Defect
other than specified, imperfection .
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Product
Defect Isolation
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*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Product
Defect Inspection Module
EB40
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The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Product
Transistor-Level Defect Simulator
Tessent DefectSim
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Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
Defect Review Station Software for electrical test
Faultstation
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Centralize all error review for your different testers in a single seat! To capture PCB layout information, FaultStation offers the choice of DPF or IPC input. In combination with a Ucamco data-prep seat, DPF is the obvious choice, while industry standard IPC provides a doorway to all other data-prep systems in today’s marketplace. Once the layout data is available, you combine it with the error information from a variety of different models and makes of testers.
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Product
Surface Defect Inspection System
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Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Product
Translating process images into significant tool-defect reduction
Trans-Imager
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Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Sapphire Defect Laser Probe and Glasses
LP-100
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Easy to use and portable■ low price with long lifetime■ can be used to detect many defects, like micro crack, bubbles, impurity, crystal subgrain■ When the laser go though the crystal, if it is monocrystal the light should be scattering, in macro it should be white.
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Product
TO-CAN Package Inspection System
7925
System
Chroma 7925 is an automatic inspection system for TO-CAN package. The appearance defects over 30 um like lens scratch, partial are clearly conspicuous by using advanced illumination technology. Because the height variation of tray and package exists, Chroma 7925 can calculate the focus distance and compensate to overcome the variation with auto focus function.
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Product
Test Services For Circuit Board
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Acculogic Contract Testing Services group with multiple locations in United States, Canada, Germany and China provides Cost Effective, On-Demand (Quick-Turn) testing service. Our circuit board assembly test services include defect analysis, In-Circuit, Boundary Scan JTAG and Functional testing on industries most widely used test platforms.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
Impulse Winding Tester
TH2882A-3
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Changzhou Tonghui Electronic Co., Ltd.
Due to the influence of coil wire material, magnetic material, framework and manufacture technics etc., coil products (such as transformers, motors, etc.) may have defects of low insulation between coil layers, circles and leads. TH2882A series impulse winding tester, adopting high-speed sampling technique, is a new generation analysis test instrument for insulation performance of coil products.
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Product
Backplane Profiling & Inspection System
603d
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A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.
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Product
Contour Check Round & Edge
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Laser measuring systems are of central importance for rolling mills to check the contours of steel profile for defects during the production process. A slight deformation on the surface of the profiles reduces the quality of the product, and in the worst case, a broken roll can even destroy the entire batch. With our systems Contour Check Round & Edge you identify and evaluate deviations at an early stage. Increase the process efficiency of your production - regardless of temperature and profile shape.
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Product
Torque Tester
TorqueLab® LTT-Series
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The torque analyzer is designed for calibrating tools, joint testing, auditing and measuring torque. Torque tools go out of calibration with use. To maintain consistent accuracy, torque tools must be checked periodically for wear or defective parts. A power or hand torque tool is a measuring tool that must be properly calibrated and maintained.
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Product
Power Steering Tester Kit
PST22A
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Pinpoints defective power steering pumps, defective power steering gears and kinked or clogged power steering lines.
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Product
Plastic Analyzer
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The Plastic Analyzer method package includes an FTIR spectral library for plastics degraded by UV rays and heat. Utilizing searches of this library demonstrates its effectiveness in the analysis of unknown samples that are difficult to identify with standard libraries. Examples include plastics degraded by exposure to UV rays as well as contaminants and defective items altered by heating.
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Product
Ultrasonic Immersion Probes
SONOSCAN I
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The SONOSCAN immersion transducers for Non-destructive Testing (NDT) are mainly used to test metals and plastics for the smallest material defects. For example, binding defects, welding defects or cracks and pores in metal parts can be detected. The powerful, robust ultrasonic probes can be connected to all common ultrasonic testing devices. Due to variable designs and sizes, the immersion probes guarantee optimal use. In addition to ultrasonic standard pobes, we also offer customized transducers according to your individual specifications.
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Product
Automated Visual Quality Control System for Lid Assembly
Angara-form
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The automated visual inspection system is designed to identify and reject covers that have defects that have arisen during industrial production, as well as visible defects in the form of black dots or dirt on the surface of the cover.
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Product
Quick Change Probes For Weld Seam Testing (ASTM)
SONOSCAN Q
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In addition to angle beam probes according to european standards (EN), we offer probes with quick-change wedges for ultrasonic weld seam inspection as well as various wedges for the american market. Quick-change probes are used wherever access to the inspection object is difficult to reach with the larger AWS transducers. The relatively small, round elements also offer better defect resolution.
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Product
Substrate Manufacturing
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KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Product
ECHO VS System with Image Enhancement
Echo VS
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The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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Product
Portable Eddy Current Flaw Detectors
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Portable eddy current (EC) flaw detectors inspect metallic parts and perform highly reliable and advanced flaw detection of surface and near-surface defects. Olympus offers portable eddy current equipment to meet a broad range of applications, including the detection of surface or near-surface defects, and the inspection of bolt holes.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
Inspection System for Die Casting
X-eye 7000BS
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Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
Manufacturing Defects Analyzer
eloZ1-400
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The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1-400 is the compact version of the eloZ1. It is particularly suitable if there is only limited space to fit test appliances. The eloZ1-400 can also be used as a mobile test system.
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Product
Environmental Stress Screening (ESS) Chamber
ESS
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Developed to help electronics manufacturers detect product defects and production flaws, Environmental Stress Screening (ESS) forces infancy product failures that would otherwise occur after final assembly and product delivery. ESS’s goal is to improve profitability by eliminating defective products. ESS Systems can meet individual performance needs, product loading, and throughput requirements. Thermotron has the experience to provide the best solution for ESS testing at your company.
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Product
Interoperability Testing Services
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Using our decades of knowledge and experience of Bluetooth, markets and products we'll help you deliver products which are free of defects, minimize field issues, lower development costs and reduce time to market. Teledyne LeCroy offers test services to help in all stages of product development from Specification to Market Launch and beyond.
