Common Core
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Product
3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
OpenVPX
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® H110
OPS500-501-H
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The OPS500-501-H is an OPS compliant digital signage player supporting dual displays with 4K at 60Hz resolution. The smart cableless open pluggable digital signage module is powered by the latest 7th/6th generation Intel® Core™ and Celeron® processors (codename: Skylake) with the Intel® H110 chipset, providing outstanding performance at a lower cost. It supports LGA1151 socket-type CPUs to offer greater flexibility for CPU selection. In addition, the OPS signage module has one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB memory capacity. The high-performance OPS500-501-H is a perfect solution for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center, and many more.
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Product
Embedded System Support Intel® 12th/ 13th/ 14th Gen. Core I9/i7/i5/i3 Platform
EPC-B2208
Embedded PC
Support Intel 12th/ 13th/ 14th Gen. Core i9/i7/i5/i3.Two DDR4 3200MHz SODIMM and up-to 64GB.Supports triple independent displays of 2x DP/HDMI/LVDS.One low-profile PCIe expansion slot.
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Product
PXI/PXIe RF Multiplexer, Dual 4-Channel, Terminated Common, 3GHz, 50Ω, MCX
42-876A-102
Multiplexer Module
The 40-876A-102 (PXI) and 42-876A-102 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 2 banks in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module has low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost.
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Product
PXI 5A Power Multiplexer, 2-Bank, 24-Channel, Isolated Common, Independent Isolation
40-651A-112
Multiplexer Module
The 40-651A-112 is part of our range of high density power multiplexer modules is suitable for switching inductive/capacitive loads up to 5A at 250VAC. It is available in the following 1-pole multiplexer formats.
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Product
Complete TAP Signal Isolation for Corelis Boundary-Scan Controllers
ScanTAP IsoPod
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The Corelis ScanTAP IsoPod™ is an add-on accessory that provides a galvanic isolation barrier between the target system and the boundary-scan (JTAG) controller hardware. While the Corelis boundary-scan controllers are highly robust and reliable, the complete electrical isolation helps prevent damage to the controller from harsh electrical environments where over-voltage and over-current can damage components.This Corelis ScanTAP IsoPod was designed to add an additional layer of protection with minimal cost and effort. Open the box and plug it in; everything just works.
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Product
Fanless Embedded System With LGA1150 Socket Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, 2 HDMI/VGA/DisplayPort, 4 GbE LANs, 6 USB 3.0, Wide Range DC-in And PCIe Mini Card
eBOX670-883-FL
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The eBOX670-883-FL supports the LGA1150 socket type for 4th generation Intel® Core™ i7/i5/i3 and Celeron® processors (formally codename: Haswell) with Intel® Q87 Express chipset. Under this rich support system, the eBOX670-883-FL allows wide operating temperature ranging from -40°C to +55°C for the most endurable operation. The outstanding embedded controller comes with four 10/100/1000 Ethernet ports, Jumbo Frame (9.5K), PXE Remote Boot, Teaming, and wake-on-LAN (WOL) function to highly enhance its network connection speed. Additionally, the eBOX670-883-FL supports up to three independent hi-resolution displays or a 4K display. Undoubtedly, this rugged fanless embedded computer is the best solution for any industrial field, including host computers, cloud computing servers, multimedia applications, and automation systems.
