Common Core
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Product
ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™, Xeon® E Processor, Intel® C246, USB 3.1 Gen2, SATA 3.0, PCI Express Mini Card Slot, VGA, DisplayPort, DVI-D, And HDMI
IMB525
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3, Xeon® E, *Pentium® or Celeron® processor (Coffee Lake)*Four 288-pin DDR4-2666/2400 ECC DIMM for up to 64GB of memory*DisplayPort, DVI-D, HDMI and VGA with triple-view supported*6 SATA-600 with RAID 0/1/5/10*1 PCI Express Mini Card slot (optional)*2 USB 3.1 Gen2 and four USB 3.1 Gen1*TPM 2.0 supported (optional)
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Product
Fanless Embedded System With 4th Gen Intel® Core™ Processor For Railway PC
tBOX322-882-FL
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The tBOX322-882-FL fanless railway embedded PC is based on 4th generation Intel® Core™ i7 or i3 processor with wide temperature capability from -40°C to +70°C. Certified with EN50155, EN50121 and complied with the standard of railway vehicles fire protection – PrCEN TS 45545-2, the railway PC is well suited for IoT & M2M-related applications such as onboard devices controller, train management, gateway, security surveillance and rolling stock environments. To keep all cables tightly secured, the railway pc has standard M12 connectors for Ethernet ports, USB ports, power input, and audio port. What is notable is that the graphics performance is now merely up to two times higher than previous generation, with the latest quad core processor, allowing faster and better information display.
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Product
Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3102 with Intel MXM GPU
Industrial Computer
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
15.6" Fanless Widescreen Panel PC With Intel® 13th Gen Core™ I7/i5/i3 Processor
PPC-415W
Panel PC
15.6" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i7-1365URE/i5-1345URE/i3-1315URE processor with fanless system designSupports PCIe x4 or PCI expansion1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology3 x Independent displays1 x M.2 bay (2242/2280) for storage onlySupport TPM2.0 hardware security
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione 640 OEM Series
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The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution. The NETD is less than 40 mK (available upon request) or 50 mK. The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low. All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, HDMI/LVDS And LAN
PICO512
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The PICO512 is designed to support the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U. Coming with one 260-pin DDR4-2133 SO-DIMM socket supporting system memory up to 16 GB, the Pico-ITX motherboard also features a PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors for an additional I/O board/signals. It supports a 4K visual experience with dual display outputs through HDMI and LVDS. Pico-ITX SBC can withstand a wide operating temperature range from -20°C to +70°C.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
Computer on Module
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
500 MHz 60 V Common Mode Differential Probe
DL05-HCM
Differential Probe
60 V of common mode and 80 V differential input range with 1 GHz of bandwidth, make these probes ideal for lower voltage GaN power conversion measurements. The 60 V of common mode is well suited for handling any float of the battery and bulk/absorption voltage during charging, while the 80 V differential input range provide margin for any overshoot.
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Product
Load Testing for Evolved Packet Core (ePC/VePC)
Flare
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Linkbit Flare is designed for load testing of Evolved Packet Core (ePC) networks, and the upcoming VePC deployments. It is based on the technology initially develped for Linkbit functional testers, and as a result is extremely flexible.
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Product
2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC962-512-FL
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The IPC962-512-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) with the Intel® Q170 chipset. It is equipped with dual DDR4-2133 SO-DIMM slots with up to 32GB system memory. The ultra-compact industrial computer supports two swappable 2.5" HDDs; moreover, it offers flexible expansion options with one I/O module slot and two PCI/PCIe slots. It also has a wide operating temperature range of -10°C to +60°C and a 24VDC (uMin=19V / uMax=30V) power input for severe environments. According to the features above, this rugged IP40 industrial PC is a great choice for a wide variety of Industrial IoT applications including automatic optical inspection, digital signage, motion control, and factory automation.
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Product
LGA 1700 Intel® 12th Gen. Core™ MicroATX Server Board with 4 x DDR5, 3 x PCIe (1 x Gen 5, 2 x Gen 4), 6 x USB 3.2, 5 x SATA3, Quad/Dual LANs, and IPMI
ASMB-588
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and two PCIe x4 (Gen 4) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
15.6" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-315W TGL
Panel PC
Industrial-grade 15.6" FHD LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive contrHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 1Support TPM2.0 hardware security
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Product
15" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315S RPL
Panel PC
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
10th Gen Intel® Core™ Processor LGA1200
AIMB-277
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Supports 10th Generation Intel® Core™ i processor (LGA1200) with Intel Q470E chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAMSupports triple display of HDMI 2.0a/DP++/VGA/LVDS( or eDP)Supports PCIe x16 (Gen 3), 1x M.2 M key + 1x M.2 E key, 4x USB 3.2 Gen2 + 4x USB 3.2 Gen1, and 4x SATA IIISupports Intel vPro, AMT, Software RAID 0,1,5,10, TPM 2.0, 3.2W AmplifierSupports ATX powerSupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API and WISE-DeviceOn
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Product
LGA 1700 Intel® 12th Gen. Core™ Proprietary Server Board with 4 x DDR5, 1 x PCIeX16, 2 x PCIeX4, 5 x USB 3.2, 4 x SATA 3, Quad LANs and IPMI
ASMB-610V3
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- Compatible with HPC-61 series chassis- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 slot or two PCIe x8 slots support FH/10.5" Length Cards- Two PCIeX4 slots support low profile expansion cards- 4 x SATA 3 ports and 5x USB 3.2 ports- One M.2 2280/22110 (SATA / PCIe compatible)- Quad LAN with Intel I350- Flexible IO board design
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Product
Compact Fanless System With 10th Gen Intel® Xeon®/Core™ I CPU Socket (LGA 1200)
MIC-770 V2
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Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipsetWide operating temperature (-10 ~ 60 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports Advantech i-Modules, FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IOVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)Microsoft Azure PnP, AWS IoT Greengrass, Ubuntu CertifiedRED Compliance
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Product
Fanless Embedded System With Intel® Core™ I7-6600U/i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LAN, 4 USB 3.0, 2 COM And PCI Express Mini Card Slot
eBOX560-500-FL
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The eBOX560-500-FL is an Intel® Skylake-based fanless embedded system with compact size and full-featured I/O interface. To bring both excellent performance and ultra-low power consumption, the palm-sized embedded box PC is powered by the 6th generation Intel® Core™ i7-6600U or Celeron® 3955U processor (formally codename: Skylake). One 260-pin DDR4-2133 SO-DIMM socket with system memory up to 16 GB is available. The power efficient IP40 embedded system supports 12V DC input with screw-lock and features a user-friendly AT/ATX DIP switch. The compact eBOX560-500-FL is suitable for Industrial Internet of Things (IIoT) solutions, digital signage, retail equipment, smart factory automation, thin clients, industrial controller systems and many more.
