Wafer Failure Analysis
Defines the failure mode and then through additional testing determine it's cause.
See Also: Wafer, Wafer Thickness, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Spectrally Controlled Interferometry For Measurement And Analysis
SCI
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Directly measure all surfaces and angles in one setup, for an ROI of < 1 year.
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Spectrum Analysis, Up To 13.5 GHz
S930901B
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The S930901B spectrum analysis adds high-performance microwave spectrum analysis to the PNA family up to 13.5 GHz. With fast stepped-FFT sweeps resulting from optimized data processing, the SA application provides quick spurious searches over broad frequency ranges. Simultaneous spectrum measurements can be done using up to five test and reference receivers. This multi-channel SA can be used with the internal swept-signal generators for efficient measurements of spurious signals emanating from mixers and frequency converters. The SA application employs source-power and receiver-response calibration as well as fixture de-embedding, providing in-fixture and on-wafer spectrum measurements with the highest level of accuracy.
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Test Analysis for Land Seismic Systems
Testif-i Land
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Testif-i Land is an independent, powerful and cost effective software suite that allows you independently process instruments, source and receiver tests to confirm that the equipment is performing correctly and within specification. The software includes modules to perform comprehensive analysis of vibrator wireline similarity test data. Analysis includes a harmonic intensity plot which can highlight problems such as sub-harmonics which may not be seen on numerical results.Geophone pulse tests can be analysed using the receiver response module and test data from third party geophone testers can be graphed and statistics produced for ease of interpretation.
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System to Handle Wafer Levels
AMI AW Series
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Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Signal Analysis
Synchronous Accumulation (Order Analysis)
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Order analysis is one of the most convenient and efficient methods for diagnostics and balancing of rotating mechanisms and transmission gears. With an RPM sensor and a vibration sensor, it is possible to study the time characteristics of gear vibration signals. It is a well-known fact that a signal from a vibration sensor is affected by signals from other sources. To tune out from the disturbing signals, the synchronous signal accumulation method is used. For each shaft rotation, the RPM sensor provides a rotation mark. This signal serves as a triggering strobe for the vibration sensor signal sweeping. The obtained signal sweeps are combined. All the sources of the signals related to the shaft frequency (frequency of rotation) are accumulated and increased in the accumulator linearly proportionally to the N number of rotations. All other signals that are not correlated with the shaft frequency are accumulated proportionally to N1/2 and in case of a greater number of averagings, the useful signal exceeds the interference level.
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Data Acquisition & Analysis
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Avionics Interface Technologies
We provide fully integrated avionics data bus and high speed network analyzer and data acquisition systems. Combining our extensive product catalog of Avionics interface modules, and our easy to use Analyzer software applications, with our Engineering Expertise, we are able to satisfy a wide range of avionics network data capture and analysis requirements with our COTS products or with customized solutions.
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Mainframe Performance Monitoring & Analysis
Strobe
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Compuware Strobe is the industry-leading application performance monitoring and analysis solution for mainframe applications. With Strobe, IT departments can pinpoint application inefficiencies that cause excessive CPU consumption and reduce hardware and software costs while increasing customer satisfaction.
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Smart Analysis for PHP
PHPSA
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PHPSA is a development tool aimed at bringing complex analysis for PHP applications and libraries.*Static analysis*Code metrics*Branch prediction*Sandbox (AST) Compiler
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X-ray Diffraction and Elemental Analysis
D8 ADVANCE
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The intelligent beam path components of the D8 ADVANCE with DAVINCI design provide true plug'n play functionality requiring minimum or even no user intervention. Featuring automatic and tool-free switching of the diffraction geometry without the need for complex adjustments, the D8 ADVANCE with DAVINCI design broadens the analytical capabilities for a wide community of X-ray diffraction users.
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PoE LLDP Emulation (PSE) & Analysis for 802.3at & 802.3bt
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The IEEE 802.3 specifications require that Type 2, Type 3, and Type 4 PDs implement PoE LLDP and use the Power via MDI TLV for power negotiation. This requirement therefore applies to any PD that draws more than 13 watts. The PDA-600 family includes an option to flexibly emulate any PSE while capturing and analyzing the LLDP power negotiation protocol from a PD.
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CD Measurement and Advanced Film Analysis
FilmTek CD
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Scientific Computing International
SCI’s leading-edge solution for fully-automated, high-throughput CD measurement and advanced film analysis for the 1x nm design node and beyond. Delivers real-time multi-layer stack characterization and CD measurement simultaneously, for both known and completely unknown structures. Patented multimodal measurement technology meets the challenging demands associated with the most complex semiconductor design features in development and production.
