Common Core
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Product
Open Pluggable Specification (OPS) Digital Signage Player With Socket G2 Intel® Core™ I5/i3 & Intel® HM65
OPS860-HM
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The OPS860-HM Open Pluggable Specification (OPS) compliant signage player delivers high performance without the high cost of installation and maintenance. This signage player supports 2nd generation Intel® Core™ i5/i3 processors with Intel® HM65 Express chipset and has a DDR3-1333 system memory that can expand up to 4GB. The OPS860-HM connects to any OPS compliant display via a standardized JAE TX-25 plug connector, and includes HDMI/DVI, DisplayPort, UART, audio, and USB 2.0 signals. Compliant with standard OPS architecture, the OPS860-HM delivers greater interoperability and allows for easy upgrade and replacement without the need to dismantle the entire signage system.
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Product
Mini-ITX Embedded Board With 12th/13th/14th Gen Intel® Core™ Desktop Processor
AmITX-AD-G
Motherboard
The AmITX-AD-G is a mini-ITX board specifically designed to be in compliance with GLI standards for the gaming industry. The AmITX-AD-G gaming board supports enhanced display specifications, ensures system integrity, and guarantees secure transactions while also offering fast time to market (TTM), low total cost of ownership (TCO) and maximum system uptime for mission critical applications.
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Product
CPCI/PICMG 2.16 Intel Core 17th Gen. System
CP6004-RA_RC
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The CP6004-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.Based on the Intel® Core™ i7 third generation processor and the QM77 platform controller hub, the CP6004-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.
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Product
PXIe-8830MC, Intel Core i7 Processor PXI MultiComputing Processing Module
783564-33
Processing Module
The PXIe‑8830mc allows two or more intelligent systems to exchange data using PCI Express technology. Featuring an Intel quad-core processor, the NI PXIe‑8830mc can be installed in any PXI Express peripheral slot. It runs on the LabVIEW Real‑Time OS and can act as a coprocessor to offload the processing from the main embedded controller in the system.
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
Industrial Computer
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
Computer on Module
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
OpenVPX
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Product
Common Mode Chokes
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Common Mode Chokes, as the name implies, are designed to attenuate and filter common mode noise within an electric system. The key parameters for a common mode choke are the current rating (to ensure the part does not overheat within the application), the impedance versus frequency (to ensure it is optimized to attenuate the desired frequencies), the isolation voltage (to ensure it meets board level requirements between the line and neutral phases) and safety isolation (to ensure it meets the safety requirements of the end-application). It is important to remember that common mode chokes cannot saturate in the application (under normal use) as they are designed to ensure that the line and return currents are balanced.
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Product
Air Core Shunt Reactors
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Shunt Reactors act as absorbers of reactive power to increase energy efficiency of the power system. Shunt Reactors are inductors that are used in order to compensate capacitive reactive power generated by long and lightly loaded transmission lines as well as underground cables, thus allowing the flow of more active power through the system and avoiding over voltages. The shunt reactors provide inductive compensation.
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Product
15" Fanless Panel PC With Intel® Celeron Quad Core J1900 Processor
PPC-3150-RJ9
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15" TFT XGA LED Panel with resistive touchscreenEmbedded Intel Celeron processor, quad core J1900 2.0GHz onboardSystem memory up to 8GB DDR3L 1333 SDRAMSupports one internal SATA 2.5" HDDSupports one Mini PCIe socket, two Gigabit EthernetFanless and compact size with low power consumputionSupports five RS-232 and one RS-232/422/485, besides six RS-232 and two RS-422/485 are optional by requestSupports one mSATA socket
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor For Railway, Vehicle And Marine PC
tBOX500-510-FL
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The tBOX500-510-FL comes with the onboard 7th generation Intel® Core™ or Intel® Celeron® processor 3965U along with onboard two DDR4-2133 SO-DIMM slots supporting up to 32GB system memory. It offers two I/O module slots and a wide selection of value-added modules (VAM) to meet different user requirements and customizations. The rugged tBOX500-510-FL is certified with E-Mark, ISO 7637-2, EN 50155, EN 50121, DNV 2.4, EN 45545-2 and IEC 60945.It supports a wide temperature range from -40°C to +70°C and anti-vibration of up to 5 Grms. The fanless embedded box PC equipped with intelligent power management offers ACC on/off delay, shutdown delay and over/under voltage protection. It supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for railway & marine applications, and 16.8V to 137.5V DC for railway applications. For system integrators with extensive storage needs, the box computer offers two 2.5” SATA HDDs and one mSATA. The new transportation embedded system is well suited for transportation-related applications such as security surveillance, onboard devices controller, truck fleet management, data transfer, and onboard passenger infotainment system.
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Product
250 MHz 60 V Common Mode Differential Probe
DL02-HCM
Differential Probe
60 V of common mode and 80 V differential input range with 1 GHz of bandwidth, make these probes ideal for lower voltage GaN power conversion measurements. The 60 V of common mode is well suited for handling any float of the battery and bulk/absorption voltage during charging, while the 80 V differential input range provide margin for any overshoot.
