon catheters, stents, bags, and tubing. Bristol combines high accuracy with straightforward operation and rugged design to make these instruments ideal for both laboratory and manufacturing environments.
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Flaw Detector & Thickness Gauge
DFX-8
Measurement Gates: Two independent gates (Flaw), and three gates (thickness). Start & width adjustable over full range. Amplitude 5-95%, 1% steps. Positive or negative triggering for each gate with audible and visual alarms
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN 650 3D
Optik Elektronik Gerätetechnik GmbH
High accurate flatness & thickness measuring system for large substrates.
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Coating Thickness Gauge
Paint Thickness Gauge
Qualitest offers extensive range of advanced coating thickness gauges such as new Positector series and much more.
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Portable Wafer Probe Station
PS-5026B
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
