Thermal Expansion
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Horizontal Dilatometers
TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
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Coupler Workstations
Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Expansion Peripherals
Expansion peripherals are used with data loggers to achieve many purposes, including the following: add additional channels, extend data communications networks, perform media conversions, read vibrating wire sensors, and build distributed measurement networks.
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DSP, Expansion & Software
A wide range of products designed to control, mix, and optimize audio signals.
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Expansion I/O Module.
SI-MOD66xx
The SI-MOD66xx is a family of high resolution, multi function data acquisition and control modules that plug into any SI-CxDSP carrier processor card for the PCI bus.
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Thermal Enclosures
LDP
Bemco LDP Thermal Enclosures are always custom. They are environmental enclosures constructed using the techniques normally employed with Bemco's LDF Series of Wide Range Expendable Refrigerant, FL-I Series of Integral Walk-in, and FL-M Series of Modular Walk-in Chambers. The LDP enclosure illustrated at left has hinged stainless steel doors, with the protective paper still in place, and hinged sides to allow full interior access.
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Thermal Imager
testo 865
The testo 865 thermal imager combines all the important properties required for high-quality thermographic measurement it is accurate, robust, fast and reliable. The testo 865 provides high-quality thermography at an affordable price and keeps going even in tough working conditions. The case supplied with the thermal imager means it can be conveniently transported, so it is always there for you when needed.
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Thermal FETs
Pin-compatible with standard Power MOSFET packages and built-in over temperature protection function for body, lighting and heater applications, as well as powertrain applications and 24V battery system applications.
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Thermal Management
Get efficient and reliable heat management and humidity control solutions geared to your specific size, location and business goals.
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CAN/LIN Communications Expansion Kit
OP-SB7GX
OP-SB7GX is the expansion kit which makes it possible to monitor, and simulate CAN and LIN communications. It enables monitoring of CAN and LIN data in any combination up to 2 channels at a time. Suitable for evaluation of mixed in-vehicle networks of CAN and LIN.
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Expansion Adapter Chassis
TB3-TO-CMC-LP
The TB3-TO-CMC-LP is an expansion adapter chassis using the Intel Thunderbolt 3 interface. The adapter allows the use of a front I/O XMC or PMC card outside its normal confines of a single board computer (SBC) or PC hosted carrier card. The TB3-TO-CMC-LP enables the deployment of XMC or PMC modules in systems previously unable to host them -- laptops, small form factor PCs, and other computers lacking add-in slots.
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FMC Expansion I/O Module.
SI-MOD32xx
The SI-MOD32xx is a family of high resolution, FMC form factor, high channel count multi function data acquisition and control modules that plug into any SI-DSP or FPGA carrier card.
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Thermal cameras
SKF Condition Monitoring Center
Using an SKF Thermal Camera is a proactive way to help you detect problems before they occur, increasing uptime and improving safety. They allow you to be able to visualise potential problems, invisible to the naked eye, by presenting a picture of the heat distribution of an asset. The thermal image, presented on a large LCD screen, shows you where the temperature is either too hot or too cold allowing you to pinpoint potential problems fast.
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Thermal Printer
DP-581H
It allows to print data without AC power by driven with built-in rechargeable battery, enables to use anywhere. Lithium-ion battery (6-cell, 11.1 V, 6000 mAh, 66.6 Wh)
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CAN/LIN Communications Expansion Kit
OP-SB87
OP-SB87 is an expansion board for CAN/LIN communications, inserting into a slot of communication analyzer LE-8200A/LE-8200. It has 2 CAN connectors and 2 LIN connectors, and measures 2 channels of CAN or LIN, or 1 CAN/1 LIN. It is useful to measure network where there are CAN and LIN communications at the same time.
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PMC/XMC Expansion Card
EXP238
The EXP238 is a 6U VMEbus form factor expansion card offering three XMC/PMC expansion sites. When ordered as an option for the XVB603 VMEbus single board computer, the 3-slot solution greatly expands system flexibility.
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Thermal Cabinets
AMETEK Sensors, Test & Calibration
We provide two models of high precision heating and cooling thermal cabinets; the TC540 heating cabinets (40°C to 300°C) and the TC550 heating and cooling thermal cabinets (-70°C to 300°C) used with liquid nitrogen for cooling.