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Product
Single and Dual Core Digital Signal Processor
SI-C665xDSP
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The SI-C665xDSP from Sheldon Instruments is a C programmable Digital Signal Processor (DSP) card designed for low power environments that require intensive computing in a cost sensitive solution.
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
Computer on Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
Industrial Computer
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
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The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Front-access I/O, PCIe And PCI Slots
IPC962-511-FL
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The IPC962-511-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) up to 65 W with the Intel® H110 chipset, featuring high performance capability. The ultra-compact industrial computer provides flexible expansion options with one I/O module slot and two PCI/PCIe expansion slots. It has a wide operating temperature range of -10°C to +60°C, and is equipped with a wide range 19V - 30V DC power input for mission-critical environments. The ruggedized industrial PC has a creative modular design with rugged mechanisms and optimized expandability. To meet different customization requirements, it has an optional I/O module slot and three different types of I/O modules. The choices, include a 4-port isolated RS-232/422/485 module; isolated 8-in/8-out DIO module; 2-port isolated RS-232/422/485 and 4-in/4-out DIO module, can provide system integrators with a less cabling solution for a lower total cost of ownership. Additionally, the compact industrial PC provides two flexible PCI/PCIe expansion slots with three different combinations of AX96205, AX96206, AX96207: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; 2 PCI.
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Product
Intel® Core™ I3 And Core™ 3 And Atom® X7000E/x7000RE Processor
AIMB-219 B1
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Intel® Core™ i3, Core™ 3 Processor and Atom® x7000E/x7000RE ProcessorUp to 16GB DDR5 4800MT/s with one SO-DIMMTriple independent display with 1 DP, 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMMini-ITX low profile motherboard, fanless designSupports Device-On and Embedded Software APIs
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Product
Common Electromechanical Universal Testing Machine
WDW-D series
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Jinan Testing Equipment IE Corporation
WDW series computer control electromechanical universal testing machines (UTM) is designed according to ASTM, ISO, DIN, EN standards etc.. It is computer-controlled and precision. Our electromechanical universal testing machine (UTM) is widely suitable for metallic and nonmetallic materials for tension, compression, bending, shearing and low cycle test. The electromechanical universal testing machine features as high precision, high stability and high reliability. Graph, test result display, data processing and printing can be done easily by its PC system and printer. Completed with modulus for metal, spring, textile, rubber, plastic and other material test, our electromechanical universal testing system is widely used in many fields such as industry factories, research and development, test institutes and training centers etc. WDW common series electromechanical universal testing machines (UTM) adopt rigid load frames, accurate load weighting system, advanced PCIE measuring & control system and intuitive modular application software. Configured with wide range of accessories for applications, the materials universal testing machines (UTM) can provide the best testing solutions for your individual application needs. With 20 years’ experience of materials testing industry and based on abundant application knowledge, we are completely capable of configuring the best solutions and more accurately testing systems for the manufacturers involved in load frame, core measuring and control elements, software package, grip/fixture that based on their specified test application and other requirements.
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
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The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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Product
COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
PICMG 1.3 Full-size CPU Card With LGA1151 7th/6th Gen Intel® Core™ Processor, Intel® Q170/H110, SATA3, USB 3.0, Dual LAN And DVI-I
SHB140
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The SHB140 PICMG 1.3 single board computer is based on the 14nm 6th generation Intel® Core™ i7/i5/i3 processors in the LGA1151 package with Intel® Q170 Express chipset (codename: Skylake). The high performance SHB-based CPU card comes with two DDR4 2133/2400 MHz up to 32GB and six SATA-600 ports with RAID 0/1/10/5. Combined high-bandwidth PCI Express for frame grabbing and conventional PCI expansion for motion capture, the SHB140 is an optimum solution for machine vision and automation applications. This high performance PICMG 1.3 slot CPU card also features an integrated Intel® AMT 11 and TPM 1.2 for higher security and easier maintenance.
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Product
3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
OpenVPX
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
