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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
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ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Product
Clamp-On / Precision / Split Core Current Transformer
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Transformer Ratio (Arms) : 100A / 1AColours : Red, yellow, blueConnection : Safety Sockets for Banana Plugs ф 4mm Jaw Opening : Cable Dia 15mm max.
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PICMG 1.3 Full-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1/Gen2, Dual LAN And DVI-I
SHB150R
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor (up to 95W)*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 Long-DIMM for up to 64GB of memory*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported (optional)*Supports M.2 Key M (C246/Q370)
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Thermal Imaging Core
JOHO336CM_A00
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Wuhan JOHO Technology Co., Ltd
JOHO336CM_A00 is a high sensitivity, high reliability uncooled thermal imaging core . With advanced image processing technology, it offers excellent image quality by 320x240 resolution,17m pitch sensor. Featuring of compact design and ultra low power.
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THIN AI Motherboard 12th Gen Intel® Core™ Processor (Alder Lake), MXM GPU Integration
AIMB-288E
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12th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport Intel Arc Embedded MXM GPU or NVIDIA Quadro Embedded MXM GPUUp to 64GB DDR5 4800 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 B-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
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ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Rapidly Compile Networks For Implementation On Lattice SensAI IP Cores
Neural Network Compiler
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Analyze networks for fit in the chosen number of engines and allocated memory. After compilation, simulate networks for functionality and performance prior to testing in hardware. Graphical display of networks supports analysis and understanding.
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Two-Way Optical Loss Test Set
KI23427OLF-INGAAS-APC
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A Two-Way Optical Loss Test set (OLTS) that's perfect for medium to ultra high fiber count loss, length and optical return loss testing applications on single mode fiber with an APC connector at triple 1310 / 1490 / 1550 nm. A pair of these compact instruments set new standards of productivity, accuracy and ease of use. The 650 nm VFL is on a separate port.
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Iron Core Current Limiting Reactors
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Current Limiting Reactor (CLR) is one of the most effective short circuit current limiting devices. It reduces stresses on busses, insulators, circuit breakers and other high voltage devices. Use of CLR is the most practical and economical approach at current limiting.
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6 Motors Core Alignment Fiber Fusion Splicer
SH-FS170+
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Shenzhen Sharingtek Communication Co., LTD
♦Based on the principle of PAS(Lateral Projection System), adopt advanced image detection algorithm .♦ Double core align structure, higher success rate of fusion and lower loss;♦Adopt 4.3 inches 16:9 TFT colorized LCD screen;♦Typical fusion time: 9sec; fast time: 7sec♦Typical heating time: automatic v-shaped heat shrinkable 9 seconds, cover and automatic heating;♦Reliability design, strengthen shockproof, dust proof and other functions;♦Low power consumption design makes it possible to work long time with many functions operate at the same time;♦Multi-functional, small-sized, portable, can greatly improve working efficiency;♦Can detect the air pressure, temperature and humidity and other environmental factors and automatically calibrate arc.♦Removable plug the battery, convenient and quick charge;♦Concerning, the straps can be used for aerial work.
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Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, Built-in Layer 2 Managed PoE Switch For Railway PC
tBOX400-510-FL
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The tBOX400-510-FL is a two-in-one transportation-certified box PC with built-in layer 2 managed PoE switch for IP surveillance applications. The tBOX400-510-FL is certified with CE (Class A) and FCC and is in compliance with EN 50155 and EN 45545-2. This high-performance transportation box PC is powered by the 7th generation Intel® Core™ (Kaby Lake) or Intel® Celeron® 3965U processors, along with dual DDR4 SO-DIMM slots for up to 32GB of memory. The built-in 10-port managed switch is powered by Qualcomm's chip. The tBOX400-510-FL has a built-in 10-port managed switch with 8-port 10/100 Mbps PoE and 2-port Gigabit LANs, featuring VLAN, QoS and PoE scheduling for the more secure and smooth network. For reliable operation in severe environments, the rugged fanless transportation box computer is designed to withstand a wide temperature range from -40°C to +60°C and vibration of up to 3 Grms. It also supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for marine applications, and 24V to 110V DC for railway applications. With its high performance, industrial-grade design and full-strict certifications, the tBOX400-510-FL is suited for transportation-related applications such as onboard video surveillance and video management.
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
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The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
Rugged IP67-rated Fanless Embedded System With Intel® Core™ I5-7300U & Celeron® 3965U, VGA, GbE LAN, 2 USB, 2 COM And 9 To 36 VDC
eBOX800-511-FL
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The eBOX800-511-FL is a fanless embedded system with IP67-rated housing and M12 connectors for mission-critical environments. This rugged embedded system is powered by the onboard 7th generation Intel® CoreTM i5-7300U and Celeron® 3965U (formally codename: Kaby Lake) and comes with one 204-pin DDR4-2133 SO-DIMM slot with system memory up to 16GB. The eBOX800-511-FL is designed for enabling to function in harsh environments with power protection, a wide range operating temperature from -30°C to 60°C, operating shock tolerance up to 3G and 9-36V wide range DC input. Additionally, there are M12 lockable connectors and N-jack type waterproof antenna openings to meet the performance needs for outdoor critical applications such as facility condition monitoring. Furthermore, the fanless embedded box computer comes in great expansion possibilities, including flexible I/O connectors and two 2 PCI Express Mini Card slots. For enhanced platform security the eBOX800-511-FL provides Trusted Platform Module (TPM) 1.2 support.
