Common Core
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Product
802.1 Core Test Software
IOL vIOLett®
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The same tool used for testing everyday in the UNH-IOL Ethernet Switching Protocols (ESP) Testing Services is now available to use in your own labs. See the below list of available testing packages. Each test package contains a complete set of tests for use with IOL vIOLett® Software, which is included with any test package license.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
Industrial Computer
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Product
17" SXGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-317
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Industrial-grade 17" SXGA TFT LCD with 50K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Dual channel memory slots support up to 64G in total.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Support expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G).Diverse system I/O and isolated digital I/O via iDoor technology.Support fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology.Support TPM2.0 hardware security.
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Product
NXP I.MX8M Plus Quad Core Processor Based IIoT Gateway Platform
MXA-200
IoT Gateway Platform
MXA-200 is an i.MX8M Plus based high-performance IoT gateway, which has an open platform design with Quad Core processor, two RS-232/422/485 isolated serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 port and operating temperature range of -20~70°C. It offers two M.2 slots for integrating Wi-Fi/4G/5G modules. MXA-200 enables system integrators to develop applications precisely for renewable energy, EV charger, smart city and factories which require massive data collection, cloud based application and video related monitoring solutions.
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Product
Intel Core Next Gen 3.5" SBC
MIO-5356
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3 simultaneous displays: LVDS + HDMI + USB-C with DP Alt.3x M.2 Expansions: E-Key 2230, B-Key 3052, M-Key 2280Support EdgeBMC for OOB(Out-of-Band) remote control management
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Product
Ultimate Performance Gaming Platform Based on 7th Generation Intel® Core™ Processors Supports up to 11x Independent Displays Including 4K UHD
ADi-SA1X-KB
Gaming Platform
- Ultimate " all-in-one" gaming platform- The best-in-class graphics capabilities in games with high levels of detail- Up to 11x independent HD monitors supporting 4K UHD- Advanced security feature set and software solutions- Intelligent middleware shortens development time- Various power supply options- Low-power consumption
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Product
10" Rugged Tablet With Intel® Core™ I3/i5/i7/Celeron® Processor
PWS-872FL
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7th generation Intel® Core™ i3/i5/i7/Celeron® processor with integrated Intel® Turbo Boost technology10.1" high-brightness WXGA and WUXGA LED display with scratch-resistant Corning® Gorilla® Glass 3 panelMulti-touch PCAP touchscreen with support for gloved operationRugged design with MIL-STD-810G certification, IP65 rating, and 4-ft. drop toleranceWiFi 6, 4G LTE, Bluetooth 5.2, and GPS modules with BeiDou/GLONASS supportBuilt-in front and rear cameras, 1D/2D barcode scanner, and NFC RFID readerHot-swappable battery supports up to 11 hours operationMicrosoft® Windows 10 IoT LTSC OSOptional peripherals include vehicle docking station, desk docking station, and multiple extension modules
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Product
3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade
cPCI-3520 Series
Processor Blade
The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.
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Product
Highly Scalable Gaming Platform Based On 12th Gen Intel® Core™ Processors Supports Up To Eight Independent Displays Including 4K UHD
ADi-SA3X-AD
Gaming Platform
ADLINK‘s ADi-SA3X-AD all-in-one gaming platform features powerful processing and graphics performance for gaming and retail. Equipped with 12th Generation Intel® Core™ processors, the ADi-SA3X-AD provides compelling graphics performance from a PCI Express 3.0x16 discrete graphics card and/or an embedded Intel® Iris® Xe supporting up to eight independent monitors.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
Iron Core Current Limiting Reactors
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Current Limiting Reactor (CLR) is one of the most effective short circuit current limiting devices. It reduces stresses on busses, insulators, circuit breakers and other high voltage devices. Use of CLR is the most practical and economical approach at current limiting.
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Product
3U 7th Generation Intel® Core™ i5-7440EQ Processor-Based PXI Express Gen3 Controller
PXIe-3977
Controller
The ADLINK PXIe-3977 PXI Express embedded controller, based on the 7th gen Intel® Core™ i5 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
High-Performance Gaming Platform Based on 8th/9th Gen Intel® Core™ Processors Supports up to Seven Independent Displays Including 4K UHD
ADi-SA2X-CF
Gaming Platform
ADLINK‘s ADi-SA2X-CF all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 7th Generation Intel® Core™ processors, the ADi-SA2X-CF provides compelling graphics performance from a PCI Express 3.0 x16 discrete graphics card and/or an embedded Intel® UHD Graphics 630 together with multi-display support for up to seven independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA2X-CF fully satisfies the needs of your gaming application.
