BGA Inspection
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Robotic 2D & 3D Vision Inspection
EyeT+Inspect
EyeT+Inspect is the outstanding 3D device for robotic visual inspection combining robust 3D vision to inspect product shape with fast 2D vision to inspect product surface. EyeT+Inspect optimizes production thanks to automatic and objective removal of defective products from the production line.
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Magnetic Particle Inspection Systems for Non-Destructive Testing (NDT)
VERIFY SURFACE AND SUBSURFACE STRUCTURAL INTEGRITY IN: Industrial Crankshafts, Ferrous Parts, Aircraft Components, Landing Gear Components.
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Inspection Kits
Elcometer offers one of the widest ranges of inspection equipment available. Our products are used across numerous industry sectors. In all cases, there is always a need to undertake a number of specific inspections during quality control assessments - as one parameter can affect another.
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Appearance Inspection
We perform quality assurance agency of customers' important products through inspection.
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X5 Pipeline X-Ray Inspection
Designed to be integrated into the production line and available with product pipes in 2.5 and 3 ", the X5 pipeline is perfect for a wide range of pumped products such as poultry, meat, slurries and sauces. The system is capable of offering good detection levels on a wide range of contaminants including all metal, bone, glass, dense plastics.
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3D X-ray hybrid inspection system
YSi-X
Ideal for 100% inspection of onboard automotive products and many other items by 3D X-rays acquire layered of target. X-ray, optical, infrared, and laser height measurement as standard equipment; hybrid and high reliability with multiple inspection modes.
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X-ray inspection system for BLU, LED Long bar products
X-eye 9000LED
X-ray Tube100kV / 200uAMin. Resolution5µmTable Size1,500mm X 500 mmDetectorFlat Panel Detector (High sensitivity)Dimension3,620(W) x 1,065(D) x 1,590(H)mm / 850kg
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Reel to Reel Non-Contact OS Inspection System for TAB/COD/TCP/TBGA
TRV
*Most suitable mechanism for non-contact inspection*Sprochet-less transfer decreases products damage.*Easy operation by Fixture alignment mechanism*Equipped with Tracing Test function
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Inspection System
CIX100
The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.
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Software Module with a Virtual Gage for Real-Time Inspection and Assembly
Verisurf Build
Verisurf BUILD is the industry-leading tool for real-time model-based inspection, tool fabrication, and computer-aided assembly.Inspect position and profile, set details and fabricate tools, jigs, and fixtures faster and at lower cost than any other process or software.Evolved and perfected from a large installed base at today’s modern aerospace, automotive, and industrial tooling manufacturers.
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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GPR System for Concrete Inspection
StructureScan™ Mini
Geophysical Survey Systems, Inc.
The StructureScan Mini safely locates metallic and non-metallic targets within concrete structures up to a depth of 20 inches. The system incorporates an auto target feature that marks the detection of features of interest. This function also estimates the depth of targets and automatically adjusts the depth scale.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Video Inspection
MacroZoom
Our MacroZoom Video Inspection packages are useful is countless industries. MacroZoom solves the problems that customers have with traditional microscopes, by offering an unlimited working distance, as well as field of view, and hugely generous 1-80x magnification range.
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Optical Inspection
3D AOI
In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. A company purchasing a 3D AOI system wants to ensure that it is manufacturing its electronic products in the very best quality and can guarantee they will have a long service life. The Viscom systems feature superlative 3D and software attributes to deliver excellent measurement accuracy and exceptional image quality. Our 3D AOI systems are designed for simple programming and can also be flexibly adapted to new requirements, allowing them to easily accommodate fast product changeovers as well as large production quantities.
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Laser Sherography NDT Sensor for Post-Production Quality Control or In-Field Component Inspections
FlawExplorer
The FlawExplorer is a laser shearography NDT sensor designed to be used for post-production quality control applications or in-field (in-service) component inspections. Depending on the application, the sensor can be configured with thermal or vacuum (partial) excitation systems and may also be automated. It incorporates the very latest in phase-shifting technology delivering accurate and reliable measurement results through clear and sharp imaging with sub-micrometer displacement resolution.
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3D Inspection Software
Metrolog X4
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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Semiconductor Package Inspection System
NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Baggage and Parcel Inspection
Inspection of bags and parcels has to be effective, efficient, and meet the toughest regulatory requirements. Rapiscan® Systems products deliver on both levels.
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Turnkey NDT Corrosion Inspection Services
Robot-enabled ultrasonic inspection that produces thickness grid maps to identify areas where corrosion and other damage mechanisms have caused wall-thinning.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Semiconductor / FPD Inspection Microscope
MX61L
Motorized Microscope for 300mm dia. Wafer/17 inch Glass Substrate use Reflected/Transmitted Illumination.
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Sensor for Filament Inspection
EyeFI
EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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BGA Rework Station
PDR IR-E3 Evolution
The PDR IR-E3 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
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Thin Film SPY Inspection w/ Built In Jeep Meter
780
For thin film coatings the easy-carry and easy to handle SPY Model 780 speeds inspection time with its built in Jeep meter and various other time saving and comfort features.
