Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
50μm Transparent Quartz Interdigitated Electrode Chip
IEQ1
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50μm transparent quartz IDE chip designed for gas sensing, biosensing, MEMS, and photoelectric applications.
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Product
High Speed Spectroscopy Camera
SynapsePlus CCD
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Superfast electronics (up to thousands of spectra per second). Very low read noise. Best linearity in its class. Different chip types to suit every spectroscopy need. Open Electrode (OE) 1024 x 256 pixels, Front-illuminated UV enhanced (FIUV) - 2048 x 512 pixels, Front-illuminated visible (FIVS) - 2048 x 512 pixels, Back-illuminated UV enhanced (BIUV) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated visible (BIVS) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated deep depletion (BIDD) – 1024 x 256 pixels.
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Product
20μm Silicon Interdigitated Electrode Chip
SBC1
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High-stability 20μm silicon IDE chip for MEMS, gas sensing, biosensing, and photoelectric applications.
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Product
SparkFun Analog/Digital MUX Breakout
CD74HC4067
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This is a breakout board for the very handy 16-Channel Analog/Digital Multiplexer/Demultiplexer CD74HC4067. This chip is like a rotary switch - it internally routes the common pin (COM in the schematic, SIG on the board) to one of 16 channel pins (CHANxx). It works with both digital and analog signals (the voltage can't be higher than VCC), and the connections function in either direction. To control it, connect 4 digital outputs to the chip's address select pins (S0-S3), and send it the binary address of the channel you want (see the datasheet for details). This allows you to connect up to 16 sensors to your system using only 5 pins!
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Product
Digitizer
742 Family
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The 742 is the Switched Capacitor Digitizer family, based on the DRS4 chip by PSI, with the highest sampling frequency (5GS/s) and channel density. It can record very fast signals from scintillators coupled to PMTs, Silicon Photomultipliers, APD, Diamond detectors and others, and save them with high efficiency and precision for advanced timing analysis. The 742 family has an additional channel (two channels in case of VME boards) which can be used as time reference for time of fight measurements. The resolution of this kind of measurements can reach up to 50 ps.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Thyristors Application Specific Devices
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A.S.D. (Application Specific Discretes) technology is a vertical integrated power technology using a full planar process. By applying the masking process on both sides of the chip, higher current density is achievable than is possible with epitaxial base or horizontal structures.
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Product
100μm Large Ceramic IDE Sensor Chip
LSC1
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100 μm large-size ceramic interdigitated electrode (IDE) sensor chip with a 10 × 20 mm sensing area. Designed for gas sensing, humidity monitoring, biosensing, and capacitive sensor research.
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Product
32G SO-DDR4-3200 2GX8 1.2V SAM -20~85℃
AQD-SD4U32GN32-SB2
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Single Channel Detectors
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Infrared detectors for gas analysis, flame detection and radiometry in TO18 or TO39 packages.Housing types TO18 and TO39Voltage or current modeSignal processing with JFET or operational amplifierThermally compensated (optional)With special chip holder for reducing the microphonic sensitivity (optional)
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Accelerometers
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Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Signal Integrity Products
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Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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Product
PXIe I/Q Arbitrary Waveform Generator, 16 bit, 540 MHz, 3 Scalar Channels
M9336A
Waveform Generator
The M9336A AWG delivers exceptional performance for creation of complex wideband waveforms. Multiple, 540 MHz bandwidth channels with 16-bit resolution and up to a 1.28 GSa/s sampling rate are provided in a single-slot PXIe instrument. This enables the AWG to generate wide bandwidth signals with low Error Vector Magnitude (EVM), making it ideal for creating baseband waveforms for wireless communications, radar, and satellite. The M9336A can also be combined with a wideband I/Q upconverter, resulting in modulation bandwidths of 1 GHz at RF frequencies for signal simulations employed in functional testing of chip sets designed for modern digital communications radios.
