Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Data Analytics
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KLA’s data analytics systems centralize and analyze the data produced by inspection, metrology and process systems. Using advanced data analysis, modeling and visualization capabilities, our comprehensive suite of data analytics products support applications such as run-time process control, defect excursion identification, wafer and reticle dispositioning, scanner and process corrections, and defect classification. By providing chip and wafer manufacturers with relevant root cause information, our data management and analysis systems accelerate yield learning rates and reduce production risk.
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Product
Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
MPI SiPH Probe Systems
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MPI Advanced Semiconductor Test
MPI designed dedicated SiPH upgrades for its well known 200 and 300 mm probe systems, which includes:*Various options of high-precision fiber alignment systems for ultra-fast scanning routines*Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration*Integrated Z-sensing for detecting the fiber to wafer contact point*Crash protection when using two optical fiber arms*Wide temperature range from -50°C to 200°C*Optional dark box for testing in light tight environment*Extensive software package for supporting easy integration to operator’s test executive*Probe system compatibility: TS2000-IFE, TS2000-SE, TS3000, TS3000-SE, TS3500 and TS3500-SE
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Product
Advanced Low-Frequency Noise Analyzer
E4727B
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Get a deeper, closer look at low frequency noise with the A-LFNA integrated with WaferPro Express, featuring data analysis, wafer prober control and test suite automation.
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Product
Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
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The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Product
Non-contact Sheet Resistance/resistivity Measurement Instrument With PC
NC-10 (NC-20)
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*Easy operation and data processing by PC*No damage measurement by non-contact eddy current method*Replaceable probes by meas. range (*Second or more probe is for the option)*1 point measurement of center position*5 types of model for each measuring range*Temperature correction for silicon wafer function
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
Resistivity Standard
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Resistivity Standards are bare silicon wafers available in 3 in, 8 in and 12 in sizes. The silicon is p-type (Boron) doped to nominal resistivity values, from 0.002 ohm.cm to 75 ohm.cm as available on the 3" model.
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Product
Probe Card Solutions
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Advanced engineering solutions are required to meet increasing challenges for wafer test, driven by today’s rapid technology acceleration. Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.
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Product
E-Chuck Supplies
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Advanced Energy's Trek e-chuck supplies have been a staple in the semiconductor industry for decades. They allow you to improve throughput, virtually eliminate sticky wafer and wafer popping issues, and reduce backside gas errors.
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Product
Portable Manual Probing Station
Model W4.0 x L6.5
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This portable manual probing station is designed for a versatile, comfortable, and accurate operation on up to 4.0” wafers or 4.0” X 6.5” printed circuit board assemblies. This turn-key, manually operated probing station, model W4.0 x L6.5, is part of the D-COAX commitment to the test and measurement and PCB fabrication industries.
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Product
Semiconductor Test Equipment
IC Tester
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Equipment to determine the pass/fail of devices in the wafer inspection process and the final inspection process after packaging.
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Product
Colorimeter
OHSP-660T Series
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Hangzhou Hopoo Optoelectronics Technology Co., Ltd
full-spectrum transmittance measuring instrument (TSM) can measure a very wide range of products, such as: glass lenses, automotive insulation paper, construction insulation paper, glass, lampshades, filters, wafers, LED diffusers, etc...
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Product
Semiconductor Inspection (SEMI)
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A process for detecting any particles or defects in a wafer.
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Product
Dicing And Lapping Systems
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In semiconductor fabrication, clean die separation and smooth surfaces can make all the difference. While these steps might come late in the process, they play a major role in how well a device ultimately performs. Dicing and lapping bring the necessary level of precision to cut wafers into individual dies and polish surfaces so everything fits, functions and holds up the way it should in real world scenarios.
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Product
Wafer ESD Tester lineup
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Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Product
Reflection/Transmission Spectrophotometry
FilmTek 3000 PAR-SE
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Scientific Computing International
Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Product
Multi-Surface Profiler
Tropel® FlatMaster® MSP
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The Tropel® FlatMaster® MSP (Multi-Surface Profiler) is a frequency stepping interferometer that provides fast and accurate metrology for semiconductor wafers up to 300mm in diameter. In seconds up to 3 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface.
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Product
NI STS
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RF Test and Measurement Solutions, LLC
RFTMS is a leader in configuring systems to meet your needs, as well as designing load board, writing SW, and integrating the final solution. We do this for wafer test, packaged parts, and modules. RFTMS can address any level of integration that your parts employ, from a single functional block, i.e., Power Amplifier (PA) to System-on-a-Chip (SOIC). We test all sorts of RFICs.
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Product
300mm Single Touchdown Burn-in and Test System
FOX-15
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Up to 15 wafers at a time Known Good Die solution Lowers production cost
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Product
Test Contactor/Probe HEad
cRacer
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The cRacer™ test contactor and probe head portfolio offer solutions for 5G mmWave FR2 up to 54+ GHz.cRacer utilizes robust spring probe technology for testing singulated packages or probe heads for wafer probe (bumped/pad) applications with fine pitch and WLCSP compatibility – ranging from 100 µm to 650 µm, covering the majority of 5G devices.cRacer features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55°C to +155°C.
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Product
Ceramic Process Carrier Pallets
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Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
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Product
IGBTs
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Renesas insulated-gate bipolar transistors (IGBTs) realize both low saturation voltage and fast switching through thin wafer technology. Product series suitable for a variety of applications are available, and help to cut down all kinds of power loss.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Product
Memory Test System
T5830/T5830ES
Test System
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Product
High Voltage 50 Ω Pulse Generator
TLP-8010A
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High Power Pulse Instruments GmbH
*Wafer and package level TLP/HMM testing*Fast 50 Ω high voltage pulse output with typical 300 ps rise time*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω-configuration*High pulse output current up to ±80 A (short circuit) with 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 300 ps to 50 ns*1 built-in pulse width: 100 ns*Optional external pulse width extensions 5/10/50/100/200/500 ns using an external pulse width extender TLP-8012A5*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
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Product
Silicon Resistivity, PN type & Alarm Tester
HS-PSRT
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It use Four Probe to test the resistivity and P/N type of wafers、ingots and all type of silicon materials.It can be used by Solar and Semiconductor industry.
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