Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
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Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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Product
Probe Card
VC20E Series
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The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Product
Automatic Online Flatness and Surface Appearance System
UltraSort200
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The UltraSort continues our 25 year tradition of providing metrology solutions to semiconductor wafer manufacturers. Designed for volume wafer production, this automated system offers superior performance in rapid, repeatable, accurate, noncontact qualification of silicon and alternative substrate wafers.
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Product
Probe Card
T90™ Series
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The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
kSA Scanning Pyro
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For use on Veeco K465i and EPIK700 MOCVD reactors, the kSA Scanning Pyro performs automated temperature mapping in order to measure temperature variations across wafer carriers and wafers. Use it to tune heater zones and optimize process and hardware to achieve higher yields, wafer uniformity and device performance.
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Product
System to Handle Wafer Levels
AMI AW Series
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Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
Thermal Controlled Chucks & Plates
TOP Cool
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Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Product
Semiconductor
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Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Product
Quick Silicon Discriminator
HS-QSD
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HS-QSD Quick Silicon Discriminator is specially designed for silicon sorting，it can quickly test the silicon type, heavy-dopedt, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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Product
microLED Testing System
OmniPix-ML1000
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The OmniPix-ML1000 is the first all-encompassing microLED testing system, offering both full wafer and localized individual pixel inspection. Measure localized and total EQE. Use automated PL and EL to test and characterize your microLEDs. Analyze defective pixels with nano-PL and nano-EL.
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Product
NI STS
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RF Test and Measurement Solutions, LLC
RFTMS is a leader in configuring systems to meet your needs, as well as designing load board, writing SW, and integrating the final solution. We do this for wafer test, packaged parts, and modules. RFTMS can address any level of integration that your parts employ, from a single functional block, i.e., Power Amplifier (PA) to System-on-a-Chip (SOIC). We test all sorts of RFICs.
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Product
Warpage Metrology System
TableTop Shadow Moiré (TTSM)
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Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Product
Substrate Manufacturing
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KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Product
Low Concentration Type HF/HCl/NH3 Concentration Monitor
HF-960M
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The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an environmentally-friendly product that uses lead-free solder for mounting chips on the PCB.
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Product
WaferPro Express On-Wafer Measurement Program Software
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WaferPro Express software performs automated wafer-level measurements of semiconductor devices such as transistors and circuit components. It provides turnkey drivers and test routines for a variety of instruments and wafer probers. Its new user interface makes it easy to setup and run complex wafer-level test plans, while powerful customization capabilities are enabled by the new Python programming environment.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
Silicon heavy-doped Tweezer Tester
HS-MRTT
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Mini resistivity tweezer tester is used to check heavy-dope silicon. adaptable for little granular material, little broken IC Wafer and other little silicon material. When the resistivity is lower than the set value, it will make alarm.
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Product
WLCSP Probe Heads
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Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
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Product
STDF Test Data Analysis Tool
DataView
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DataView is a low‐cost test data analysis tool that is used by test and product engineers to perform characterization of integrated circuit devices. DataView reads in industry standard STDF or ATDF files and can produce reports, histograms, and wafer maps in multiple formats including Excel. DataView is ideal for the test or product engineer who needs a fast and simple tool to analyze characterization data.
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Product
Macro Inspection
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High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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Product
Slip Line Detection System
YIS 200
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The YIS and SF Series metrology systems are designed for optical detection of wafer defects such as crystaldislocations, slip and other defects. The YIS-300HM (for 300 mm wafers) and YIS-200HM (for 200 mm wafers) utilizeMakyoh optics technology (Magic Mirror) and integrated robotic wafer handler provided by Hologenix.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
Absolute Contamination Standards (ACS)
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The Absolute Contamination Standard (ACS) is used to calibrate instruments which size and detect particles on the surface of bare silicon wafers. Use ACS to characterize particles, before particles characterize products.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
