Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Automotive Paint Thickness Meters
Shenzhen Linshang Technology Co., Ltd.
Linshang automotive paint meter, also named paint thickness meter, is a painting thickness gauge used to test car paint thickness. Linshang automotive paint meter can identify the substrate automatically. If you devote to find a cost effective paint thickness meter, you can view the digital coating thickness gauges listed below.
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Paper Thickness Tester
DRK107B
Shandong Drick Instruments Co., Ltd.
DRK107B Paper Thickness Tester is applied to testing the thickness of paper specimens.
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EHC-09 Ultrasonic Corrosion Thickness Gage - Monochrome
EHC-09
Danatronics most popular thickness gages are those in our EHC-09 series. With thousands of units in the field, our durable, custom molded case with raise rubber keypad is IP54 rated and has proven it can handle your toughest jobs (this is bad help fix). The EHC-09 series is available in 6 models to suit every budget and application. What’s best is our simple upgrade path where all gages are capable of quickly and easily (directly from the keypad) adding any software options. Features include a graphic display with multiple languages, vibrate on alarm, fast minimum, echo to echo to ignore coatings, 100K reading Datalogger with export to excel, B-scan and live A-scan with waveform adjust.
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Benchtop Unit for Universal Coating Thickness Measurement
FISCHERSCOPE MMS PC2
Multifaceted for coating thickness measurement and material testing. Universal multi-measuring system for parallel coating thickness measurement and material testing with up to eight measuring modules.
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Inline Thickness Measuring Instrument
TGD
Thickness and profile measuring system for use in production lines.For cold and hot rolled strips and sheets. Measuring procedure free of contact.
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System to Handle Wafer Levels
AMI AW Series
Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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ECHO 7 Ultrasonic Precision Thickness Gage
ECHO 7
ECHO 7 represents our most advanced thickness gage ever. ECHO 7 offers a 3.5” high resolution sunlight readable color display with live A-Scan, use of a wide variety of contact, delay line and immersion probes from 1-20 Mhz as default and custom created and stored applications setups, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 7 is available in 4 models including the ECHO 7, ECHO 7DL, ECHO 7W and ECHO 7DLW.
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Wafer Level Multi-Die Test System
ITC55WLMD
The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Wafer Cathodoluminescence Microscope
Säntis 300
Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Thickness Check Calix
For the manufacturing of a perfect cold strip, many factors are crucial. Our measuring frames specifically check the thickness-related quality parameters of the strip steel or steel sheet. Free of radioactive radiation, laser sensors are used in the cold strip areas that do not require protection measures with laser class 2, or only low precautions when using laser class 3B sensors. The installation of our measurement systems is quick and uncomplicated for our customers. The CALIX is integrated into the line with its C-shaped frame across the material flow. Our solutions with and without traversing determine all important parameters for quality assurance, including strip thickness, edge thickness, wedge or cambering, and measure the complete thickness profile. Thus, you have full process control in the current production.
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ATEX Certified Ultrasonic Thickness Gauge
Cygnus 1 Ex
The Cygnus 1 Intrinsically Safe is a rugged, shock-proof multiple echo ultrasonic surface thickness gauge designed for safely measuring metal thickness to determine wastage or corrosion in potentially explosive environments. By using multiple echo technology the metal thickness gauge measurements are error checked using 3 return echoes to provide repeatable, reliable results.
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Compact Coating Thickness Gauges
MP0 Series
Ultra compact pocket coating thickness gauges for simple, fast and nondestructive coating thickness measurement on virtually all metals or only on steel/iron
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Coating Thickness Gauge
456
The Elcometer 456 dry film thickness gauge is available in four different models. Each thickness gauge provides the user with increasing functionality - from the entry level Elcometer 456 Model E, to the top of the range Elcometer 456 Model T.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Multi-mode Ultrasonic Thickness Gauge
MMX-6DL
The MMX-6DL has all the features of the MMX-6 plus: An Internal data logger that stores a total of 1000 readings in 10 files of 100 readings each file. This gives the user the ability to store, and download the stored measurements directly to a PC using our DakView software program. The software and transfer cable are included in the MMX-6DL kit.
