Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
-
Product
Wafer Edge Profile Measurement
WATOM
-
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
-
Product
WATOM
-
Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
-
Product
Ultra Slim Digital Signage
DS-015
-
Power by Nvidia 6-core & 8-core Arm® Cortex-A78AE v8.2 64-bit. Multiple AI workloads up to 157 TOPS (INT8) Ultra-slim design with intelligent fan cooling. Connectivity: 3 × USB 3.2 Gen 1 ports, 1 × USB Type-C (for download mode only) Display & Camera Support: HDMI 4K@60 output and GMSL camera interfaces.
-
Product
Edge AI Inference System
AIR-021
-
Edge AI Inference system powered by NVIDIA® Jetson Orin™ NX/Nano and Super mode. Compact and high performance AI box. NVIDIA® Jetson Orin NX 16GB/8GB and Orin Nano 8GB Modules. 12~24V wide power and -20~50 °C (NX) -10~50°C (NANO) supported.
-
Product
AI Inference System Based On NVIDIA Nova Orin For AMR Applications
MIC-732-AO
-
Fanless and ultra-compact design. Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS. Supports 1 x 10GbE, 1 x 2.5GbE, 3 x USB 3.2 Gen 2 (10 Gbit/s). Supports 2 x CANbus, 1 x mPCIe, 2 x Nano SIM slots. Support Total 8-ch GMSL3.0/2.0 with FAKRA connectors.
-
Product
High-Performance All-In-One Gateway For Battery Energy Storage Systems
ECU-1170
-
Quad-core Cortex-A55 processor, 1.8GHzConnectivity: 4 GbE, 8 RS-232/485, 2 CAN, 1 mPCle and 1 M.2I/O: 20 DI, 6 DO, 8 Relay, 2 AIBattery-powered RTC, Watchdog, and optional TPM supportWide operating temperature range: -40~70°COptional 5 sec power backup with SupercapacitorSupports IEC 61850, IEC 104, DNP3, Modbus, MQTT, and OPC UAPreloaded with Yocto Linux and EdgeLink or Ubuntu Linux
-
Product
Edge AI Inference Systems
-
Powered by NVIDIA Jetson family and RTX, AIR series provides scalable AI inference performance or efficient retraining on a large scale at the edge.
-
Product
Edge AI HPC System
AIR-500D
-
Edge AI HPC system powered by Intel® Xeon® D-1700 Series processors with support for up to 4 PCIe slots. Intel® Xeon® D-1700 series processor 4x DDR4 SO-DIMM sockets support ECC/nonECC memory up to 128GB.
-
Product
Edge Gateway
EPC-R4760
-
EPC-R4760 is an ARM based Box Computer powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GPS. EPC-R4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Win10 IoT core BSPs, this box computer enables customers to easily develop unique application on specific OS.
-
Product
Edge AI Inference System
AIR-075
-
Edge AI Inference system powered by NVIDIA® Jetson Thor™ Powered by NVIDIA Jetson T5000™ and Jetson T4000™, delivering up to 2070 TFLOPS FP4 inference performance. 19~36V wide power and -10~40 °C wide temp. supported.
-
Product
Edge Gateway
EPC-R3710
-
EPC-R3710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI/LVDS/eDP and rich IO as dual GbE/2serials/3USB/12GPIO. EPC-R4710 also features Mini-PCIe slot for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for HMI, IoT gateway, healthcare application.
-
Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
-
Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
-
Product
Edge Gateway
EPC-R4680
-
EPC-R4680 is an ARM based Box Computer powered by Rockchip ARM Cortex-A17 RK3288 Quad core high performance processor, which supports 4K display and 4Kx2K multiformat video decoding via HDMI. It also features M.2, Mini-PCIe and SIM card slots for WIFI, BT and 4G connectivity. EPC-R4680 also offers rich interfaces such as 6 USB2.0, 6 UART, 1 GbE and 8 GPIO. It is an ideal solution for Kiosk, Vending machine and Digital signage application.
-
Product
Edge AI Inference System
AIR-120
-
Edge AI inference system powered by Intel® Atom® processor with Hailo-8 AI acceleration module.
-
Product
Edge Gateway
EPC-R4710
-
EPC-R4710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI and rich IO as dual GbE/6serials/6USB/5GPIO. EPC-R4710 also features Mini-PCIe, M.2, and SIM card slots for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for Kiosk, POS, and Vending machine application.
-
Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
-
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
-
Product
Edge Gateway
EPC-R3220
-
EPC-R3220 is a RISC-based box computer integrated with the TI Sitara AM3352 Cortex-A8 0.8GHz processor. It is designed for applications that require multiple connectivity points and low power consumption. The EPC-R3220 offers dual RS-232/485 serial ports with Modbus/OPC-UA protocol support for date collection, 6GPIOs for indication or device control, dual 10/100/1000 Ethernet ports, one wifi/BT onboard solution and one Mini-PCIE that can expand to an LTE solution. EPC-R3220 supports wide-ranging power input and temperature and supports both DIN-rail and wall mounting.
-
Product
Edge Card Adapter, Universal, for .062 PCB
111107138
-
VPC provides two types of Edge Card Adapter Kits for 10, 25 and 50 Module ITA Enclosures. Both kits are designed for various sized cards.The Universal Edge Card Adapter Kit’s card guides are hinged and can be folded for storage by releasing the holding latches on either side of the card.
-
Product
Wafer Chucks
-
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
-
Product
Wafer Tester
-
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
-
Product
Wafer Prober
Precio XL
-
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
-
Product
Wafer Inspection System
-
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
-
Product
Wafer Test
-
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
-
Product
Wafer Cathodoluminescence Microscope
Säntis 300
-
Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
-
Product
Wafer Probe Heads
-
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
-
Product
Edge Gateway
EPC-R6410
-
EPC-R6410 is the RISC based box computer which integrated NXP i.MX6D/Q Cortex-A9 1.0GHz high performance processor. It is designed for the applications that require high performance and rich I/O but low power consumption. It supports dual display via HDMI and VGA up to 1080p, 1 Gigabit Ethernet, 6 USB 2.0 and 4 serials, as well as mini-PCIE for 4G/3G and M.2 for WiFi/BT. With wall mount brackets, fanless and dust-proof design, you can easy install in rugged environment.
-
Product
Wafer Test
-
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.





























