Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Dry Film Thickness
Dry film thickness, coating thickness or paint thickness as it is often known, is probably the most critical measurement in the coatings industry. It provides vital information as to the expected life of the substrate, the product’s fitness for purpose, its appearance and ensures compliance with a host of International Standards. In 1947, Elcometer launched one of the world’s first non-destructive coating thickness gauges, the Elcometer 101 Coating Thickness Gauge. For more than 6 decades, the design and production qualities of this rugged and reliable instrument have been the watchwords for all our products and these philosophies are still held today. Elcometer has a comprehensive range of Dry Film Thickness gauges to meet all of your coating inspection requirements.
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Ultrasonic thickness gauge
The frequency range of sound that can be heard by the human ear is about 20Hz to 20KHz, and sound waves with higher frequencies are called ultrasonic waves. In general ultrasonic flaw detection equipment, 5MHz is often used in the range of 1MHz to 20MHz as standard.
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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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WDXRF Wafer Analyzer
2830 ZT
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Thickness and Flaw Inspection
NORTEC 600
Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Thickness Measurement
Thickness Tester is a high precision mechanical contact method thickness tester, which can be used to thickness measurement of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
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Wafer Test
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Coating Thickness Measurement Gauges
ElektroPhysik Dr. Steingroever GmbH & Co. KG
Handy, universally applicable coating thickness gauge in three versions: Integrated probes, cable probes and interchangeable internal and external probes.
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Underwater Thickness Gauge
Multigauge 4000
The Multigauge 4100 and 4400 ROV Underwater Thickness Gauges mount onto most types ROV. There are two models in the range, the Multigauge 4100 which has a depth rating of 1000m and the Titanium Multigauge 4400 which has a depth rating of 4000m.
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Destructive Coating Thickness Gauges
Designed for measuring on a non-metallic substrate or assessing the thickness of a multi-coat paint, Elcometer offer a range of destructive coating thickness gauges such as the Elcometer 121/4 and Elcometer 141 that are portable and easy to use.
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Wafer Probers
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Paperboard Thickness Tester
DRK107D
Shandong Drick Instruments Co., Ltd.
It is used to test thickness of plane sheet samples, widely used in paper, board and other sheet material industry.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Thick Film Bleeder
GBR-350
GBR-350 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Layer Thickness Gauges
PeakTech Prüf- und Messtechnik GmbH
Coating thickness gauges are used for the non-destructive measurement of coatings such as paint or plastic on metallic surfaces.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Thick Film Heating Elements
GBR-200
GBR-200 series high voltage resistors are made in a thick film technology on ceramic substrates (Al2O3 96%). Those elements are used in high voltage applications requiring high stability and resistance.
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Solar Wafer Transfer Tool
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Thickness Gauges
CMX DL+
The CMX DL+ has all the features of the CMX DL, plus a full featured A-Scan presentation with RF and Rectified viewing options. The CMX DL+ is equipped with 3 fully adjustable gates (start, stop, width, & Threshold). Equipped with a 20dB boost/cut attenuator, which offers added flexibility for transducer types and applications. Selectable 50 volt pulser boost or cut (100 200 volts). Truly the Cadillac of the CMX series.
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Thickness Gauges
Thickness gauges are used for measuring the thickness of a material. Our thickness gauges use a non-destructive testing technique which does not permanently change the material it tests. GAOTek’s thickness gauges are reliable, high quality, and affordable instruments that provide an accurate measurement and offer an efficient and quick means of inspection or testing. They are compact, easy to carry and are designed to work in complex conditions. Our gauges are available for sale to the United States, Canada and globally.
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LED Tester For Chip And Wafer
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Ultrasonic Thickness Gauges
MMX 6 + MMX 6DL
The new wall thickness gauges MMX-6 and MMX-6DL includes all the features of the MX devices with the additional unique possibility to measure on coated parts without the coating is applied in the measurement (Echo Echo + pulse-echo function)
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Thick Film Passive Element
GBR-250
GBR-250 series high voltage resistors are made in a thick film technology on ceramic substrates (Al2O3 96%). These elements are used in high voltage applications.
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Coating Thickness Gauge
Guangzhou Amittari Instruments Co.Ltd
The Basic Type Coating Thickness Gauge AC-110 Series have two types: Type C ( Integral Type ), Type CS ( Separate Type ); Suitable for automotive, paint layer coating thickness measurement; Integral Type suitable for single-hand operation, large probe with large contact surface have better stability, users can get continuous, good repetitive and precise measurements. Separate Type can provide several type probe, measure can be more flexibility. It is a kind of portable measuring instrument, it can quickly, no damage and precise coating, coating thickness measurement. Not only can be usedin the laboratory, also can be used in the engineering field. Through the use of different measuring head, but also can meet the needs of a variety of measurement. Widely used in manufacturing, metal processing industry, chemical industry, commodityinspection and testing field. Is the material protection professional.