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ATX Motherboard With LGA1151 Socket 9th/8th Gen Intel® Core™
IMB521R
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The IMB521R is powered by the LGA1151 socket 9th and 8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake Refresh), Intel® Pentium® or Intel® Celeron® processor with the Intel® C246 chipset. The industrial motherboard is designed with rich functionality and offer high processing powers, multiple expansion interfaces, security feature, and stunning graphical performance to deliver true customer value and quick deployment in a broad range of high-performance applications such as industrial automation, gaming, AI-related server, self-service kiosks, medical, and digital signage. It features one PCIe x16 slot, four PCIe x4 slots, one PCIe x1 slot and one PCI slot for future expansions such as motion control cards, frame grabber cards or data acquisition cards. It also has two USB 3.1 Gen2 and four USB 3.1 Gen1 ports for faster data transfer. In addition, the industrial-grade ATX motherboard is integrated with the Intel® HD Graphics to deliver stunning 4K resolution, as well as fast 3D and video playback for graphics-intensive applications. It support three independent displays with DisplayPort++, DVI-D, HDMI, and VGA.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H310 And TPM 2.0
OPS500-520-H
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The OPS500-520-H is powered by the newest 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (code name: Coffee Lake S) with the Intel® H310 chipset. The smart cableless digital signage module has two DDR4-2400 SO-DIMMs for up to 32GB of system memory. Axiomtek's OPS500-520-H supports the LGA1151 socket-type processors offering greater flexibility for CPU selections, which is easily configured to meet various performance requirements. The OPS signage module is connected to OPS-compliant display via a standardized JAE TX-25A plug connector interface which supports DisplayPort, HDMI 2.0, USB 2.0, USB 3.1, audio and UART signals. It also has one M.2 Key E for Wi-Fi modules and one M.2 Key M supporting PCIe, SATA and SSD interfaces for storage. We believe that this new smart cableless open pluggable signage module with simplified installation, maintenance and upgrade can help you develop creative display solutions that increase your sales and improve your customers' experiences. With the enhanced multimedia performance, the Intel® Coffee Lake S-based OPS500-520-H is well suited for a wide range of digital signage applications in retail, transport, entertainment, education, and more.
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SC9-TOCCATA, CompactPCI® Serial CPU Card Equipped With 11th Generation Intel® Core™ & XEON® W Processors (Tiger Lake H45 Platform)
EKF-SC9-TOCCATA
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SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.
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Product
Value Series Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C47
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Elevate your industrial applications with the ADLINK IMB-C47 value series motherboards, engineered to deliver robust performance at an exceptional value. Designed with the evolving needs of cost-conscious businesses in mind, the IMB-C47 value series offers a versatile foundation for a wide range of computing tasks.From manufacturing automation to retail kiosks, these motherboards bring reliability without the premium price tag. Featuring support for the latest processors, abundant I/O connectivity, and expansion options, the IMB-C47 value series is crafted for those who seek reliable technology that aligns with their budgetary parameters.
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Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-511-FL
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*Integrated real-time vision I/O**4-CH trigger input**4 trigger output**4-CH LED lighting control**2-CH quadrature encoder input**16-CH isolated DIO*Supports camera interfaces**4 IEEE802.3at GbE LAN ports (PoE)*Power input: 24 VDC (uMin=19V/uMax=30V)*-10°C to +60°C operating temperature range with W.T. SSD*Supports 2 swappable 2.5" HDD*Supports TPM 2.0 function
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Product
Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor, Compact Size For Video Analytics In Vehicle PC Market
UST100-504-FL
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*CE, FCC certified; ISO 7637-2 compliant*LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 35W) with Intel® H110*Fanless and Wide operating temperatures from -40°C to +60°C*12/24 VDC power input, with power management (ACC ignition)*Single-sided I/O design for easy maintenance*Expansion capability for three PCI Express Mini Card slot and two internal SIM card slot
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Product
Iron loss Testers
ATS Series
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Hunan Linkjoin Technology Co., Ltd.