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Low-overhead Coverage Analysis For Critical Software
RapiCover
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* Collect coverage for Ada, C & C++ (inc. MC/DC) on-host & target* Reduce test builds needed for analysis on constrained targets* Save time with efficient merge and mark verification workflow* Simplify verification by integrating with your CI tool* Produce evidence for DO-178 and ISO 26262 certification
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Ultrasonic Imaging with Molecular Analysis
MOLECULUS
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MoleculUS is a dual-modality ultrasound and photoacoustic data acquisition unit that allows the simultaneous collection of ultrasound and photoacoustic channels sharing the same probe elements. The analog signal path of MoleculUS is split into PA and US paths. PA and US modes operate sequentially in time with support for US preview mode and continuous on-fly multiplexing between modes.
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X-ray Fluorescence, XRF Analysis Services
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Two XRF systems are available, a wavelength dispersive system (WDXRF) and an energy dispersive system (EDXRF). The difference is the manner in which the x-rays are detected. WDXRF instruments have very good energy resolution which leads to fewer spectral overlaps and improved background intensities. EDXRF instruments have higher signal throughput which can shorten analysis times. The higher signal throughput also makes EDXRF systems suitable for small spot or mapping analysis.
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Jitter And Eye Diagram Analysis Tools
DPOJET
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DPOJET is the premiere eye diagram, jitter and timing analysis package available for real-time oscilloscopes.Operating in the Tektronix DPO7000, DPO70000 and DSA70000 Series oscilloscopes. Jitter and Timing Analysis for Clocks and Data Signals. Real-Time Eye Diagram (RT-Eye™) Analysis*1. TekWizard™ Interface for One-Button and Guided Jitter Summaries.
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X-ray Photoelectron Spectroscopy Analysis (XPS Analysis)
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Rocky Mountain Laboratories, Inc.
X-ray photoelectron spectroscopy (XPS Analysis) also called Electron Spectroscopy for Chemical Analysis (ESCA) is a chemical surface analysis method. XPS measures the chemical composition of the outermost 100 Å of a sample. Measurements can be made at greater depths by ion sputter etching to remove surface layers.
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Wafer Thickness Measurement System
MPT1000
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Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Surface Analysis
Dimension AFP
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The Dimension AFP is the world's only fab-based metrology tool specifically designed for both CMP profiling and etch depth metrology for current and advanced technology nodes. The system combines the superb resolution of an AFM with the long-scan capability of an atomic force profiler tomonitor etch depth and dishing and erosion on submicron features with unsurpassed repeatability.
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Mainframe Debugging and Analysis
Xpediter
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Xpediter is Compuware's mainframe application interactive debugging and code coverage solution. When an application experiences a problem, developers need to get into an interactive test session to solve the issue. However, complex setup procedures make this a time-consuming step and delay the resolution process.Compuware's mainframe debugging and analysis tool Xpediter enables developers to get into an interactive test session with minimal effort and quickly move applications into production with greater confidence.
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Dynamic Signal Acquisition and Analysis
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m+p Analyzer systems are available for field and laboratory use from 4 to many hundreds of measurement channels. From gathering simple time history data to narrowband (FFT) spectra, fractional octaves, wavelets, shock response spectra and much more, m+p Analyzer real time analyzers can be used with a wide range of instrumentation hardware including our own m+p VibPilot, m+p VibRunner and m+p VibMobile systems, National Instruments (CompactDAQ USB, PCI, PXI) and VTI Instruments (PCI). Low cost portable instruments to systems for distributed measurements can be configured for maximum flexibility. Measurement data from all sources are stored in a common format so it is easy to compare and handle results from any measurement source.
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Zero-footprint Timing Analysis For Critical Software
RapiTimeZero
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*Collect timing metrics from systems that produce branch traces* Identify code to optimize for worst-case behavior*Debug rare timing events*Simplify verification through integration with your CI tool*Analyze timing behavior of libraries without source code
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Optical Communication Analysis
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In lab and manufacturing environments, R&D engineers require scalable and optimized test solutions to enable them to properly characterize new advanced modulation scheme signals for next-generation, ultra-high-speed telecom networks. Through EXFO’s optical communication analyzers, R&D engineers and manufacturing operations involved in the development or production of transmitters or systems based on new high-speed technology will find the right tools for their advanced technology needs.
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IC Side Channel Analysis
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These probes allow you to couple fast, transient magnetic field, E-field, and current pulses into ICs.
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Air Quality Analysis
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Ambient Gas Monitoring: We offer a variety of analyzers for the ambient monitoring of the criteria pollutant gases, including CO, NOX, SO2, and others such as CH4 and CO2. Source Gas Monitoring (Emissions Monitoring): Experience reliable measurement in your process for emissions compliance every time.Ambient Particulate Monitoring: Experience our monitoring technology and gain the power to do more than just inform.Emissions Calibrators: For continuous monitoring of mercury in exhaust stacks, waste incinerators, and cement kilns, or multi-gas models to control the calibration of gas concentrations.
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Cable Pulling Analysis
CABLE
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CABLE quickly solves complex three-dimensional cable pulling tension and sidewall pressure calculations, allowing you to make rapid and accurate design decisions.Don't leave installation to chance.
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Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
