Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Protocol Control Control
PC2
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The PC2 software from SCSI Toolbox, LLC brings a new level of parallel SCSI protocol control to your test environment. Designed in cooperation with LSI Logic to work with their Fusion-MPT Message Passing Interface technology, PC2 allows all negotiated parameters to be displayed or set for all devices connected to any SCSI Host Bus Adapter based on the LSI53C1030 chip set. PC2 also provides the means to generate hardware SCSI bus resets.
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Product
Probe Cards
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PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Product
DIP Test Clips
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Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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Product
Accelerometers - Special Purpose
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Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Product
Anti-Sulfurated Chip Resistor Array
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Attenuators
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The 01311 attenuator chip series is designed to achieve precision and tight flatness with an attenuation accuracy of ± 0.2 dB on our 1-10 dB pads and ± 0.3 dB on our 11-20 dB pads. SemiGen tests 100% of all attenuator chips prior to shipment to verify that they meet specifications.
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Product
Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
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IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Product
High Speed Spectroscopy Camera
SynapsePlus CCD
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Superfast electronics (up to thousands of spectra per second). Very low read noise. Best linearity in its class. Different chip types to suit every spectroscopy need. Open Electrode (OE) 1024 x 256 pixels, Front-illuminated UV enhanced (FIUV) - 2048 x 512 pixels, Front-illuminated visible (FIVS) - 2048 x 512 pixels, Back-illuminated UV enhanced (BIUV) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated visible (BIVS) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated deep depletion (BIDD) – 1024 x 256 pixels.
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Product
Respiration Sensor
X4M200
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The XeThru X4M200 is Novelda’s respiration sensor powered by the XeThru X4 system on chip. The standard sleep and respiration monitoring abilities are integrated in the sensor and provide advanced respiration and movement tracking both during the day and throughout the night. The programmable detection range up to 5 meters is a key feature for the sensor.
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Product
Dicing Machines
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Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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Product
32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-SD4U32N32-SBW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, Anti-sulfuration resistor. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
Step Recovery Diodes
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Macom Technology Solutions Holdings Inc.
MACOM’s Silicon and GaAs varactor multiplier diodes provide broadband performance ranging from 10 MHz to 70 GHz. They are ideal for multiplier circuits and are available in die form, plastic and ceramic packaging. These diodes boast a flip chip series for higher frequency millimeter wave applications; plastic packaged series for microwave frequency surface mount applications; ceramic packaged series for high power waveguide and coaxial applications.
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Product
In-Process Wafer Inspection System
7945
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Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
ALD Applications
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Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
N2,O2 Analyzer
P860 Series
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
P860 series analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%. It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation. - See more at: http://en.ci-ele.com/8aedb8bf-ef48-4f8c-127a-797c939a6181/54b8d904-ebc5-7b11-fc19-cf39baaa5889.shtml#sthash.0iShzAbt.dpuf
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Product
IGBT Drive
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IGBT gate drive photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a photo diode, signal processing circuit and power output transistor on the output side in a single chip. This coupler is designed specifically to provide high common mode transient immunity (CMR) and a high output current, and has an active miller clamp and high switching speed, making it ideal for driving IGBTs and MOS FETs.
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Product
8G SO-DDR3-1600 512X8 1.35V SAM -20~85℃
AQD-SD3L8GN16-SGH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
GO-NR1000 Near-Field Goniophotometer
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Hangzhou Everfine Photo-E-Info Co., LTD
Suitable for LED light source, LED chip, module and other small light source, the principal function includes: spatial light intensity distribution curve, spatial color distribution curve, iso-lux curve, total luminous flux, effective luminous flux, spatial luminance curve, etc.The test data can be saved as IESNA (*.ies), CIBSE (*.cib), EULUMDAT (*.ldt), CIE (*.cie), CEN (*.cen) and other formats, which can be directly used as the input data of international general lighting design software. Spatial luminance data can be imported into near-field lighting generation software to generate light data that can be imported into third parties (TracePro and LightTools).
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High-Speed Digital Output
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High-speed digital output photocouplers (optocouplers) are optically coupled high-speed, totem-pole output isolators containing a GaAlAs LED on the input side and a photodiode and signal processing circuit on the output side in a single chip.
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Product
32G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-D5V32GN48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Actuators, Adjusters, & Transducers
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We offer a wide range of adjustment screws, micrometers, and kinematic positioners, as well as stepper motor, DC servo, high-precision piezo inertia actuators, and voice coil actuators. Additionally, our piezoelectric offerings include modular, screw, and replaceable-tip piezoelectric actuators, as well as Langevin transducers for ultrasonic welding applications. A wide variety of piezoelectric chips and stacks are also available.
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Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
MKR Family
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The MKR Family is a series of boards, shields & carriers that can be combined to create amazing projects without any additional circuitry. Each board is equipped with a radio module (except MKR Zero), that enables Wi-Fi, Bluetooth®, LoRa®, Sigfox, NB-IoT communication. All boards in the family are based on the Cortex-M0 32-bit SAMD21 low power processor, and are equipped with a crypto chip for secure communication.
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Laser Diode
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Is a Polarization Maintaining CWDM Coaxial DFB-LD for CWDM analog communication, CATV return-path, laboratory instrument, and R&D applications. This cost-effective, high reliability DFB laser chip has a selectable wavelength with range between 1270 nm to 1610 nm. The versatile DFB-CWDM also features a built-in InGaAsP monitor photodiode, built-in optical isolator and 4-pin coaxial- pigtailed package, single mode coupling, and an FC/APC connector. Contact Optilab for more information.
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Product
IR Sensor
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The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
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Product
USB Solutions
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Arasan Chip Systems provides a complete suite of USB-compliant IP including low speed, high speed and super speed USB products. Arasan became a member of the USB-IF standards body in 1996 and delivered its first USB 1.0 IP product in that year. The offering expanded to USB 2.0 products in 2000 and USB 3.0 products in 2009. Arasan's customer base includes many major systems and SoC companies in variety of industries.
