Thermal Expansion
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Product
Horizontal Dilatometers
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TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Product
Coupler Workstations
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Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Product
IDoor Module: 2-Port Hilscher NetX100 FieldBus MPCIe, EtherNet/IP, RJ45
PCM-26R2EI
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Meets Advantech Standard iDoor TechnologyPCI ExpressR Mini Card Specification Revision 1.2 compliantIdentical interface for all Hilscher Real-Time Ethernet Fieldbus ProtocolsVarious colorful front plates for protocol identificationEasy integration by wide range of device driversHigh extended temperature range up to 70°CCompatible with embedded automation PC UNO-1/2/3/4 series
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Product
4-Slot Expansion I-Module With 1 PCIe X16, 3 PCI
MIC-75M13
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1x PCIEx163x PCI1x SATA (2x 2.5" HDD bay)Support 1x 8cm FAN (Optional)Dimension (W x H x G): 90 x 192 x 230 mm
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Product
I-Module With 1 X PCIex16, 3 X PCI
MIC-78M13
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1 x PCIEx161 x PCESupport 1 x 8cm FAN (Optional)Support additional 2.5" HDD/SDD kitDiemension with MIC-780 : 173 x 195 x 255 (mm)
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Product
IDoor Module: 2-Port Hilscher NetX100 FieldBus MPCIe, EtherCAT, RJ45
PCM-26R2EC
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Meets Advantech Standard iDoor TechnologyPCI ExpressR Mini Card Specification Revision 1.2 compliantIdentical interface for all Hilscher Real-Time Ethernet Fieldbus ProtocolsVarious colorful front plates for protocol identificationEasy integration by wide range of device driversHigh extended temperature range up to 70°CCompatible with embedded automation PC UNO-1/2/3/4 series
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Product
4-Ch PWM Lighting Control For AIIS Vision System
AIIS-1882
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Designed specifically for machine vision applications4-ch lighting control output with trigger inputProgrammable delay time, PWM high/low time, and output lighting durationUp to 350 mA and 40 VDC digital output capability by external power12-ch isolated digital input and 16-ch isolated digital outputSoftware configurable digital filter for isolated digital input and triggerSoftware selectable sink (NPN)/source (PNP) type for isolated digital output2,500 VDC isolation protection for all I/O signals
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Product
Regular Flex I/O For Reset, Remote Switch And 5VDC
98R17500801
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Flex I/O expansion on the front panel for same-side cablingCompatible with MIC-7300, MIC-7500, MIC-7700, MIC-770, MIC-7900
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Product
MXM GPU Expansion Module
MIC-75GF10
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Support NVIDIA MXM GPU with whole system fanless designSupport up to 80W NVIDIA Quadro MXM 3.1 Type A/B form factor GPU1 x HDMI and 3 x DisplayPort 1.4a display outputOperating Temp. -10~50CSupport 1Grms Op. vibrationDual front removable 2.5" storage bay for easy swapIP40 fanless ruggedized compact size designMIC-7 Series compatible
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Product
Regular Flex I/O For Remote Switch
98R17500401
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Flex I/O expansion on the front panel for same-side cablingCompatible with MIC-7500, MIC-7700, MIC-770, MIC-7900
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Product
Regular Flex I/O For COM Port
98R17500601
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Flex I/O expansion on the front panel for same-side cablingCompatible with MIC-770
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Product
PCI Express X4, 2/4-Port GbE Expansion Card
PCE-GIGE
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Intel Ethernet Controller i210, Supports Wake-on-LAN function, Supports two or four GbE LAN ports. Supports PXE function, PCI Express x4 interface.
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Product
Thermal Imaging
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Transcat is an industry-leading supplier of thermal imagers and infrared cameras for every application, ranging from building or HVAC diagnostics and spot temperature measurement to complex and operation-critical industrial preventative maintenance and energy loss analysis. Our featured thermal imaging brands, Fluke and FLIR, continue to expand their diverse range of product offerings with new and innovative cameras at every price level.
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Product
Thermal Imaging
JOHO272
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Wuhan JOHO Technology Co., Ltd
With innovative design and superior functions, this thermal weapon sight sets a new standard to build in an eye-safe laser ranger finder which you can get target distance very easily. The thermal aiming and laser ranging scale line would be changing smaller as distance further so that the shooter would easily and quickly lock target even in a further distance. To improve shooting percentage, as many as ammunition drop chart can be input to the sight program. Should any drop chart be selected, the sight would automatically generate a new shooting scale line after program calculating temperature, angle, wind speed, altitude. Different button size and battery convex design friendly for shooter night us
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Product
Expansion Adapter Chassis
TB3-TO-CMC-LP
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The TB3-TO-CMC-LP is an expansion adapter chassis using the Intel Thunderbolt 3 interface. The adapter allows the use of a front I/O XMC or PMC card outside its normal confines of a single board computer (SBC) or PC hosted carrier card. The TB3-TO-CMC-LP enables the deployment of XMC or PMC modules in systems previously unable to host them -- laptops, small form factor PCs, and other computers lacking add-in slots.
