Defect
other than specified, imperfection .
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Product
Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Transistor-Level Defect Simulator
Tessent DefectSim
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Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
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Product
Sapphire Defect Laser Probe and Glasses
LP-100
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Easy to use and portable■ low price with long lifetime■ can be used to detect many defects, like micro crack, bubbles, impurity, crystal subgrain■ When the laser go though the crystal, if it is monocrystal the light should be scattering, in macro it should be white.
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Product
Defect Isolation
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*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Product
Defect Inspection Module
EB40
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The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Product
Solar EL Defect Detector
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Jiangsu Keyland Laser Technology Co., Ltd.
Features: - Reveals invisible defects- Improves line yield prior to lamination- Improves quality and reliability of final product- Exceptional optical resolution in its class- Flexible system configuration for framed or unframed modules testing
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Product
Defect Review Station Software for electrical test
Faultstation
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Centralize all error review for your different testers in a single seat! To capture PCB layout information, FaultStation offers the choice of DPF or IPC input. In combination with a Ucamco data-prep seat, DPF is the obvious choice, while industry standard IPC provides a doorway to all other data-prep systems in today’s marketplace. Once the layout data is available, you combine it with the error information from a variety of different models and makes of testers.
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Product
Digital In-Circuit tester
MTS180/300
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Analog in-circuit inspection and function inspection are realized on this inspection equipment. IC pin float function is standard equipment. The MTS180 is a press type jig, and the MTS300 is a vacuum type jig. In the board mounting process at the production site, electrical inspection is performed on the mounted board after component mounting, and non-defective or defective products are automatically judged. The main inspection contents are short / open inspection, analog inspection of resistors, capacitors, coils, diodes, etc., lead floating voltage measurement of QFP and BGA, Digital IC inspection, frequency measurement.
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Product
Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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Product
kSA Emissometer
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The kSA Emissometer is designed to quickly and easily generate high-resolution diffuse and specular reflectance and total emissivity maps of MOCVD carriers. Carrier emissivity variation means temperature non-uniformity, which can lead to reduced device yield and possibly complete growth run failure. With the kSA Emissometer, emissivity changes can be tracked to determine carrier end-of-life, without wasting growth runs. The kSA Emissometer also detects unwanted residual deposits after baking, and easily identifies carrier surface defects, scratches, microcracks and pits that are not visible to the eye.
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Product
Thermal Cycling Test Equipment
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Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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Product
Radiographic Inspection Test
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The radiographic inspection is a non-destructive x-ray method for detecting internal physical defects in small component parts which are not otherwise visible. Radiographic techniques are intended to reveal such flaws as improper positioning of elements, voids in encapsulating or potting compounds, inhomogeneities in materials, presence of foreign materials, broken elements, etc.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Automated Optical Inspection (AOI)
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Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Product
Eddy Current Testing
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Shanghai Xianda Denshijiki Industry Co.,Ltd
And the eddy current generated on the specimen by the specimen by the action of the magnetic field can not be detected (defect) and the change due to the influence of the material is detected.
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Product
T8090 Dual Absolute Leak Tester
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The Dual Absolute.The new Dual Absolute technology makes it possible to eliminate the disadvantages of a classic differential system, improve its advantages and renew an industry that has been standing still for decades. Thanks to the new Dual Absolute technology, ForTest has combined the simplicity of a classic absolute decay system with the precision and sensitivity of a differential system, bringing leak testing instruments to a level never seen before.The new algorithms and measurement hardware eliminate typical defects in a differential system, such as differences in stabilization between the test part and the reference sample.The new range of instruments is able to work in 3 different ways: Pure Differential, Dual Absolute and Central Zero.The new Dual Absolute technology is so powerful and reliable that ForTest has decided to stop developing the classic differential system.
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Product
Scanning Electron Microscope
E5620
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The E5620 is a MASK DR-SEM(∗) product for reviewing and classifying ultra-small defects in photomasks and mask blanks. It implements Advantest’s highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations. Compared to the E5610, our predecessor DR-SEM system, the E5620 features a number of improvements designed specifically to target mask requirements for extreme ultraviolet (EUV) lithography.