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Thermal Imaging
Is a sophisticated and non-invasive technique that utilizes infrared technology to detect heat emissions from various objects.
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Thermal Management
Our air cooling components dissipating heat to the ambient air comprise high-performance heat sinks, general purpose DC fans and AC fans for forced air ventilation, as well as filter fans with exchangeable exhaust filter inserts that ensure clean and reliable air exchange in cabinets.
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Thermal Software
ThetaCalc
Thermal Engineering Associates, Inc.
A tool designed to provide a quick estimate of the temperature and thermal resistance from a heat source to a reference heat sink. It also shows the temperature and thermal resistance value of each layer in the heat flow path. The program can accomodate up to ten layers of different materials of varying dimensions between the heat source and sink. The heat spreading angle can be set independently for each layer to a value between 0 and 45 degrees; the tool will automatically determine if heat flow reaches the layer edge and then convert to columnar flow.
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Thermal Monitoring System
The monitoring system for the thermal state of traction electric locomotive machines is designed for:control of the thermal state of traction electric motors (TED) as part of a high-speed traction-energy car-laboratory for testing rolling stock (TEL-C) in the acceptance and certification tests of electric locomotives;control of the thermal load of the TED and the temperature distribution by volume of the TED during the operational tests of electric locomotives;experimental determination of the most heated parts of the TED under different operating conditions;display of the current thermal state of the engine to the operator of the system;storing the thermal state data in the database for later playback.
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Thermal Analysis
Thermal Analysis is important to a wide variety of industries, including polymers, composites, pharmaceuticals, foods, petroleum, inorganic and organic chemicals, and many others. These instruments typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature. Properties characterized include melting, crystallization, glass transitions, cross-linking, oxidation, decomposition, volatilization, coefficient of thermal expansion, and modulus. These experiments allow the user to examine end-use performance, composition, processing, stability, and molecular structure and mobility.
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Thermal Transport
The thermal transport probe measures thermal conductivity and thermoelectric power (defined by the Seeback Coefficient). Electrical and thermal contacts are made to opposite ends of the sample allowing for customisation to suit the sample requirements of the user.
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Thermal Neutron Detector
TN15
The TN15 high sensitivity thermal neutron detector utilizes a state-of-the-art silicon photomultiplier (SiPM) and offers world-leading specification in a compact form. The TN15 surpasses the performance of a 100mm long 13mm3 He tube at 4 atmospheres and does not need cooling but operates at room temperature.
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Thermal Voltage Converter
1395B
The 1395B TVC. Has better thermal stability than it's predecessor. Measuring ac voltages between 20 Hz and 100 MHz with increased accuracy and reliability. The 1395B can be used as a primary ac voltage standard and/or standard for the calibration of ac calibrators and voltmeters.
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Air and Thermal Management
Honeywell Aerospace Technologies
Honeywell's range of electronic and electro-pneumatic systems for air and thermal management are proven to deliver highly reliable and efficient operation with lower total costs of ownership for aircraft operators.
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Fluids And Thermal
Whether you’re an analyst performing advanced computational fluid dynamics (CFD) modeling or a design engineer who quickly needs to understand fluid or thermal effects on a design proposal, Altair offers a complete line of tools to support your project. From detailed component analysis to full systems performance, Altair provides a range of scalable solvers under Altair CFD™, as well as robust pre- and post-processing software for CFD.
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PCIE Module For PCIe Bus Expansion
PCI113
PCI113 is VadaTech second generation PCIe expansion module. The PCI113 is a high-speed 20Gbps bridge from the host PCIe bus to VadaTech’s carrier and Rear Transition Module (RTM) products such as the ATC104/114/118/117/119, ART114, μTCA chassis, etc. The different carriers host different I/O modules such as PMC/PrPMC, AMC, PCI-X and PCIe edge modules. This concept allows any of the available I/O modules in these standard form factors to be integrated quickly and easily into an AdvancedTCA or μTCA subsystem. The PCI113 allows expansion among multiple μTCA chassis or expansion into other chassis that are not ATCA or μTCA based.The PCI113 is a single module PCIE based on the PCISIG specification. The PCI113 provides a PCIe x4 link infiber/copper via front panel QSFP. The dual front I/O allows expansion into two separate systems independently. The upstream port must not have spread spectrum PCIe clock enabled.