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Product
End Point IP Core
PCIe
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The highly configurable PCIe End point IP core supports x1, x2, and x4 lane with a selection of 32/64-bit data path. Depending on design requirements, a maximum of 8 VCs and 8 TCs are supported. The IP core consists of many useful features that can be included to enhance system performance and to address special design needs in different applications. The data link layer allows the configuration of infinite credits to boost the flow control efficiency. By-pass mode, cut-through mode, and store-and-forward mode are other optional items. The transport layer features include configurable ECRC generation and checking, support for up to 64 configurable outstanding non-posted requests, and configurable payload size from 128 to 4 Kbytes
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Product
3U Intel® Core™ i7-7820EQ Quad-Core Processor-Based PXI Express Gen3 Controller
PXIe-3987
Controller
The ADLINK PXIe-3987 PXI Express embedded controller, based on the 7th gen Intel® Core™ i7 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
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Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
Intel® 8th/9th Generation Core I 2U Fan System
EPC-P3066
Embedded PC
Intel® 8th/ 9th Gen Core™ i processor (LGA1151) with Intel C246/H310Up to 4 x extension Card by Riser Card (Optional)3 x GigaLAN and upto 8 x USB3.02 x RS-232/422/485 and 4 x RS232 serial ports, 16 bit GPIO4 x SATA (max), 1 x M.2 E key, 1 x M.2 B/M key, 2 x F/S mSATAVGA+HDMI or 2 x HDMI output (Optional)12~24V DC input power rangeSupport Advantech I Door moduleSupport SUSI, WISE-DeviceOn and Edge AI Suite
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Product
Intel® 6th/7th Generation Core™ I3/i5/i7 Performance Embedded PC
EPC-B2205
Embedded PC
Supports Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170/H110 chipset.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of VGA/DP/DVI.One expansion slot (low profile).Two Shock Resistant 2.5" drive bays.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
12.1" Panel PC With 8/9th Generation Intel® Core™ I/Celeron® Processor
PPC-6121
Panel PC
12.1" TFT XGA LCD panel with resistive touch control8/9th generation Intel® Core™ i/Celeron® processor (thermal power design: 35W)2 x 260-pin SO-DIMM DDR4 2666 MHz (max. 32 GB)1 x M.2 2230 (E key)1 x mSATA bay (SATA SSD + mSATA support RAID 0&1)1 x Optional TPM2.0 & 1 x Optional PCI/PCIe x4 expansion kit1 x Isolated RS422/485 (terminal block)1 x VGA and 1 x HDMI
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Product
12.1" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-312S(W) RPL
Panel PC
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
Computer on Module
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Product
Performance Core i7 Mission Computing Platform
ComSys-5362
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The ComSys-5362 is a rugged COTS based mission computer. A powerful yet power stingy 15W Intel Core™ i7 CPU supports signal processing for critical applications. Highly configurable, application-specific I/O. Removable drive bay for two 2.5“ SSDs.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3100 with Intel MXM GPU
Industrial Computer
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
785158-04
Controller
PXIe, 2.6 GHz Dual Core Processor PXI Controller—The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
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Product
PXIe-8830MC, Intel Core i7 Processor PXI MultiComputing Processing Module
783564-33
Processing Module
The PXIe‑8830mc allows two or more intelligent systems to exchange data using PCI Express technology. Featuring an Intel quad-core processor, the NI PXIe‑8830mc can be installed in any PXI Express peripheral slot. It runs on the LabVIEW Real‑Time OS and can act as a coprocessor to offload the processing from the main embedded controller in the system.