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Product
Ceramics and Glass Inspection Systems
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Due to their special material properties, ceramic and glass components are the basis of many high-tech products. The same properties make the production complex and costly. Substrate defects that lead to failure of finished components should be avoided at all costs. For this reason, early automated optical inspection is essential.For the inspection of sapphire and quartz glass Intego has developed systems to detect both external and internal defects and can also provide cutting suggestions. Using index matching it is possible to test rough or uneven glass profiles.For the inspection of ceramic components Intego offers solutions specifically tailored to the respective testing task. Our modular design uses standard components that have already been developed and tested and in most cases only requires minimal adaptation.
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Product
Environmental Testing
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Environmental testing and accelerated ageing are testing that may be mandated for certain regions or required standards. But for many products, this testing is not mandated, but if any claim to performance is made then testing should be done to have evidence. In addition, it can help ensure less product returns to defective products that may after sold become faulty due to external environmental impacts.
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Product
Thermal Shock Chambers
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Weiss Technik Thermal Shock chambers are designed to give quick transitions between a HOT and COLD temperature zones. Available in vertical, horizontal and liquid models. Thermal stock chambers are used in all industries including Automotive, Electronics, Aerospace, and others to help find product defects in electronic components and product assemblies. Thermal shock is important with MIL -STD 883 test standard.
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Product
Non- Destructive Testing
NDT
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Non-destructive testing (NDT) is an application of industrial radiography that uses X-rays to reveal defects in manufactured products or structures. Fujifilm NDT systems share digital X-ray innovations with our Fuji Computed Radiography (FCR) imaging systems.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
PXI Based Multifunction Measurement and ICT Instrument
PXI-501
Multifunction Switch/Measure Unit
The PXI-501 is a multifunction measurement instrument for functional and in-circuit measurements.It combines two parametric measurement units with a digital voltmeter, a high voltage current source and a discharge unit. This powerful combination makes it the ideal instrument for classical analog in-circuit test and manufacturing defect analysis with additional functional test capabilities.With it’s fast sampling rate of up to 4MSps it speeds up measurements and is capable of measuring and generating AC signals up to 100kHz.To enhance the PXI-501 capabilities it can be combined with an ABex TM-501 or an ABex TM-404. The ABex TM-501 enhances the in and output range of the PXI-501. Furthermore, it provides a shunt current measurement upgrade. In combination with the ABex TM-404 it’s a complete in-circuit test solution with 86 channels in one ABex slot. For sure it can be upgraded to 2838 test points in one rack by simply adding additional matrix modules.With the above-mentioned terminal modules, the PXI-501 is able to act as a ABex system controller, so that no additional controller is required in the cassis.
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Product
Axis Play Tester
PMS 3.5 | VP 225012
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Maschinenbau Haldenwang GmbH & Co. KG.
The axis play tester PMS 3.5 is used to reliably determine defects and wear on steering parts, wheel bearings, suspension and suspension by counter-rotating transverse and longitudinal movement of the test plates. The built-in hydraulic drive ensures a powerful and even movement of the test plates. An automatic mode and other different operating modes make the PMS 3.5 easy to use.
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Product
Contour Check Shape
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Contour Check Shape has proven itself in hot rolling of long products and is an essential part of the rolling process in many factories. It checks hot and cold steel profiles with the help of three-dimensional surface reconstruction. Thus, it records geometrical errors due to rolling defects including surface defects like scale seams, shells or roller outbreaks.
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Product
Magnetic Permeability Meter Ferromaster
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Instrument for easy measurement of the relative magnetic permeability µr of feebly magnetic materials and workpieces with a permeability between 1.001 and 1.999. The permeability is measured by touching the workpiece with the probe tip and reading the result from the display. Typical applications are: non-destructive testing of materials, e. g. quality control of stainless steel, material selection for electron-/ion-beam equipment, detection of material defects induced by mechanical or thermal stress.
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Product
MPI Sorter Series
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MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Product
Environmental Stress Screening (ESS) Chamber
ESS
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Developed to help electronics manufacturers detect product defects and production flaws, Environmental Stress Screening (ESS) forces infancy product failures that would otherwise occur after final assembly and product delivery. ESS’s goal is to improve profitability by eliminating defective products. ESS Systems can meet individual performance needs, product loading, and throughput requirements. Thermotron has the experience to provide the best solution for ESS testing at your company.
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Product
3D AOI
Zenith2
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Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.
