Thermal Expansion
-
product
MSX® Thermal Camera
FLIR TG165-X
The FLIR TG165-X helps you visualize the hot and cold spots that can indicate electrical faults, mechanical break-downs, or air and water leaks. This all-in-one, non-contact measurement and imaging tool displays temperature anomalies on screen, allowing you to inspect efficiently and pinpoint the source of problems faster than with a single-spot IR thermometer. See components clearly and even read labels thanks to FLIR patented MSX image enhancement, which adds visual details to full thermal images. The bullseye laser ensures you’re always targeting the right component for measurement while easy-to-use buttons and settings help you complete the job quickly and stress-free. With internal storage for up to 50,000 images and a rechargeable Li-ion battery, the FLIR TG165-X is ready to go right out of the box.
-
product
Semiconductor Thermal Analyzers
Analysis Tech Semiconductor Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement on all types of semiconductor devices.
-
product
Professional Thermal Imaging Cameras
PeakTech Prüf- und Messtechnik GmbH
Is a thermal imaging camera with a thermal resolution of 160x120 thermal image points with a high-quality sensor, which makes even the smallest temperature differences visible. All thermal images can be opened and evaluated using the enclosed software, with subsequent changes, e.g. can be done on the pallet selection. Use this new development to find thermal bridges in thermography, leaks in systems and pipe systems or track heating pipes in walls and floors.
-
product
Thermal Vacuum Chamber & Control
Based on several successful deliveries of complex DAQ systems, WinSoft was selected by 2 major satellite manufacturers to design and build a DAQ and Control systems which are connected to various thermal vacuum chambers - all connected to a central database.The chambers are used for environmental testing. The data collected by the DAQ system is recorded continuously every few seconds over a period of a few months.
-
product
Thermal Microscope Stage
TS-4MP
With our TS-4MP Thermal Stage, a specimen on a microscope slide or culture dish can be maintained at any temperature between -20°C and +60°C. Setup is easy, takes little time, and the controller will regulate the stage temperature to within +/-0.1°C
-
-
product
Thermal Warpage and Strain Measurement Tool
PS200S
The TherMoir PS200S is a metrology solution that utilizes the shadow moir measurement technique combined with automated phase-stepping to characterize out-of-plane displacement forsamples up to 150 mm x 200 mm. With time-temperature profiling capability, the TherMoir PS200S captures a complete history of a sample's behavior during a user-defined thermal excursion.
-
product
Thermal Software
ThetaCalc
Thermal Engineering Associates, Inc.
A tool designed to provide a quick estimate of the temperature and thermal resistance from a heat source to a reference heat sink. It also shows the temperature and thermal resistance value of each layer in the heat flow path. The program can accomodate up to ten layers of different materials of varying dimensions between the heat source and sink. The heat spreading angle can be set independently for each layer to a value between 0 and 45 degrees; the tool will automatically determine if heat flow reaches the layer edge and then convert to columnar flow.
-
product
PCIE Module For PCIe Bus Expansion
PCI113
PCI113 is VadaTech second generation PCIe expansion module. The PCI113 is a high-speed 20Gbps bridge from the host PCIe bus to VadaTech’s carrier and Rear Transition Module (RTM) products such as the ATC104/114/118/117/119, ART114, μTCA chassis, etc. The different carriers host different I/O modules such as PMC/PrPMC, AMC, PCI-X and PCIe edge modules. This concept allows any of the available I/O modules in these standard form factors to be integrated quickly and easily into an AdvancedTCA or μTCA subsystem. The PCI113 allows expansion among multiple μTCA chassis or expansion into other chassis that are not ATCA or μTCA based.The PCI113 is a single module PCIE based on the PCISIG specification. The PCI113 provides a PCIe x4 link infiber/copper via front panel QSFP. The dual front I/O allows expansion into two separate systems independently. The upstream port must not have spread spectrum PCIe clock enabled.
-
product
Thermal Desorption
Scientific Instrument Services, Inc.
The SIS Short Path Thermal Desorption units sit directly on top of a GC injection port to provide for the direct desorption of both volatile and semi-volatile samples into the GC injection port and column. Due to the "short path" of sample flow, these new systems overcome the shortcomings of previous desorption systems by eliminating transfer lines, which are easily contaminated by samples, and by providing for the optimum delivery of samples to the GC injector via the shortest path possible--the direct, syringe-like injection into the GC.
-
product
Compact, High-resolution Thermal Camera
Ceres V 1280 Series
The Ceres V 1280 series is based upon the Dione 1280 OEM thermal imaging core with 1280×1024 pixels and 12 µm pixel pitch and NETD of less than 40 mK (available upon request) or 50 mK. The camera offers superior thermal imaging capabilities, thanks to the state-of-the-art microbolometer detector and on-board image processing.The Ceres V 1280 camera outputs full frame images at 60 Hz via either a CameraLink or at 45 Hz via a GigE Vision interface – all GenICam compliant.The compact size Ceres V 1280 series offers excellent image quality and find applications in industrial machine vision, medical, scientific and security thermal imaging systems.The camera offers either a no lens configuration or with different HFOV (Horizontal Field-Of-View) options.Benefits & Features• Compact and high-resolution• Superior on-board image processing performance (optimized image quality)• GenICam compliant• Uncooled operation
-
product
Thermal Test Vehicles
TTV
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
-
product
FMC Expansion I/O Module.