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Product
Compact Size Tower IPC With 12th / 13th Gen Intel® Core
IPC-320
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Compact Size Tower IPC with 12th / 13th Gen Intel® Core™ i CPU Socket (LGA 1700) and 250W PSU. Intel® 12th / 13th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with H610E chipset. Design for operator IPC and application with space limit, Dual USB 3.2 and dual USB 2.0 port on both front and rear side. Dual Independent Display (HDMI/ DP) 2 low profile Expansion slots (PCIe x16 and PCIe x4).
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Product
Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
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The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Product
Intel® Core™ I3, N Series And Atom® X7000E/x7000RE Series Processor
AIMB-219
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Intel® Core™ i3, N series and Atom® x7000E/x7000RE SeriesUp to 32GB DDR4 3200MT/s SODIMMTriple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMTHIN Mini-ITX low profile I/O stack design, fanless thermal solutionExtend operating temperature: -20C~70°C (-4 ~ 158 °F)
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Product
Tilera GX72 Processor, 72 Core, Mid-size, AMC
AMC741
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The AMC741 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network.
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Product
MicroATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Edge Computing, Industrial Automation, And Compact Servers.
ASMB-589
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Powered by LGA 1851 Intel® Core™ Ultra 9/7/5 processors with W880 chipset for high-performance computing.Supports up to 192 GB of DDR5 ECC/Non-ECC UDIMM memory at speeds of 5600/4800/4400 MT/s for demanding applications.Features two PCIe x16 (Gen5) and two PCIe x8 (Gen4) slots for flexible expansion with high-speed peripherals.Offers versatile display connectivity with DisplayPort, VGA, and HDMI 2.0 ports, supporting triple simultaneous displays.Provides extensive storage options with five SATA 3 ports and eight high-speed USB 3.2 ports for peripheral connectivity.Includes one M.2 2280 slot (PCIe x4) for fast NVMe SSD storage, enhancing system boot and application load times.Designed with rackmount-optimized placement and positive airflow for enhanced thermal performance in server environments.Ensures reliable operation in industrial environments with an ambient operating temperature range of 0 ~ 60°C (32 ~ 140°F).
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Product
PCIe End Point IP Core
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The Arasan PCI Express End Point is a high-speed, high-performance, and low-power IP core that is fully compliant to the PCI Express Specification 1.1 and 2.0. The IP core is designed for applications in computing, networking, storage, servers, wireless, and consumer electronics. The feature-rich IP core is highly configurable that allows a target design to be implemented with the least number of gates and highest performance.
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Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
Processor Blade
- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Product
3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade
MIC-3332
Processor Blade
MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.
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Product
Drum Core Inductors
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Drum core inductors are so named as the conductor (round magnet wire) is wound directly onto the ferrite core which is shaped like a drum or spool. The wire is then connected to the core, a plastic base or metal lead frame to form the surface mount termination. Drum core inductors come in unshielded (high saturation current but potentially more EMI) and shielded constructions (lower saturation current but closed magnetic path for lower EMI). The shielded constructions use either a second ferrite core or a magnetic resin epoxy to create the magnetic shield.
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Product
8th Gen. Intel® Core I7/i5/i3/Celeron 3.5" SBC W/ MIOe
MIO-5373
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8th Gen. Intel Core Processor with Quad/Dual Cores, TDP 15WDual Channel DDR4-2400 up to 32GB, onboard eMMC up to 64GBTriple simultaneous displays by 48-bit LVDS/eDP+HDMI+DP2 GbE, 4 USB3.1, CAN Bus, M.2 M-Key 2280 supports NVMe, DC-in 12-24VSupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
Load Testing for Evolved Packet Core (ePC/VePC)
Flare
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Linkbit Flare is designed for load testing of Evolved Packet Core (ePC) networks, and the upcoming VePC deployments. It is based on the technology initially develped for Linkbit functional testers, and as a result is extremely flexible.
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-506
Motherboard
Supports Intel® 8th/9th Gen Core i7/i5/i3 processor with H310 chipsetSupports up to 14 COM, 8 USB 3.0, 12 USB 2.0, TPM 1.2/2.0 (optional)Supports Dual display of VGA, DP, DVI, eDP, LVDS (optional) and two GbE LANTwo DIMM sockets support up to 64 GB DDR4 2666 MHz SDRAMSupports WISE PaaS/Device-On, McAfee, Acronis, Edge AI Suite and Embedded Software APIs
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Product
Intel® Core™ I3-N305 Processor And Intel® Processor N-Series 3.5" SBC
MIO-5154
Single Board Computer
Intel® Core™ i3-N305, N-series N97 and N50Single Channel DDR5-4800 up to 16GB3 independent display: LVDS + HDMI + DPDual GbE, 6 USB, 6 COM, SMBus/I2CExpansion: M.2 E-Key 2230, M.2 B-Key 2280 & 3052Supports iManager & Software APIs, WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
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The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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Product
Soft Magnetic Core Power Loss Analyzer
SS-SML01
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This SS-SML01 soft magnetic core power loss analyzer includes one set broadband power signal generator and on set W-A-V meter, the broadband power signal generator is specially researched and manufactured for the testing of the soft magnetism materials.
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Product
THIN AI Motherboard 12th Gen Intel® Core™ Processor (Alder Lake), MXM GPU Integration
AIMB-288E
Motherboard
12th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport Intel Arc Embedded MXM GPU or NVIDIA Quadro Embedded MXM GPUUp to 64GB DDR5 4800 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 B-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale





