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione 640 OEM Series
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The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution. The NETD is less than 40 mK (available upon request) or 50 mK. The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low. All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
2U Rackmount Network Appliance Platform Based On Intel® Xeon® E3 Series And 6th/7th Generation Intel® Core™i7/i5/i3 Processors
FWA-4130
Network Appliance
Intel® Xeon® E3 Series and 6th/ 7th Generation, Intel® Core™i7/ i5/ i3 Processors4 x DDR4 2133/ 2400MHz ECC UDIMMs, up to 64GB4 x Advantech network module expansions1 x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2 x 3.5" HDD bay, CF slot (optional)IPMI2.0 compliant remote management (optional)
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Product
High-Performance Gaming Platform Based On 12th Gen Intel® Core™ Processors Supports Up To Eight Independent Displays Including 4K UHD
ADi-SA2X-AD
Gaming Platform
ADLINK's ADi-SA2X-AD all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 12th Generation Intel® Core™ processors, the ADi-SA2X-AD provides compelling graphics performance from a PCI Express 4.0x16 discrete graphics card and/or an embedded Intel® UHD Graphics 770 together with multi-display support for up to eight independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA2X-AD fully satisfies the needs of your gaming application.
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Product
COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
Computer on Module
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Product
2U Rackmount Network Application Platform Base On Intel 12th/13th/14th Gen Intel® Core Processors. Ideal For Data Center Deployments.
FWA-4134
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency Cores4 x DDR4 3200MHz ECC UDIMMs, up to 128GB4/8 x Advantech network module expansions1x Mini-PCIe slot1x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2/4 x 3.5” HDD bays
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Product
Intel Core I Platforms
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Embedded Mini-ITX motherboards with Intel LGA115x Socket, Mobile BGA and ULT Core™ I / Pentium/ Celeron Series Processor, Up to 65W TDPs.
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Product
PXI/PXIe RF Multiplexer, Single 4-Channel, Terminated Common, 3GHz, 50Ω, SMB
42-876A-001
Multiplexer Module
The 40-876A-001 (PXI) and 42-876A-001 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 1 bank in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module exhibits low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost.
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Product
6U CompactPCI 6th/7th Gen Intel® Xeon® E3 and Core™ i3/i7 Processor Blade
cPCI-6636(KL) Series
Processor Blade
The ADLINK cPCI-6636 Series is a 6U CompactPCI® processor blade based on the 6th/7th Generation Intel® Xeon® E3 and Intel® Core™ i3/i7 Processors with Intel® HM170 or CM236 Chipsets. The cPCI-6636 supports up to 16GB onboard DDR4-2133 memory and 16GB DDR4-2133 via SODIMM. Total memory capacity is up to 32GB of DDR4-2133. The cPCI-6636 is a highly integrated processor blade fit for mission critical applications in industries ranging from automation to defence.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Product
Intel Core Series - Medium Branch
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Rackmount Network Appliances with Intel® Core™ Family for NFV and SD-WAN.
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Product
Compact Fanless System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-770 V3
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Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipsetWide operating temperature (-20 ~ 60 °C)2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power rangeIP40 dust proof for deployment in harsh environmentSupports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IOSupports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIsSupports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Modular TPC - Computing Box Module With Intel® Core™ I3-N305 Processor
TPC-B520L
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Modular Computing Box powered by Intel® Core™ i3-N305, octo-core processorModular Front Panel modules ranging from 12.1" to 23.8" with P-CAP multi-touch in selection (12.1", 15", 15.6", 21.5" with high brightness panel option)Single DDR5 Memory slot supports up to 16GBSupport expansion via three M.2 slots (PCIe, Wifi, 5G)LAN, POE, isolated serial port and isolated digital I/O via iDoor technologySupport Type-C connector with USB 3.2, DP 1.4a, 15W power deliverySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologyPerformance, fanless embedded system with chassis grounding protection
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Product
Edge AI Compact Box PC With Intel® Core™ Ultra Processor (Series 3)
UNO-258
Box PC
Intel® Core™ Ultra series 3 processors (code name: Panther Lake H) with 25W and 45W TDP supportIntegrated AI acceleration providing up to 180 TOPS total AI performance (120 GPU + 50 NPU + 10 CPU)Xe3 GPU architecture providing up to 2× the graphics performance compared to Arrow Lake-HDual-channel DDR5 SO-DIMM memory supporting up to 128GB (64GB per channel)M.2 E-Key, B-Key, M-Key (supports NVMe) expansion for storage, LTE/5G, and Wi-FiBuilt-in 1000Mbps & 2500Mbps LAN ports with TCC and TSN supportModular I/O board design offering dual LAN or isolated DIO/CANBUS/COM
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Product
Shortwave Infrared Camera Core
Tau® SWIR
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FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Product
IC-3172, 1.80 GHz Intel Core i5 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784228-01
Controller
The IC‑3172 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3172 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
ARINC 818-2 IP Core
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iWave’s ARINC IP core is ARINC 818–2 compliant offering point-to-point, high-speed, low latency video transmission. This IP core can be implemented on any transceiver-based FPGA device. It can be used for both transmit and receive applications. This core supports configurable ADVB video formats and uses a simple streaming interface to interface with video & image processing IP cores supported by FPGA vendors.
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Product
Ultra-compact thermal imaging core
Dione 1024 CAM Series
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The Dione 1024 CAM series is based upon the Dione 1024 OEM thermal imaging core with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz.Dione 1024 CAM is a LWIR uncooled thermal imaging SWaP module with housing supporting M34/M45 lens (optional).Dione 1024 CAM series benefit from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and the availability of multiple lenses (optional) provides a high level of tunability for optimal integration into many systems.The compact Dione 1024 CAM series find applications in safety and security, transportation and industrial process monitoring.
