BGA Inspection
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Industry-Standard, Automated Precision Inspection Systems
Circuit AOI 4.0
Circuit AOI 4.0 is a set of industry-standard, automated precision inspection systems that combine precision, robust construction and line-of-sight technology for assembly and production under stringent regulatory standards and is ideal for PCB / HDI line inspection.It uses innovative alignment detection logic to detect defects such as short / open circuit, protrusion / depression, scratch, pinhole, residual copper, line width / line distance violation, missing objects, unwanted objects, and so on. The system can be used with off-line set-up station and off-line re-check station to enhance the detection capacity.Circuit AOI 4.0 uses multi-angle LED light source, compared to the traditional single angle light source design, can obtain the best image contrast, widely used in different plate inspection.
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Automated Optical Inspection System
506
We are proud to introduce the latest member of our model 505 AOI product family, the 506. This system was developed to provide a high coverage, easy to program AOI system for the larger backplanes / backpanels being produced today.
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Protective Coating Inspection Kit 3
Measurement parameters include:Surface profileSurface temperatureClimatic conditionsCoating thicknessAdhesion
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Luminescence Defect Inspection System
INSPECTRA® PL Series
This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Powder Coating Inspection Kit
Elcometer has produced this kit to enable the inspection of powder coatings on all surfaces. For a smooth surface, the digital Elcometer 415 Paint and Powder Gauge may be used but for more demanding, uneven surfaces, the Elcometer 1542 Cross Hatch Adhesion Tester is included.
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PHOTOMASK INSPECTION MACHINE
NEGATIVE FILM
Negative film and photomask inspection originated from the extensive use of printed circuit boards. Negative films and photomasks are used in large quantities. The early detection method is to use the "inspection light table" for inspection, which requires too much manpower and material resources, and manual testing may be due to eye fatigue and negligence.
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AXI Inspection Systems
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AXI Inspection Systems
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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High Precision Angular Positioning, Calibration and Geometry INspection
LabStandard AIR
Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.The LabStandardAIR has been designed as a “Contact Free” system and eliminates features, which may detract from achieving the optimum rotational performance. The rotating elements are supported on super high precision, air lubricated, hydrostaticbearings and are not subject to disturbances associated with gear drives.
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Solar Power Plant Inspection Service
We provide various performance/safety tests including insulation resistance measurement, ground resistance measurement as well as string I-V inspection, EL inspection, and IR inspection using thermography. We provide services of pre-operation voluntary test and pre-operation self check, mandated by revision of FIT scheme in 2017 for solar plants of 500kW – 2,000kW.
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Visual Counting & Inspection Systems
Sciotex has created a comprehensive line of visual counting and inspection systems. These systems can be custom configured for a wide range of applications and are often delivered, ready-for-installation in your environment.Our Products:PerfectCount, Ball Coleman SeedView, ConveyorView Inspection Systems, Sciotex ImageView, MultiView Inspection Systems
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Automated And Manual Sample Inspection
In addition to typical in-process, continuous dynamic measurement applications, LaserLinc’s non-contact measurement equipment is well suited for manual and automated off-line sample inspection. Inspecting cylindrical products with long, thin characteristics, such as camshafts and catheters requires checking multiple locations and dimensions for accuracy. Manual inspections of these areas can be difficult because of the complex profile as well as the need for numerous measurement stations, different equipment and skilled personnel.
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High Precision Angular Positioning Calibration and Geometry Inspection
LabStandard
Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.Designed for horizontal and vertical applications with self-locking worm gearing and a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
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Motor Vehicle Inspect Lines Engineer Program
Foshan Analytical Instrument Co, Ltd.
It is suitable for measurement of motor vehicles equipped ignition engine with max total mass more than 3500kg. Including the dual idle speed method test. Meet the requirement of GB18285-2005"Limits and Measurement Methods for Exhaust Pollutomts from Vehicles Equipped Igintion Eigine under Two-speed Idle conditions and simple Driving Mode Conditions". The system can select the prompt mode of the dirver mode or the prompt mode of lattice screen.
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X-Ray Inspection System
MX1
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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Structural Adhesive Bead Inspection
Predator3D
The Predator3D bead inspection technology measures bead height, width (volume) and position to assure structural integrity. It also alerts users to skips and partial skips, where material is deposited with insufficient volume.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Wafer Chip Inspection System
7940
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Thickness and Flaw Inspection
MultiScan MS5800
Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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Fiber Optic Inspection & Cleaning
One of the most basic and important procedures for the maintenance of fiber optic systems is to clean the fiber optic equipment.
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Magnetic Particle Inspection(MPI)
Magnetic particle inspection is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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High Precision Angular Position, Calibration and Geometry Inspection
GeoOrdinate
Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.The GeoOrdinate has been designed specifically for the inspection of large and heavy components and is fully compatible with any shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Digital Ultrasonic Inspection, Information, storage, and retrieval system
ULTRAPROBE® 3000
he Ultraprobe 3000 is a digital ultrasonic inspection, information, storage, and retrieval system that comfortably fits in the palm of your hand.
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Automated LED Inspection and Testing
Landrex Technologies Co., Ltd.
Automated LED Inspection and Testing