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Product
Thermal Camera
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Shenzhen UYIGAO Electronic Technology Co., Ltd
This is an infrared thermal imager that combines the functions of surface temperature measurement and real-time thermal imaging. The traditional thermal imaging camera needs to measure each component one by one, while this instrument does not need to. Therefore, it helps to save your time. Even the potential problems can be clearly displayed on the color screen which helps users quickly locate the central point to measure cursor and temperature.
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Product
TTL/I2C/SPI Expansion Kit
OP-SB85L
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OP-SB85L is the interface expansion kit that has a port to measure TTL / CMOS signal level communications, and the one to measure the voltage of high-speed analog input. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communication between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI on monitoring and simulating.
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Product
PMC/XMC Expansion Card
EXP238
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The EXP238 is a 6U VMEbus form factor expansion card offering three XMC/PMC expansion sites. When ordered as an option for the XVB603 VMEbus single board computer, the 3-slot solution greatly expands system flexibility.
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Product
Thermal Imagers
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Klein Tools’ thermal imagers allow electricians, plumbers, HVAC professionals, home inspectors and other trade professionals to verify systems and troubleshoot problems needing maintenance based on hot and cold spots displayed on LCD.
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Product
Fixed-Mount Thermal Camera
FLIR Axxx-Series Smart Sensor
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The FLIR Axxx-Series Thermal Smart Sensor Camera has the features automation solution providers need for complex monitoring applications, including critical infrastructure, product quality, and early fire detection. The Smart Sensor configuration includes multiple measurement tools and alarms while also providing computing-on-the-edge, with analytics performed at the camera level for immediate results. With a range of lens choices, motorized focus control, and unrivaled connectivity, A400/A500/A700 cameras offer unmatched power and flexibility. Easy configuration allows you to tailor this monitoring system to your company’s quality, productivity, maintenance, and safety needs.
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Product
Thermal Conductivity Analyzer
TCi
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The default C-Therm TCi Thermal Conductivity Analyzer employs the Modified Transient Plane Source (MTPS) technique in characterizing the thermal conductivity and effusivity of materials.
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Product
Thermal IR Camera
LIR320
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*LIR320 is the perfect system for IIoT and Machine Vision applications.*With a resolution of 320×240 pixels and state-of-the-art pixel pitch of 12 μm, it is offered with two optical options, 4 mm and 9.1 mm, giving you calibrated, high-quality thermal images, at a frame rate of 27 Hz.*The camera LIR320 is a cost-effective imaging solution that provides maximum performance in multiple industry applications.
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Product
Thermal Management Solutions
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AMS Technologies has a long track record of developing and manufacturing thermal solutions for customers – suitable for applications like: *Reagents Cooling *Laser Cooling from 0,2 to 3 kW *Small Cabinet Cooling *Wide Range Temperature Stabilization Covering -60°C to +180°C *Compact Dehumidifying*and many more.Some of AMS Technologies’ thermal management solutions may be used as an OEM kit for integration into your application as well. Currently available are thermal management solutions for direct cooling (a mounting plate that is temperature stabilized), air cooling and liquid cooling.
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Product
Thermal Testing And Analysis
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Response Dynamics Vibration Engineering, Inc.
We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.
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Product
Thermal Transport
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The thermal transport probe measures thermal conductivity and thermoelectric power (defined by the Seeback Coefficient). Electrical and thermal contacts are made to opposite ends of the sample allowing for customisation to suit the sample requirements of the user.
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Product
Field thermal needle system for thermal resistivity / conductivity measurement
FTN01
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Hukseflux Thermal Sensors B.V.
The FTN01 Field Thermal Needle System allows performing fast, on-site measurements of the thermal resistivity or conductivity of soils, in particular around the typical depth of burial of high voltage cables. FTN01 is designed with a focus on robustness and saving time, while still offering sufficient accuracy for typical field measurements. The sensor is a Non-Steady-State Probe (NSSP), TP09, which is mounted at the tip of the Lance LN01. The system is operated using a hand-held Control and Readout Unit CRU01.
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Product
Thermal Platforms
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Thermal Platforms are perfect for using conductive transfer to test components hot and cold, they work best for parts with a low or flat physical profile. They transfer heat outstandingly for programmed or very rapid heating and cooling transition times (that’s why they’re called hot plates or cold plates as well), and have a precise temperature control every time from cryogenic temperatures to extremely hot
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