Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Thick Film Passive Element
GBR-181
GBR-181series resistors are made in a thick film technology, or ceramic substrates (Al2O3) - 96&). Thick film resistors are characterized by a higher stability, and lower noises than a typical carbon resistors. The whole of resistor is encapsulated with epoxy resin by fluidization process. GBR-181 series elements are used both for general, and professional applications. Other values of resistance, and tolerance (up to 0.1%) are available on request.
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Ultrasonic Thickness Gauge w/A & B Scan and Thru Coating Capability
UTG-4000
Utilizing color waveform A-scan and time based B-scan for absolute correctness, this new state of the art ultrasonic thickness gauge is packed with useful features allowing users to be confident of the displayed values on the most critical of applications. This multi-functional ultrasonic thickness gauge offers everything from basic measurement, Scan mode with Min/Max viewing, GO/NO GO display, Adjustable Sound Velocity and Thru-Coating Capabilities.
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Ultrasonic Thickness Gauge
27MG
The Olympus 27MG is an affordable ultrasonic thickness gauge designed to make accurate, measurements from one side on internally corroded or eroded metal pipes, tanks, and other equipment. It weighs only 12 oz. (340 g) and is ergonomically designed for easy, one-hand operation. Despite its compact size, the 27MG has many innovative measurement features utilizing the same technologies that are available on our more advanced thickness gauges.
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Batch Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Thickness Measurement Testing
DRK3011B
Shandong Drick Instruments Co., Ltd.
It is used for the durability test of children's mattress surface rolling and the test of the height of the cushion surface.
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Hall Effect Thickness Gage
Magna-Mike 8600
The Magna-Mike® 8600 is a portable thickness gage that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Coating & Material Thickness Gauges
GAOTek’s coating thickness gauges are designed for measuring the thickness of a material and are for sale to the United States, Canada and globally. Our products utilize non-destructive testing techniques that do not permanently affect the material they are testing. They are reliable, high quality, and affordable pieces of equipment that can provide an accurate measurement and offering an efficient and quick means of inspection or testing. Our products emphasize compactness and portability to allow the user to work in complex conditions.
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Ultrasonic Thickness Gauge
UTG-2800
State of the art, digital ultrasonic thickness gauge is packed with features typically found on high end models only. This multi-functional ultrasonic thickness gauge offers everything from basic measurement, Scanning Capabilities, Adjustable Sound Velocity, extended memory and USB output capabilities.
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Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8829
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 閸?-3%n or 閸?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45闁?/span>(32闁?/span>-104闁?/span>),闁?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Stand Alone Wafer Sorter
MicroSORT
The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Thick Film Passive Element
GBR-182
GBR-182 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). Thick film resistors are characterized by a higher stability, and lower noises than a typical carbon resistors. The whole of resistor is encapsulated with epoxy resin by fluidization process. GBR-182 series elements are used both for general, and professional applications.
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Thickness Gauges
UMX
Take your MX-3 underwater with you! This portable solutionoffers off-shore inspectors a very versatile system for underwater corrosion surveys:Clear plexiglass construction.300 feet depth rating.Stainless steel connectors, latches, and control bar.Simple to install and operate.1 year limited warranty.
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Electrostatic Capacitance-Type Non-Contact Thickness Meter
CL-5610 series
The CL-5610/5610S is used to perform non-contact thickness measurement of objects under measurement including conductors, semiconductors and insulators in combination with the new-developed VE series capacitance type gap detector. The CL-5610/5610S can be connected up to 2 gap detectors and also used as 2-ch displacement meter.
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Industrial Protective Coating Thickness Gauge
456 IPC
The Elcometer 456 Industrial Protective Coating Thickness Gauge1 is designed to measure dry film thickness on shot or grit blasted steel substrates.
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Precision Thick Film Chip Resistors
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Full Wafer Contact Test System
Fox 1
Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Wafer Mapping Sensor
M-DW1
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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COATING THICKNESS GAGES
Coating thickness or dry film thickness (DFT) is an important variable that plays a role in product quality, process control, and cost control. Measurement of film thickness can be accomplished by selecting the best mil gage for the particular application.
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Leather Thickness Gauge
UI-FT43
Leather Thickness Gauge is used to measure the thickness of leather. Place the sample in a thickness meter under a specified load for a certain time and them read the thickness. Unuo Instruments supply film thickness gauge, film thickness gauge, rubber thickness gauge and etc. Shore Durometer for rubber is also available.
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Non Contact Thickness Measurement Systems
Non contact thickness measurement is becoming more complicated with each passing year.From medical devices to food packaging, we understand the needs from an array of industries to successfully design non contact thickness measurement systems to meet your needs:
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
