Product

Coupler Workstations

-

Lightel Technologies, Inc.

Lightel Technologies, Inc.

Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.

Product

Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase

Q-400 TCT

-

Dantec Dynamics A/S

Q-400 TCT - Dantec Dynamics A/S

The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.

Product

Horizontal Dilatometers

-

TA Instruments

TA Instruments

TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.

Product

Expansion Board

MSXB 044

-

Microstar Laboratories, Inc.

MSXB 044 - Microstar Laboratories, Inc.

The MSXB 044 expansion board works with the iDSC 1816 to add signal conditioning to the data acquisition and anti-aliasing capabilities. Four MSXB 044 boards are included in each MSSC-8 module. Purchase the MSXB 044 as part of a complete SCS system: an enclosure and 1, 2, 3, or 4 MSSC-8 modules, for a total of 8, 16, 24, or 32 channels.

Product

Expansion Card

PMC238

-

Abaco Systems Inc

PMC238 - Abaco Systems Inc

The PMC238 is a 6U form factor card that expands a single PMC site on a VMEbus processor board to two PMC sites and one PCMCIA/CardBus socket or to three PMC sites. Compatible with many VMEbus single board computers, it provides an extension of PCI and PCMCIA capacity within the VMEbus form factor. The PMC238 has the option for the PCMCIA/CardBus cards to be mounted outside the chassis using an 18-inch cable.

Product

Digital Expansion Board

MSXB 013

-

Microstar Laboratories, Inc.

MSXB 013 - Microstar Laboratories, Inc.

Digital Expansion Boards. The MSXB 013 Digital Input/Output Expansion Board expands 16 digital input lines and 16 digital output lines to 64 digital input lines and 64 digital output lines.

Product

X Expansion Boards

-

ICP DAS USA, Inc.

ICP DAS USA, Inc.

The X series expansion boards are the ultimate solution for existing 7188 owners who would like to upgrade the capabilities of their controller for new or revised use. With over 75+ different X boards available, users can add everything from additional COM ports, digital and analog I/O, additional memory, to high speed counters or 2~3 axis motion control encoders!

Product

GPU Expansion I-Module

MIC-78MG30

-

Advantech Co. Ltd.

MIC-78MG30 - Advantech Co. Ltd.

1 x PCIe x16 Gen51 x PCIe x2 Gen31 x PCIe x4 Gen3Supports 250W GPU cards

Product

Thermal Testing

-

Pacific Testing Laboratories

Pacific Testing Laboratories

A view of multiple testing stations for use in conducting Thermal Analysis on various materials. This is one of several areas assigned to various thermal tests. Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), Thermomechanical Analysis (TMA), and Dynamic Mechanical Analysis (DMA)

Product

Analog Expansion Board

MSXB 014

-

Microstar Laboratories, Inc.

MSXB 014 - Microstar Laboratories, Inc.

The MSXB 014 Analog Expansion Board provides 4 additional analog outputs. Up to 16 Analog Output Expansion Boards can be connected to a single DAP for a total of 64 additional output channels.

Product

RS-485 I/O Expansion Racks

-

ICP DAS USA, Inc.

ICP DAS USA, Inc.

RU-87Pn I/O expansion units are used to expand I-87K series I/O modules via the RS-485 interface. They are equipped with one power module, one RS-485 interface, one CPU module and several I/O slots. High profile I-87K series I/O modules can be plugged into the unit. RU-87Pn series I/O Expansion Racks have auto configuration. Each slot configuration can be pre-configured and stored in the CPU module. Once a module is plugged in, the CPU module will write the pre-configured data to the module. They are also hot swappable.

Product

FlexRay Communications Expansion Kit

OP-SB88

-

LINEEYE Co., Ltd.

OP-SB88 - LINEEYE Co., Ltd.

The FlexRay communication is anticipated as a next-generation high-speed in-vehicle network.The OP-SB88 is an expansion kit that allows monitoring of FlexRay communications on up to two channels in real time. The kit incorporates a monitor function that does not require complicated parameter settings, and a simulation function with which the OP-SB88 works as a FlexRay communications node to transmit and receive data, thus powerfully supporting the initial development. The filter function and high-capacity memory greatly shorten the analysis time of trouble.

Product

Thermal Conductivity Analyzers

-

Teledyne Analytical Instruments

Teledyne Analytical Instruments

Thermal Conductivity Analyzers by Teledyne Analytical Instruments

Product

Thermal Shock Chambers

-

ACE Technology Limited

ACE Technology Limited

The chamber is divided into 3 parts:Hight temperature zone, low temperature zone, and the testing zone. Special heat isolating structure and preserve cold and heat treatment.

Product

Thermal Testing And Analysis

-

Response Dynamics Vibration Engineering, Inc.

Response Dynamics Vibration Engineering, Inc.

We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.

Product

Thermal Load Boards

-

Thermal Engineering Associates, Inc.

Thermal Engineering Associates, Inc.

A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.

Product

Serial I/O Expansion

PCM-G-COM8

-

WinSystems, Inc.

PCM-G-COM8 - WinSystems, Inc.

The PCM-G-COM8 is an 8-channel PC/104-compatible serial module. It is well suited for embedded applications requiring a large number of serial I/O ports. Each channel supports RS-232, RS-485, and RS-422 electrical levels to interface to a wide variety of serial communications devices such as modems, data collection equipment, and distributed I/O terminals. The PCM-COM8 will operate over the full industrial temperature range of -40° to +85° Celsius.