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Product
Air Core Electric Arc Furnace Reactors
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Arc Furnace Reactors are serially connected reactors that are installed in the supply systems of arc furnace transformers to stabilize arc and limit the unstable arc furnace current and voltage drop which optimize their melting process. These buffer reactors are connected in series to the primary side of the furnace transformer. Typically these reactors are tapped coils and manufactured as per customer'stap requirements.
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Product
Compact IoT Edge Computer With Intel® Core™ I CPU
UNO-238
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8th generation Intel® Core™ i processor2 x GbE, 4 x USB3.2, 2 x RS-232/422/485, 1 x HDMI, 1 x DP, 1 x GPIO (8 bit)Compact, fanless designRubber stopper for stand mount and optional kit for DIN-rail mountingThreaded DC jack for reliable power supplyOptimized mechanical design for easy RAM swapping
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Ultimate Performance Gaming Platform Based on 7th Generation Intel® Core™ Processors Supports up to 11x Independent Displays Including 4K UHD
ADi-SA1X-KB
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- Ultimate " all-in-one" gaming platform- The best-in-class graphics capabilities in games with high levels of detail- Up to 11x independent HD monitors supporting 4K UHD- Advanced security feature set and software solutions- Intelligent middleware shortens development time- Various power supply options- Low-power consumption
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Optical Loss Test Set/Light Source/Optical Power Meter
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The CMA5 series (Optical Loss Test Set/Light Source/Optical Power Meter) offer superior accuracy and reliability for evaluating a wide range of optical devices and systems including WDM.
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3U 7th Generation Intel® Core™ i3-7100E Processor-Based PXI Express Gen3 Controller
PXIe-3937
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The ADLINK PXIe-3937 PXI Express embedded controller, based on the 7th gen Intel® Core™ i3 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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ATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Workstations, General-Purpose Servers, And Multi-Tasking.
ASMB-789
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Features an LGA 1851 socket for Intel® Core™ Ultra 9/7/5 processors with the W880 chipset, delivering next-gen performance.Supports up to 192 GB of high-speed DDR5 ECC/Non-ECC UDIMM memory at up to 5600 MT/s.Provides extensive expansion with one PCIe x16 (Gen5), one PCIe x8 (Gen5), and five PCIe x4 slots.Drives triple independent displays through DisplayPort, VGA, and HDMI 2.0 for advanced visual workspaces.Includes four SATA 3 ports for traditional storage and seven USB 3.2 ports for high-speed peripherals.Features one M.2 2280 slot (PCIe x4) for fast NVMe SSDs, accelerating boot times and application performance.Its rackmount-optimized design ensures positive airflow, enhancing cooling and system reliability in server environments.Built to operate reliably in a 0 ~ 60°C (32 ~ 140°F) ambient temperature range, suitable for various industrial settings.
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
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- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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MicroATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Edge Computing, Industrial Automation, And Compact Servers.
ASMB-589
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Powered by LGA 1851 Intel® Core™ Ultra 9/7/5 processors with W880 chipset for high-performance computing.Supports up to 192 GB of DDR5 ECC/Non-ECC UDIMM memory at speeds of 5600/4800/4400 MT/s for demanding applications.Features two PCIe x16 (Gen5) and two PCIe x8 (Gen4) slots for flexible expansion with high-speed peripherals.Offers versatile display connectivity with DisplayPort, VGA, and HDMI 2.0 ports, supporting triple simultaneous displays.Provides extensive storage options with five SATA 3 ports and eight high-speed USB 3.2 ports for peripheral connectivity.Includes one M.2 2280 slot (PCIe x4) for fast NVMe SSD storage, enhancing system boot and application load times.Designed with rackmount-optimized placement and positive airflow for enhanced thermal performance in server environments.Ensures reliable operation in industrial environments with an ambient operating temperature range of 0 ~ 60°C (32 ~ 140°F).
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Product
Compact IoT Edge Computer With Intel® 12th Gen. Core™ I Processor
UNO-238 V2
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12th Gen Intel® Core™ i Processor up to 10 CoresDual Channel DDR5-4800 up to 64GBM.2 E-Key, B-Key, M-Key (support NVMe) expansion for storage/wirelessEquipped with CANBus for reliable communicationDC-in terminal block for wiring flexibilitySupports multiple displays for ThinManager solutionSupports software APIs, WISE DeviceOn, WISE Edge365
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Product
6th Generation Intel® Core™ i7/i5/i3 Fanless Computer
MVP-6010/6020 Series
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ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Mini-ITX SBC With LGA1151 Socket 6th/7th Gen Intel® Core™ Processor, Intel® H110/Q170, HDMI/DisplayPort/VGA/LVDS/eDP, Dual LANs And USB 3.0
MANO500
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The MANO500 is based on the new 14nm 7th/6th generation Intel® Core™ i7/i5/i3 and Pentium® processors in the LGA1151 package. Featuring the new Intel® H110 Express chipset with DDR4 2133MHz memory support, this motherboard is built to perform. Its three SATA 6G ports, four USB 3.0 ports, and two RS-232/422/485 ports provide robust storage and I/O options. Users also can increase board functionality with PCIe x16 slot and PCI Express Mini Card slot. The high quality MANO500 allows the connection of up to four display interfaces via HDMI, VGA, DisplayPort, and LVDS/ Embedded DisplayPort (eDP), making it an ideal solution for gaming, workstation, digital signage, medical and other IoT&M2M applications.
