Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
-
Product
Bonding
-
With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
-
Product
Temporary Bonding Systems
-
Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
-
Product
Minority Carrier Life Time System
MWR-SIM
-
MWR-SIM Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as probe.It enables repetition and contactless of measurement and does not require specialsurface treatment before measurement or wafer cutting.
-
Product
Resistivity Standard
-
Resistivity Standards are bare silicon wafers available in 3 in, 8 in and 12 in sizes. The silicon is p-type (Boron) doped to nominal resistivity values, from 0.002 ohm.cm to 75 ohm.cm as available on the 3" model.
-
Product
Integrated Couplers/ Harmonic Mixers
-
These waveguide bandwidth integrated coupler/mixers are designed to allow phase locking or signal monitoring of compact millimeter wave systems. RF inputs and outputs are on opposite sides of a thin wafer to obtain minimum insertion length. These devices use silicon Schottky barrier beam-lead diodes on a rugged stripline circuit. Nominal coupling value is 10 dB. For coupling values greater than 10 dB, non-directional coupler models are available (consult factory).
-
Product
Permanent Bonding Systems
-
The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
-
Product
Super Silicon Resistivity and Type Tester
HS-3FC II
-
Super Silicon Resistivity and Type Tester is specially designed for silicon sorting，it can quickly test the silicon type, heavy-doped, resistivity and current, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. Furthermore, it integrates two probes, three probes and four probes. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
-
Product
EasyEXPERT Group+ Software (for B150x Mainframe)
-
Keysight EasyEXPERT group+ GUI based characterization software is available for Keysight Precision Current-Voltage Analyzer Series. It is available on your PC or the B150xA's embedded Windows 7 platform with 15-inch touch screen to accelerate the characterization tasks. It supports efficient and repeatable device characterization in the entire characterization process from measurement setup and execution to analysis and data management either interactive manual operation or automation across a wafer in conjunction with a semiautomatic wafer prober. EasyEXPERT group+ makes it easy to perform complex device characterization immediately with the ready-to-use measurements (application tests) furnished, and allows you the option of storing test condition and measurement data automatically after each measurement in a unique built-in database (workspace), ensuring that valuable information is not lost and that measurements can be repeated at a later date. Keysight Precision Current-Voltage Analyzer Series provides the complete solution for device characterization with these versatile capabilities.
-
Product
High Voltage 50 Ω Pulse Generator
TLP-4010C
-
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±10 kV*High pulse output current up to ±40 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
-
Product
Test House Services
-
Microtest provides complete test house services in a clear room equipped with the state of the art handler and wafer probing system using its own innovative ATE.The test house operates in hot, cold and room temperature for both production and characterization test.Innovative reliability system for Burn In and HTOL ServicesStatistical analysis is performed for digital and mixed-signal devices.Microtest Pacific Test house is located in Malacca (Malaysia).
-
Product
Manual Semiconductor Metrology System
-
Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
-
Product
High Voltage 50 Ω Pulse Generator
TLP-8010A
-
High Power Pulse Instruments GmbH
*Wafer and package level TLP/HMM testing*Fast 50 Ω high voltage pulse output with typical 300 ps rise time*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω-configuration*High pulse output current up to ±80 A (short circuit) with 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 300 ps to 50 ns*1 built-in pulse width: 100 ns*Optional external pulse width extensions 5/10/50/100/200/500 ns using an external pulse width extender TLP-8012A5*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
-
Product
Multi-Wafer Test & Burn-in System
FOX-XP
-
The key features of the new FOX-XP test cell that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 "Universal Channels" per wafer, which allows the system to test all the devices on the wafer in parallel. The new "Universal Channel" architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing.
-
Product
microLED Testing System
OmniPix-ML1000
-
The OmniPix-ML1000 is the first all-encompassing microLED testing system, offering both full wafer and localized individual pixel inspection. Measure localized and total EQE. Use automated PL and EL to test and characterize your microLEDs. Analyze defective pixels with nano-PL and nano-EL.
-
Product
Ultrasonic Wafer Scanner
AutoWafer
-
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
-
Product
Photonics Test Solutions
-
Chroma offers precision instruments such as laser drivers, photodetector monitoring, and temperature controllers. These lab class instruments are often intefrated into production solutions for wafer probe test, burn-in and device or module characterization with inspection, metrology, robotics, Industry 4.0 and more.
-
Product
Inline OEM High Resolution Thickness & Resistivity Module for PV / Solar Sorters
MX 152
-
To allow three thickness scans during belt transport at different wafer sizes, two measuring bars, one from top and one from bottom, hold 3 sensors each.
-
Product
Laser Type Edge Detection Sensor
LD
-
Panasonic Industrial Devices Sales Company of America
The Panasonic LD Series Laser Type Edge Detection Sensor can easily measure the outer diameter of objects. It can also sense inclines, detect the notch of a wafer and judge the height of small objects.
-
Product
Multisite Probe Card
T300 ButtonTile™
-
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
-
Product
Metrology System
IMPULSE V
-
With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
-
Product
Silicon Resistivity, PN type & Alarm Tester
HS-PSRT
-
It use Four Probe to test the resistivity and P/N type of wafers、ingots and all type of silicon materials.It can be used by Solar and Semiconductor industry.
-
Product
CMP Process and Material Characterization System
CP-4
-
he new Bruker CP-4 CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes. Reproduces full-scale wafer polishing-process conditions. Provides unmatched measurement repeatability and detail. Performs tests on small coupons rather than whole wafers for substantial cost savings.
-
Product
Substrate Manufacturing
-
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
-
Product
Edge Grinding Machines
-
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
-
Product
Tabletop Front & Backside Mask Aligner
Model 200IR
-
The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
-
Product
Stand Alone Wafer Sorter
MicroSORT
-
The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
-
Product
Semiconductor
-
Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
-
Product
Pressure Switches
-
Whitman controls offers the most diverse selection of pressure switches in the industry. Our diverse line of switches are used across a wide range of applications including blowers, generator sets, off-road vehicles, compressors, wafer ovens, process equipment, flow control devices, pumps, wastewater, heating and cooling systems, and numerous other applications across industries.
-
Product
Fluorescence Spectrometers
-
PicoQuant offers several fluorescence spectrometers that range from compact table-top spectrometers for teaching or daily routine work to modular high-end spectrometers with exact timing down to a few picoseconds. Samples can be liquids in standard cuvettes, solid samples or even semiconductor wafers for in-line quality control.
-
Product
Wafer Inspection System
-
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