Linkjoin Iron Loss Testers
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Product
Fanless Embedded System With Intel® Core™ I5-6300U 2.4 GHz/i3-6100U 2.3 GHz/Celeron® 3955U 2.0 GHz, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM And 9 - 36 VDC
eBOX565-500-FL
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The eBOX565-500-FL is designed to support the 6th generation Intel® Core™ i5-6300U or Celeron® 3955U processor with one 260-pin DDR4-2133 SO-DIMM socket with up to 16GB system memory. The eBOX565-500-FL is designed for reliable use in industrial environments with an IP40-rated enclosure, a wide range 9 to 36 VDC power input, a wide temperature ranges from -10°C to 50°C (14°F to 122°F), as well as up to 3G vibration endurance. To fulfill various needs, the palm-sized industrial embedded computer, which measures 141.6 x 106 x 73 mm in size, provides rich I/O connectivity including two HDMI ports, one RS-232/422/485 port, one RS-232 port, four USB 3.0 ports, two Gigabit Ethernet ports, and two SMA type connector openings for antenna. One PCI Express Mini Card slot enables the addition of Wi-Fi, 3G, or LTE wireless cards.
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Product
Intel Core Ultra Processors (Code Name: Panther Lake)
MIO-5381
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Intel Core Ultra Processors, up to 14 Cores, TDP 28W/15WDual Channel DDR5-7200 up to 128GB, with IBECC support4 simultaneous displays: eDP + 2x HDMI + USB-C with DP Alt.2x LAN, 6x USB (incl. 1x USB4), 4x UART, 2x CAN-FD, 8bit GPIO, I2C(*SMBus)4x M.2 Expansions: E-Key 2230, B-Key 3052, 2x M-Key 2280Supports Windows 10/11 LTSC & Ubuntu 24.04 LTS, embedded software APIs, DeviceOn Remote Management, Robotic SuiteSupport EdgeBMC for OOB(Out-of-Band) remote control management
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Product
Handheld Return Loss Tester
JW3308
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Shanghai Joinwit Optoelectronic Tech,co.,Ltd
JW3308 handheld return loss tester is used to measure the return loss in the field fiber optic linking, in order to adjust the quality of the optic fiber end-face, and to make sure the fiber optic communication is in good condition. This 3308 handheld return loss tester can realize measurement of Return Loss, Insertion Loss, Output power, and also can be used as the laser source. Moreover, it has the data storage function of 500 measurement items.
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Product
Powerful 4th Generation Intel® Core™ i7 Processor-Based Fanless Embedded Computer
MXE-5400
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ADLINK’s new Matrix MXE-5400 series of rugged designed quad-core fanless computers, featuring the latest 4th generation Intel® Core™ i7-4700EQ processor (Formerly Haswell) delivers outstanding processor performance with minimum power consumption. Intel’s Quick Sync Technology and Core IPG equip the MXE-5400 with market-leading performance boost in image/video related applications.
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Compact High-Performance IoT Gateway With NXP I.MX8M Quad Core Cortex A53, 2 LAN, 2 COM & 1 USB
ECU-150
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NXP i.MX8M Quad Core Cortex A53 1.3G CPUDDR4 2GB RAM, 16GB eMMC for system storage2 x RS-232/485 isolated serial ports2 x 10/100/1000 Ethernet ports1 x Mini-PCIe for WIFI/Cellular/4GSupport web service for remotely on-line monitoringSupport SD card & on-line firmware updateSupport Modbus, IEC-60870-5, DNP3.0, OPC-UA, BACNet protocol （ECU-150-12A1&ECU-150-12A1U need container EdgeLink）Support Data logger on SD card
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14th/13th/12th Gen. Intel® Core™ Processors (Alder Lake-S/Raptor Lake-S Series, LGA1700 Socket CPU) On 4" EPIC SBC
MIO-4370
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14th/13th/12th Gen. Intel® Core™ Processor up to 24 Cores, TDP 35WHigh scalability with socket type CPU (LGA1700) & Support Std. CPU coolerDDR5 4800 up to 32GB + 3 simultaneous display: Dual HDMI+eDPDual High Speed 2.5G Ethernet with TSN, 2x COM, CANbus, TPM3 Expansions: Dual M.2 M-Key (support NVMe), M.2 E-KeySupports Windows 10 LTSC & Ubuntu 22.04 LTS, embedded software APIs, WISE-DeviceOn
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
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The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Product
Ultra-compact, uncooled thermal imaging core
Dione 640 CAM Series
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The Dione 640 CAM series is based on the Dione 640 OEM thermal imaging core with 640 x 480 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione 640 CAM is both lightweight and small. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 640 CAM versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ MicroATX Server Board with 4 DDR4, 4 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-586
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- LGA 1151 Intel® Xeon® E and 8th/9th generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 128GB- One PCIe x16, two PCIe x4 and one PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- 0 ~ 60° C ambient operating temperature range
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Product
ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DVI-D And HDMI
IMB502
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*LGA1151 socket 7th/6th gen Intel® Core™ i7/i5/i3, Pentium® & Celeron® processor (Kaby Lake/Skylake)*Four 288-pin DDR4-2400/2133/1866 DIMM for up to 64GB of memory*VGA, DVI-D and HDMI with triple-view supported*5 SATA-600 with RAID 0/1/5/10*6 USB 3.0 and 7 USB 2.0
