BGA Inspection
-
Product
Video Inspection Scope
BK3000
-
• Integrated 8.5 mm high-res imager allows for ease of use and ensures the product is always ready to go. Imager is resistant to dust, dirt, and water ingress for 30 minutes at depths of up to 3 meters.
-
Product
Highly Integrated Optical Inspection
BOA
-
BOA is a highly integrated optical inspection tool for controlling quality and increasing productivity. It comprises all the elements of an industrial machine vision system in a tiny smart camera style package.
-
Product
DC Safety Inspection Device For Solar Panels
“DC Fault Tester”
-
Identifies defect position instantly- contributes to saving inspection time
-
Product
Low to Modest Volume Clean, Inspect, Test
KI-TK034
-
1310/1550 nm source & power meter, inspection microscope, cleaning materials. Interchangeable MPO/APC, SC, LC connectors (EAR99 Restricted)
-
Product
High Precision Angular Position, Calibration and Geometry Inspection
GeoOrdinate
-
Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.The GeoOrdinate has been designed specifically for the inspection of large and heavy components and is fully compatible with any shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
-
Product
Wafer Inspection System
-
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
-
Product
Protective Coating Inspection
Kit 6
-
The Elcometer Protective Coatings Inspection Kit 6 is a comprehensive kit which incorporates all the key gauges and inspection accessories required to assess a structure before, during and after coating has been applied.
-
Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
-
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
-
Product
BGA Interposer, LPDDR4 200-ball, 2-wing For Logic Analyzer, Connects To 61-pin ZIF
W6601A
Interposer
The W6601A LPDDR4 2-wing BGA interposer for LPDDR4 200-ball BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A logic analyzer module it is compatible with. The W6601A is the smallest BGA interposer for LPDDR4 200-ball DRAM capable of capturing simultaneous read and write traffic at data rates in excess of 3.2 Gb/s. U4208A and U4209A probe/cables connect W6601A LPDDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W6601A BGA interposer wings. Refer to the W6601A data sheet for complete list of LPDDR4 signals probed with the W6601A.
-
Product
Wafer & Die Inspection
-
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
-
Product
Automatic Double-Sided Bare PCB Final Inspection AVI System
FI-18 Series
-
InScan Limited (SIP) Co., Ltd.
InScan FI-18 is a compact and high performance fully automatic double sided AVI system for Final Inspection of PCB boards.The setup is based on golden board and CAD data which greatly simplifies the setup process. The FI-18 series inspects and processes a double sided board sized 210X300 mm 5.5 sec. Superior interline high resolution CCD sensor.
-
Product
Solder Paste Inspection System
KY8030-3
-
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
-
Product
Automated Optical Inspection (AOI)
-
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
-
Product
Wafer Inspection Products
-
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
-
Product
Biofuels Testing and Inspection
-
Intertek delivers assurance, testing, inspection and certification services to refiners, producers, blenders, distributors, consumers and research institutes across the world.
-
Product
Fixture and Software for Open/Leak Inspection
-
In addition to jigs and fixtures for probing conductors and electrode pads, NIDEC-READ provides specialized software for test point selection and log analysis.
-
Product
DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
Interposer
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
-
Product
Tracing-Type Non-Contact Inspection System For LCD/STN/Touch Panel/FPC
TTS
-
*"Probe + Non-Contact Sensor" enables to delect SHORT after sticking LCD*No Fixture in LCD Inspection*Applicable to FPC Inspection
-
Product
First Article Inspection Services
-
API’s, on-site, first article measurement services provide inspection data on parts and assemblies with direct comparison against CAD models or drawings. Generated 3D measurement data from our portable metrology equipment and 3D scanners offers a comprehensive analysis of the physical part under measurement. Inspection reports can include 3D color maps or generated 3D models for detailed computer analysis.
-
Product
Non-Destructive Inspection Equipment
-
Non-destructive inspection means that various materials such as metal are "without damaging the object, knowing the presence or absence of scratches on the surface or inside and the degree of scratches, and passing the object against standards such as standards.
-
Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
-
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
-
Product
Portable gear inspection- and 3D-measuring systems
-
ultimate independent measurement - on the production machine or on the shop-floor without rotary table
-
Product
Vision Inspection Products
-
Vision inspection systems use a series of high-speed cameras and imaging software to detect and measure random objects as they move along a conveyor belt. Custom software and measurement algorithms can determine the size, shape, color or composite measurement of any object and convert this into standard units for quality control. Bench, over-line, and in-line systems are available and provide real-time 100% inspection and rejection of any production line.
-
Product
3D Measurement And Inspection
LOTOS
-
LOTOS automatic measuring systems can measure the full outer contours or individual areas of any measurement object quickly and precisely, irrespective of the shape, and test them for imperfections. The three-dimensional, non-contact measurement is carried out using optical measurement sensors with accuracy in the μm range. The result is a representation of the measurement object as a 3D model. Powerful, intuitive software allows the measurement results to be assessed extremely quickly.
-
Product
Magnetic Particle Inspection Systems for Non-Destructive Testing (NDT)
-
VERIFY SURFACE AND SUBSURFACE STRUCTURAL INTEGRITY IN: Industrial Crankshafts, Ferrous Parts, Aircraft Components, Landing Gear Components.
-
Product
BGA Socket Adapter Systems
-
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
-
Product
AOI/SPI Inspection Systems
-
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AOI/SPI Inspection Systems
-
Product
X-ray Inspection Performance
MXI Quadra 7
-
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
-
Product
High Precision Angular Positioning, Calibration and Geometry Inspection
LabStandard COMPACT
-
Rotary Precision Instruments UK Ltd
Designed for horizontal or vertical applications with a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
-
Product
X-ray Inspection System
RTX-113™
-
Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