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PICMG 1.3 Full-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 Processor, Intel® Q87, SATA3, USB 3.0, DVI-D, VGA, DisplayPort And Dual LAN
SHB130
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The PICMG 1.3 full-size CPU card, SHB130, designed for the new architecture 4th Generation Intel® Core™ processors (codename: Haswell/Haswell Refresh) with Intel® Q87 chipset on 22nm technology using LGA1150 socket. The outstanding SHB130 with new Intel® architecture delivers up to double the graphics performance over the previous generation. The new graphics solution has high levels of integration to enable new form factors and designs with excellent visual quality built in. In addition, The PICMG 1.3 full-size CPU card comes with two DDR3 1333/1600 MHz unbuffered ECC DIMM slots up to 16 GB of system memory and six SATA 6Gbps ports with RAID 0, 1, 5, 10. The PCI Express 2.0 available on the new Intel® Core™ processor provides flexible x16, x4 or x1 lanes for versatile applications. The high performance SHB130 with improved graphics ability is ideal for applications such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
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The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
21.5" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3211W
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21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3x Independent displays1x M.2 bay (2242) for storage only & 1x TPM 2.0 internal support (optional)No RED Certification
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PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly codenamed Skylake)
CMx-SLx
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The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.
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COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
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ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Product
Fanless Embedded System With Intel® Core™ I5-7300U/i3-7100U & Celeron® 3965U, 2 HDMI, 2 GbE LAN, 4 USB 3.0 And PCI Express Mini Card Slot
eBOX560-512-FL
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The eBOX560-512-FL is powered by the Intel® Core™ i5-7300U/i3-7100U or Celeron® 3965U processor. To enhance system efficiency, the embedded box PC supports one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB system memory. Two HDMI ports with up to 4K resolution are supported for dual independent display applications. The palm-sized fanless embedded system is dedicated to smart factory automation, thin clients, industrial controller system, digital signage and retail equipment. Axiomtek's eBOX560-512-FL was designed to operate reliably in industrial and embedded application environments. It is enclosed in IP40-rated heavy-duty aluminum extrusion and steel enclosure and offers a wide operating temperature range from -10°C ~ +50°C (+14°F ~ +122°F) and up to 3G vibration endurance.
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Fanless Robotic Controller with Intel® Xeon®/Core™ Processor
ROScube-I
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ADLINK ROScube-I is a real-time ROS 2 enabled robotic controller based on Intel® Xeon® 9th Gen Intel® Core™ i7/i3 and 8th Gen Intel® Core™ i5 processors featuring exceptional I/O connectivity supporting a wide variety of sensors and actuators for unlimited robotic applications. Also supported are Intel® VPU and NVIDIA GPU cards for computation of AI algorithms and inference. The extension box allows for convenient functional and performance expansion. ROScube-I supports the full complement of resources developed with ADLINK Neuron SDK, a perfect platform for development of industrial use service robotic applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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Product
COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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3.5” Embedded SBC With 4th/5th Generation Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® HM86 (Intel® QM87 Optional), LVDS/ VGA/Dual HDMI,Dual LANs And Audio
CAPA881
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The CAPA881 3.5-inch embedded board supports the 22nm 4th generation Intel® Core™ i7/i5/i3 processors (codename: Haswell) with Intel® HM86 or Intel® QM87 chipset (optional). The 3.5-inch single board computer comes with a DDR3L SO-DIMM socket up to 8 GB. The highly integrated 3.5-inch embedded board features high performance, graphics, power efficiency, security, and remote management capabilities (Intel® AMT), making it ideal for a broad range of intelligent systems such as embedded applications, gaming, DSA, DVR, IoT/M2M-related, network computing, and many more.
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Compact DIN-Rail Edge Controller With 11th Gen Intel® Core™ I CPU
UNO-148
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Port isolation for 8 x DI, 8 x DO, 4 x COMSupports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modulesDual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technologyRemote out-of-band (OOB) power management with Advantech iBMC technologyMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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PICMG 1.3 Half-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1, LAN And DVI-I
SHB250R
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 SO-DIMM for up to 64GB of memory*Supports M.2 slot (C246/Q370)*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported
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Mini-ITX 12th/13th/14th Gen & And Series 2 Intel® Core™ Processor LGA1700
AIMB-279 B1
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Intel® Core™ Desktop Processors 12/13/14th Gen and Series 2Dual channel DDR5 5600MHz, max. 96GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power Input via ATX 8pin+5VSB pin headerWindows 11 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
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The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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LGA 1700 Intel® 12th Gen. Core™ MicroATX Server Board with 4 x DDR5, 3 x PCIe (1 x Gen 5, 2 x Gen 4), 6 x USB 3.2, 5 x SATA3, Quad/Dual LANs, and IPMI
ASMB-588
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and two PCIe x4 (Gen 4) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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LGA 1700 Intel® 12th Gen. Core™ Proprietary Server Board with 4 x DDR5, 1 x PCIeX16, 2 x PCIeX4, 5 x USB 3.2, 4 x SATA 3, Quad LANs and IPMI
ASMB-610V3
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- Compatible with HPC-61 series chassis- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 slot or two PCIe x8 slots support FH/10.5" Length Cards- Two PCIeX4 slots support low profile expansion cards- 4 x SATA 3 ports and 5x USB 3.2 ports- One M.2 2280/22110 (SATA / PCIe compatible)- Quad LAN with Intel I350- Flexible IO board design
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Product
12.1" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-312
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Industrial-grade 12.1 XGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with 5-wire resistive touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Diverse system I/O and isolated digital I/O via iDoor technologySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupport TPM2.0 hardware security
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Advanced Design System (ADS) Core
W2200BP
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Advanced Design System (ADS) is the flagship product from Keysight EEsof EDA, the technology and innovation leader in high-frequency, mixed-signal electronic design automation (EDA). It is the only design simulation platform that enables the co-design of IC, package and board in high-frequency and hi-speed applications. ADS seamlessly integrates system, circuit, and full 3D electromagnetic simulation with Keysight's test instrumentation to perform single pass successful electronic designs repeatedly.
