Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
CMP Process and Material Characterization System
CP-4
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he new Bruker CP-4 CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes. Reproduces full-scale wafer polishing-process conditions. Provides unmatched measurement repeatability and detail. Performs tests on small coupons rather than whole wafers for substantial cost savings.
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Software
Junction Measurement and Analysis
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Materials Development Corporation
A comprehensive set of analyses for junction diode or Schottky barriers begins with C-V data gathering that adjusts the voltage step to the slope of the C-V characteristics. This assures an optimum set of C-Vdata whether the voltage range is small or large. Doping profile and resistivity profile are both available at the touch of a key. Plots of 1/C2 - V or Log(C) - Log (V+ phi) show doping uniformity and doping slope factor. Exclusive recalculation options allow adjustment of stray capacitance and area to facilitate calibration using a standard reference wafer of known doping or resistivity.
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Total Reflection X-ray Fluorescence (TXRF) Services
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A highly surface-sensitive technique, TXRF is optimized for analyzing surface metal contamination on semiconductor wafers.
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Product
Immersion Systems
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Immersion systems are the workhorses of the industry. Our latest NXT machines have shown the ability to run in excess of 6,000 wafers per day, with an average five percent productivity increase over 12 months, supporting our customers' value requirements. We continue to innovate our immersion systems to meet the requirements of future nodes, benefiting from commonalities in R&D with our EUV program, while ensuring the platform’s extendibility through System Node Enhancement Package upgrades. Thanks to these packages, any NXT system can be upgraded to the latest technology.
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Product
Low Concentration Type HF/HCl/NH3 Concentration Monitor
HF-960M
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The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an environmentally-friendly product that uses lead-free solder for mounting chips on the PCB.
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Product
MPI PA Wafer Probers
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MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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Product
Thermal Controlled Chucks & Plates
TOP Cool
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Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Product
Minority Carrier Lifetime Tester
HS-CLT
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HS-CLT Minority Carrier Lifetime Tester has strong functions. It can not only measure carrier lifetime of wafer but also silicon ingot, silicon filament,silicon phosphorus ingot,silicon boron ingot, seed crystal and other irregular shape silicon material.The minority carrier testing ranges from 1μs to 6000μs, the minimum resistivity is 0.1Ω.cm, (can be extensive to 0.01Ω.cm). Dynamic curve monitoring in the whole process.
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Product
EasyEXPERT Group+ Software (for B150x Mainframe)
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Keysight EasyEXPERT group+ GUI based characterization software is available for Keysight Precision Current-Voltage Analyzer Series. It is available on your PC or the B150xA's embedded Windows 7 platform with 15-inch touch screen to accelerate the characterization tasks. It supports efficient and repeatable device characterization in the entire characterization process from measurement setup and execution to analysis and data management either interactive manual operation or automation across a wafer in conjunction with a semiautomatic wafer prober. EasyEXPERT group+ makes it easy to perform complex device characterization immediately with the ready-to-use measurements (application tests) furnished, and allows you the option of storing test condition and measurement data automatically after each measurement in a unique built-in database (workspace), ensuring that valuable information is not lost and that measurements can be repeated at a later date. Keysight Precision Current-Voltage Analyzer Series provides the complete solution for device characterization with these versatile capabilities.
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Product
SAM Auto Line
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PVA TePla Analytical Systems GmbH
The fully automated acoustic microscopes from the SAM Auto Line enable simple detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer. The results can be issued as klarf files and VEGA MAP. A GEM/SECS connection is also possible.
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Product
Minority Carrier Life Time System
MWR-SIM
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MWR-SIM Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as probe.It enables repetition and contactless of measurement and does not require specialsurface treatment before measurement or wafer cutting.
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Product
Probecard testers
MANAGER
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Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
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Product
Probe Only Manipulator
LSP
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The LSP mounts to standard prober hinge mounts with easy access to service and engineering locations. This reduces the floor space per test cell, saving you significant capital expenses. And you’ll be able to quickly and easily set up your ATE to wafer probe.
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Product
Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
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The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
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Product
Thermal Engineering Projects
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Precision Development Consulting Inc
Open loop temperature controller, LED process tool, Single wafer CVD chamber, Batch CVD Tool, Batch ALD Tool, MOCVD equipment, Device cooler
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Product
Die Sorter Handler
4605-HTR
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4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.
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Product
330 System
NSX
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With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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Product
Mixed Signal Test Systems
MTS1020i
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The MTS-1020i is a cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process
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Microwave Plasma Subsystems
AX2600 And AX2700
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The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
Grain Inspector
iS-G1
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The iS-G1 is a full line speed optical module for the inspection of crystal grains.Using our new grain imaging technology, the iS-G1 is able to inspect as cut wafers at full inline speed with no need to stop the conveyor belt. Automated algorithms analyze the grains and report metrics.
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Product
Vacuum Handling Systems
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RECIF Technologies history started in 1982 offering its first wafer handling solution: Vacuum handling Systems.Based on this historical technical mastery, Recif Technologies provides today a full range of single wafer manual vacuum handling solutions adapted to our customers’ and current Semiconductor industry’s’ requirements.
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Product
Solar Cell PL/EL/IV 3-in-1 Testing System
VS6841
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Industrial Vision Technology Pte Ltd.
This luminescence Analyzer integrates a Photoluminescence (PL), Electroluminescence (EL) , and I-V Measurement Technology, has a Device’s PL image, EL image, as well Device’s I-V characteristics in One system. It is being using to quantitatively map Minority-Carrier Lifetime, and to characterize the defect of silicon wafer & solar wafer, and measure the key parameters from solar cell I-V Curve. It is also a useful tool for scientist to develop other methodology & parameters that can be used as a promising technique for online material monitoring and process control.





























