Teledyne DALSA
DALSA Corporation is an international high performance semiconductor and electronics company that designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized wafer foundry services.
- 519 886 6000
- 519 886 8023
- sales.americas@dalsa.com
- 605 McMurray Road
Suite 142
Waterloo, Ontario N2V 2E9
Canada
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Product
Xcelera Frame Grabber
Xtium-CLHS PX8
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Building on the field proven capability of Teledyne DALSA’s Xcelera frame grabber series, the Xtium™-CLHS PX8 is based on AIA’s CameraLink HS standard and uses PCI Express™ Gen 2.0 expansion bus to deliver high speed image acquisition and image transfer to the host memory. Xtium-CLHS uses industry standard CX4 cable to delivery up to 2.1 GB/s of image acquisition over a single cable to go beyond 15m and host transfer speeds of up to 3.2GB/sec - all in a compact, half-length, single slot solution.
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Product
Xcelera Frame Grabber
Xtium-CLHS PX4
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Building on the field proven capability of Teledyne DALSA’s Xcelera frame grabber series, the Xtium™-CLHS PX4 is based on AIA’s CameraLink HS standard and uses PCI Express™ Gen 2.0 expansion bus to deliver high speed image acquisition and image transfer to the host memory. Xtium-CLHS uses industry standard CX4 cable to delivery up to 2.1 GB/s of image acquisition over a single cable to go beyond 15m and host transfer speeds of up to 1.7GB/sec - all in a compact, half-length, single slot solution.
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Product
Line Scan Camera
Piranha4
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The Piranha4 cameras offer advanced features such as sub-pixel spatial correction, areas of interest (up to 4 at a time) to reduce data processing and simplify cabling, as well as dual-line area mode to double line rate, HDR mode, shading and lens correction. The Piranha4 is built for the real world with features to ease system integration. The advanced GenICam compliant user interface makes it easy to set up and control camera parameters such as exposure control, FFC, white balance, gain, test patterns, diagnostics and more.
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Product
Xineos Large Area Detectors
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As a leader in CMOS innovation, Teledyne DALSA developed the Xineos to deliver three times more sensitivity and five times more signal-to-noise performance than other standard technologies at equal X-ray dose conditions. CMOS image detectors offer numerous advantages including the ability to record smaller image details with higher resolutions – allowing for the diagnostics of medical anomalies at earlier stages, and significantly increasing the probability of early intervention, patient recovery, and reduced treatment costs.
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Product
CL MX4 Frame Grabber
Xtium-CL MX4
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Building on the field proven capability of Teledyne DALSA’s Xcelera frame grabber series, the Xtium™-CL MX4 is based on industry standard PCI Express™ Gen 2.0 expansion bus to deliver high speed access to host memory. The new Xtium series offers higher bandwidth to sustain Camera Link® 80-Bit modes over longer cable distances and supports a wide variety of area and line scan color/monochrome cameras, all in a compact, half-length, single slot solution.
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Product
CoalXPress Frame Grabber
Xtium-CXP PX8
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The Xtium™-CXP is based on the industry standard PCI Express™ Gen 2.0 expansion bus to deliver high speed access to host memory. The Xtium series offers high performance frame grabbers for CameraLink, CameraLink HS and CoaXPress interface standards. The Xtium Series takes full advantage of PCIe Gen 2.0 platform to deliver bandwidth up to 3.4 GB/s using PCIe x8 slots. By enabling maximum sustained throughput and ready-to-use image data, the Xtium series minimizes CPU usage and improves processing times for the host applications. In addition, the Xtium series offers enhanced memory architecture to handle area and line scan, monochrome and color cameras. In addition, the Xtium-CXP series support image acquisition rate of up to 6.25 Gb/s from four input channels.
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Product
Xtium2 Frame Grabber Family
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The Xtium2 series leverages the PCIe Gen3 x8 platform to deliver high- speed image transfers to host memory without CPU overhead. Featuring Camera Link HS® interface standards, supports Active Optic Cable and SFP+ modules, CoaXpress® 12, and Camera Link®.
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Product
Multi-Interface Frame Grabber
Xtium2 CXP PX8 Series
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The Xtium2™-CXP PX8 series is based on the industry standard PCI Express™ Gen 3.0 and CoaXPress ver 2.0 to transfers image data to the host memory at maximum acquisition rates. The Xtium2-CXP series takes full advantage of PCIe Gen 3.0 platform using PCIe x8 slots to deliver bandwidth up to 6.4GB/sec into the host memory while supporting image acquisition from up to 4 CXP12 input channels (12.5Gbps per channel). The Xtium2 CXP series is available in three configurations:
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Product
CL LX1 Base Frame Grabber
Xcelera-CL LX1 Base
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Building on the field proven technology and performance of DALSA’s X64 frame grabbers, the X64 Xcelera™ Series leverages the PCI Express (PCIe) platform to bring traditional image acquisition and processing technology to new levels of performance and flexibility.The PCIe point-to-point host interface allows simultaneous image acquisition and transfer with little intervention from the host CPU.The X64 Xcelera -CL LX1 Base is a cost effective frame grabber based on the PCI Express x1 interface. Fully compliant with Camera Link (V. 1.20) specifications, the Xcelera-CL LX1 supports single Base cameras and can acquire images from a wide variety of multi-tap area and line scan, color and monochrome cameras.
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Product
CL+ PX8 Full Frame Grabber
Xcelera-CL+ PX8 Full
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The X64 Xcelera-CL+ PX8 Full has been built within Teledyne DALSA’s Trigger-to-Image Reliability technology framework. Trigger-to-Image Reliability leverages Teledyne DALSA’s hardware and software innovations to control, monitor and correct the image acquisition process from the time that an external trigger event occurs to the moment the data is sent to the host, providing traceability when errors do occur and permitting recovery from those errors.
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Product
3D Profile Sensor
Z-Trak2
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Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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Product
Area Scan Camera
Genie Nano-CXP
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Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading edge high resolution CMOS image sensors.
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Product
Area Scan Camera
Genie Nano-1GigE
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Introducing Genie Nano, a CMOS GigE camera that redefines low cost performance. Genie Nano starts with industry leading CMOS sensors and adds proprietary camera technology for breakthrough speed, a robust build quality for wide operating temperature, a three-year warranty and an unmatched feature set—all at an incredible price.
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Product
CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.




































