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Coating Thickness Meter for Automobiles - Ferrous and Non-Ferrous Substrates
CM8828FN
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 卤1-3%n or 卤2.5um- Min. measuring area: 6mm - Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45鈩?/span>(32鈩?/span>-104鈩?/span>),鈮?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Industrial Paint & Powder Thickness Gauge
415
Incredibly fast (60+ readings per minute), reducing inspection times, increasing productivitySwitches instantly between ferrous & non-ferrous substrates without interruption1Measures cured paint & powder coatings up to 1000μm (40mils)Zero or smooth (2 point) calibration ensures accuracy on smooth & thin coated substratesEasy to use, ergonomic design provides maximum comfort for continuous useLarge easy to read values in microns or milsAuto rotating large colour display provides clear visibility whatever the angle of measurementScratch, solvent & water resistant display protects against the elementsRugged & resistant to dust or powder coatings equivalent to IP64, ideal for modern industrial & powder coating environmentsTransfer live data via USB or Bluetooth® to ElcoMaster® for instant report generation
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Thickness and Flaw Inspection
OmniScan MX2
The result of over 10 years of proven leadership in modular NDT test platforms, the OmniScan MX has been the most successful portable and modular phased array test instrument produced by Olympus to date, with thousands of units in use throughout the world.
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Substrate Thickness, Warp, and TTV Measurement
413 Series
Substrate Thickness, Warp, and TTV Measurement- with or without Tape- for Wafer Backgrind and Etch Thinning processes.Non-contact Echoprobe Technology.Thin film and surface roughness options.
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Glass Thickness Meters
Shenzhen Linshang Technology Co., Ltd.
As a supplier of laser glass thickness gauge and glass thickness measuring tool, Linshang provides two models of glass thickness gauge that can be used to measure the thickness of various glasses, i.e: single-layer glass, double glazing, triple glazing, multilayer glass, LOW-E glass, and insulating glass, especially suitable for installed glass, such as doors and windows, curtain wall glass, etc.. It can measure the glass thickness as well as the thickness of air space (between the glass). The glass check works on the basis of reflection in the glass.
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Ultrasonic Material and Coating Thickness Gauge
CMX Series
Ultrasonic Material and Coating Thickness Gauge - CMX Series is a full function ultrasonic thickness and coating gauge with a widest variety of modes and features for extra versatility.
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High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Non Rotating Spindle Type Tooth Thickness Micrometer
Measures the "root tangent length" of gears. Compatible modules differ depending on the model.
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ITA, G10, 10 Module, 0.88" Thickness
410104375
ITA, G10, 10 Module, 0.88" ThicknessCompatible with VPC 90-Series modules.
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Passive and Active Resistor Trimming for Thick and Thin Film
LRT 2000L
*Travel: 6" x 6"*Laser : Fiber Laser Ytterbium 1064 nm*Kerf: 30 to 80 micron Adjustable*Pulse width : 80 nano second*Rap Rate: 1 to 1 million Pulse Per Second*Average Power: 20 watts*Target: Electric crosshair on monitor
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Radar solution for thickness measurememt of steel & metal
Our radar sensor solution determines the thickness and the thickness profile of steel plates, steel strips or steel slabs (up to 1600 °C hot) with an accuracy of up to ±10 µm on the roller conveyor. Thanks to robust radar technology, sophisticated signal processing and intelligent radar algorithms, OndoSense radar sensors achieve this high level of precision in thickness measurement even under the difficult production conditions of the steel industry with smoke, steam, dirt, vibrations, fire and extreme temperatures.
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Thickness Gauges
CMX DL
The CMX DL has all the features of the CMX, plus a huge storage capacity, using multiple file structures. Select between to file formats: Sequential, with auto identifiers or, our standard alpha numeric grid format.