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Product
Compact Fanless System With 10th Gen Intel® Xeon®/Core™ I CPU Socket (LGA 1200)
MIC-770 V2
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Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipsetWide operating temperature (-10 ~ 60 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports Advantech i-Modules, FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IOVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)Microsoft Azure PnP, AWS IoT Greengrass, Ubuntu CertifiedRED Compliance
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Product
11th Gen. Intel® Core™ Processor-Based Fanless Open Frame Touch Panel PC
SP2-TGL Series
Panel PC
- 11th Gen. Intel® Core™ Processor- 10.1"/15.6"/21.5" PCAP touch screen- Wide input voltage range 9-36V DC- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Extensive I/O and function expansion through board-to-board connectors (Function Modules)- Enhanced protection in case of sudden power outage with back-up battery (Optional)- Pre-compliance EMC testing and high ESD tolerance
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Product
6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
Industrial Computer
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Product
Fanless Embedded System With Intel® Atom™ Processor E3845 Quad Core™ (1.91 GHz) For Railway PC
tBOX323-835-FL
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The tBOX323-835-FL, a fanless railway PC, is designed for in-train applications. Integrated with onboard quad-core Intel® Atom™ E3845 processor and 4 GB low-powered DDR3L memory. The fanless railway PC boosts its computing performance and specializes its I/O design with five isolated COM ports, two M12-type LAN connectors, USB 2.0 ports, and one isolated digital I/O. The railway PC also provides VGA and HDMI outputs for in-train surveillance. The tBOX323-835-FL is an ideal all-in-one IoT (Internet of Things) solution for various applications, including railway multi-functions of gateway, controller, digital signage management and surveillance. Certificated with EN50155 and EN50121 for rolling stock and complied with EN45545-2 for fire resistance, the rugged embedded system operates reliably in a -40ºC to 70ºC operating temperature range (EN50155 Class TX) and in a high vibration environment.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H310 And TPM 2.0
OPS500-520-H
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The OPS500-520-H is powered by the newest 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (code name: Coffee Lake S) with the Intel® H310 chipset. The smart cableless digital signage module has two DDR4-2400 SO-DIMMs for up to 32GB of system memory. Axiomtek's OPS500-520-H supports the LGA1151 socket-type processors offering greater flexibility for CPU selections, which is easily configured to meet various performance requirements. The OPS signage module is connected to OPS-compliant display via a standardized JAE TX-25A plug connector interface which supports DisplayPort, HDMI 2.0, USB 2.0, USB 3.1, audio and UART signals. It also has one M.2 Key E for Wi-Fi modules and one M.2 Key M supporting PCIe, SATA and SSD interfaces for storage. We believe that this new smart cableless open pluggable signage module with simplified installation, maintenance and upgrade can help you develop creative display solutions that increase your sales and improve your customers' experiences. With the enhanced multimedia performance, the Intel® Coffee Lake S-based OPS500-520-H is well suited for a wide range of digital signage applications in retail, transport, entertainment, education, and more.
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Product
COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
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The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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Product
TAP Adapter for Corelis JTAG Controllers
Low Voltage Adapter
Controller
High technology, energy efficient, and small form factor products push JTAG interfaces to the limits; low power and high performance means low voltage, high speed, and high drive requirements. Building specialized interface circuits on product Printed Circuit Boards (PCBs) is inconvenient and costly—an out-of-the-box, external solution is needed.The Corelis Low Voltage adapter is an add-on accessory that provides existing scan controllers with an active, plug-in interface to access low voltage scan chains, without sacrificing performance.
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Product
Metal Cored PCB
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Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.
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Product
Air Core Test Lab Reactors
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Test Laboratory Reactors are designed for high voltage and high power test laboratories. They are designed to withstand the most extreme electrical service conditions during test periods. Design techniques are implemented in accordance with the most demanding service conditions. These reactors are used for various purposes in test laboratories such as current limiting and synthetic testing of circuit breakers, capacitor testing, artificial line simulation etc.
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Product
Intel® Core™ Ultra Processor-Based Fanless Open Frame Touch Panel PC
SP2-MTL Series
Panel PC
- Intel® Core™ Ultra H series (Meteor Lake) processor- 10.1"/15.6"/21.5" Projected capacitive touch screen- 3x independent display output, LVDS, DP, USB type C- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Extensive I/O and function expansion through board-to-board connectors (Function Modules)- Support PoE by extension module (optional)- Support NVIDIA MXM GPU type A by carrier board (optional)- Pre-compliance EMC testing and high ESD tolerance
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Product
Intel® Core™ I3, N Series And Atom® X7000E/x7000RE Series Processor
AIMB-219
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Intel® Core™ i3, N series and Atom® x7000E/x7000RE SeriesUp to 32GB DDR4 3200MT/s SODIMMTriple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMTHIN Mini-ITX low profile I/O stack design, fanless thermal solutionExtend operating temperature: -20C~70°C (-4 ~ 158 °F)