SI-MOD32xx
The SI-MOD32xx is a family of high resolution, FMC form factor, high channel count multi function data acquisition and control modules that plug into any SI-DSP or FPGA carrier card.
-
product
Longwave Infrared Thermal Camera
FLIR A6750 SLS
The FLIR A6750 SLS longwave camera is the ideal choice for high-speed thermal events and fast moving targets. It offers extremely short integration times and windowed frame rates above 4,000 Hz, so you can freeze motion or achieve accurate temperature measurements on moving subjects. The 327,680 (640 x 512) pixel IR resolution and high sensitivity produce crisp imagery, well suited to electronics inspections, scientific research, and more.
-
-
product
Compact, Industrial Thermal Imaging Core
Dione 320 OEM Series
The Dione 320 OEM is based on a state-of-the-art detector with a 320×240 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 320 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 320 OEM series find application in industrial machine vision, medical, scientific and advanced research, safety and security systems.
-
product
Thermal Imaging Camera
Zhejiang ULIRvisionTechnology Co., LTD
A thermal imaging camera is a device that uses infrared and thermal imaging technology to convert the image of the temperature distribution of the target object into a visible image through detecting the infrared radiation of the target object and applying signal processing and photoelectric conversion. The thermal imaging camera accurately quantifies the actual detected heat and images of the entire object in real-time in the form of a surface, thus accurately identifying the suspected fault area that is heating. The operator initially judges the fever condition and the fault location through the image color and hotspot tracking display function displayed on the screen of the thermal imaging detector, and strictly analyzes it, thereby embodying high efficiency and high accuracy in confirming the problem.
-
product
2-Zone and 3-Zone Vertical Thermal Shock Chambers
FS
Originally developed for testing microelectronic devices for use in military and aerospace electronic systems, Bemco Vertical Thermal Shock Chambers are widely used for screening and quality evaluation of smaller electronic parts.
-
-
product
Thermal Shock Chamber
Allows for the rapid transfer of products between temperature extremes, or the alternating heating and cooling of test articles in cyclical manner.
-
product
Thermal Imaging System for Electronics Testing
ETS320
Whether the goal is product testing or scientific research, heat can be an important indicator of how a system is functioning. The FLIR ETS320 is a non-contact thermal measurement system that pairs a high-sensitivity infrared camera with an integrated stand, for hands-free measurement of printed circuit boards and other small electronics.
-
product
CAN/LIN Communications Expansion Kit
OP-SB87
OP-SB87 is an expansion board for CAN/LIN communications, inserting into a slot of communication analyzer LE-8200A/LE-8200. It has 2 CAN connectors and 2 LIN connectors, and measures 2 channels of CAN or LIN, or 1 CAN/1 LIN. It is useful to measure network where there are CAN and LIN communications at the same time.
-
product
PCIe Gen3 X16 Bus Expansion Via Dual X8 OCuLink
PCI125
The PCI125 is VadaTech’s 4th generation PCIe expansion module based on the PCI-SIG specification. The Module has a Retimer/Conditioner to improve signal integrity for enhancing system performance and reliability across long cables. It removes both random and deterministic jitter from the input signals eliminating inter-symbol interference and resets the output jitter budget. It supports the full 16 lanes.
-
product
Ultra-compact, uncooled thermal imaging core
Dione 640 CAM Series
The Dione 640 CAM series is based on the Dione 640 OEM thermal imaging core with 640 x 480 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione 640 CAM is both lightweight and small. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 640 CAM versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
-
product
40-CH 100G Thermal AWG
Flyin’s 40 channel 100G Thermal AWG(100G TAWG) is designed for use within the C -band release of DWDM system. To decrease the power dissipation of the devices in different environmental conditions, the TAWG package is special designed with selection of reliable thermal plastic with low thermal conduction, and the TAWG operating temperature is controlled by using foil resist heater or Peltier TEC with thermistor temperature sensor. Different input and output fibers, such as SM fibers, MM fibers and PM fiber can be selected to meet different applications. We can also offer different product packages, including special metal box and 19” 1U rackmount.
-
product
LXI EMR Low Thermal EMF Matrix 42x33
60-511-002
This high density 1-pole matrix has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix.
-
product
Workstation Software For Thermal Analyzer
LabSolutions TA
A new design and enhanced functions that can be used at a glance. Intuitive operations that allow seamlessly performing the sequence of processes from measurement to analysis, and the outputting of reports.
-
product
Pocket-Sized Thermal Vision Monocular
FLIR Scout TK
The FLIR Scout TK is a pocket-sized thermal vision monocular for exploring the outdoors at night and in lowlight conditions. Scout TK reveals your surroundings and helps you see people, objects and animals over 100 yards (90 m) away. Simple to use, with still image and video recording, Scout TK is the perfect companion, whether in the back country or your own backyard.
-
product
Semiconductor Thermal Transient Tester
T3Ster®
T3Ster (pronounced "Trister") is an advanced thermal tester from Mentor Graphics MicReD Products for thermal characterization of semiconductor chip packages. Superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01oC); and its 1 micro-second measurement resolution in time.
-
product
LXI Low Thermal EMF Matrix 1-pole 44x33
60-510-021
The 60-510 is a high density 1-pole matrix module controlled via LXI. It has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix. Typical applications include signal routing in ATE, selecting thermocouple inputs, switching amplifier gain circuits and high accuracy DC micro-volt measurements. Ruthenium reed switches are used because of their good low level switching capability. They also have a very long life with excellent contact resistance stability, minimal wetting current and low thermal offset.