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Product
Pyroelectric Detectors
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Pyroelectric detectors are thermal detectors; i.e. they create an electric signal due to temperature changes in the chip. This temperature change is caused by absorption of light. We do use LiTaO3 and DLaTGS as pyroelectric materials. Basically such detectors cover the whole spectra. However, they are mainly used for mid-wave and long-wave infrared detection (MWIR and LWIR). In addition, the usage in the THz region seems to become more popular these days.
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Product
Low Light USB Camera With Microphone
Conversa
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Conversa, camera for conversation (See3CAM_CU38), is a 3.4 MP low light USB 3.1 Gen1 camera with built-in stereo microphone providing 16bit audio @48KHz. This low-light USB camera is the next advanced version of our flagship product See3CAM_CU30, with built-in stereo microphone for crystal clear sound. It is a plug-and-play (UVC and UAC) compliant USB 3.1 Gen1 SuperSpeed camera and is also backward compatible with USB 2.0 host ports. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control).
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Coating And Finish Durability
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Our capabilities: Adhesion. Impact Resistance. Gravelometer. Chemical Resistance. Cyclic Corrosion. Hardness. Chipping. Resistance. Water Immersion
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Product
System Level Test
SLT
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As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Product
Caibration Equipment For Lab Use
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In the field of high-power semiconductor testing, PONOVO has launched a smart test platform with high-speed high-frequency, high-voltage, high-current power sources, combined with high-speed, high-precision high-voltage, high-current analog acquisition technology and high-speed digital processing control system. The platform can complete the testing of dynamic parameter parameters, static parameters, thermal parameters and mechanical parameters, and power life parameter of various types of high-power semiconductor devices, modules, and chips, which could meet different testing requirements. It is the universal testing platform for automated testing for different application purpose, such as the research and development testing, engineering acceptance test, factory acceptance test, etc.
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Product
Digitizer
743 Family
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The 743 is the Switched Capacitor Digitizer family, based on the SAMLONG chip and developed in collaboration with CEA/IRFU, with a good compromise between high sampling frequency (3.2GS/s) and channel density. It can record very fast signals from scintillators coupled to PMTs, Silicon Photomultipliers, APD, Diamond detectors and others, and save them with high efficiency and precision for advanced timing analysis.
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Product
SMT Rework Station
RW1210
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Safely and precisely rework SMD, BGA, or LED chips. This all-in-one solution covers rework needs for even the most complex, densely populated PCBAs. Yet it is easy to use, enabling technicians to quickly master delicate alignment, placement, and heating controls.
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Product
Alchitry Au+ FPGA Development Board (Xilinx Artix 7)
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The Alchitry Au+ is the "gold" standard for FPGA development boards and it's possibly one of the strongest boards of its type on the market. The Au+ substitutes a more robust & scalable FPGA chip (Xilinx XC7A100T) that allows for more complex application circuits. The number of Configurable logic blocks (LABs/CLBs), Logic Elements, and total RAM bits are all nearly 3x that of the standard Au; see "Features" for more details.
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SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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Product
Registered DIMM
SQR-RD5N
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Registered DIMM DDR5 4800/5600/6400, Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB, 100% Screening Test. Compatible with server platform, Original IC chip adopted.
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Product
Low TCR High Power Current Sensing Resistors, Wide Terminal Type
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Panasonic Industrial Devices Sales Company of America
Panasonic's ERJ-D1 and ERJ-D2 Series, Low TCR High Power Current Sensing Chip Resistors, achieve high power and low TCR (±100×10–6/°C) using a wide terminal electrode structure and original materials.These Resistors are suitable for small size/high power current detection and their low TCR enables high accuracy of current detection. The ERJ-D1 Series features higher rated power at 2W in a 1020 case size while the ERJ-D2 Series features 1W in a 0612 case size. These Resistors are AEC-Q200 Compliant and offer IEC 60115-8, JIS C 5201-8 and EIAJ RC-2134B Reference Standards ensuring optimal quality and reliability.
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Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Patented DPEM Process for Die Removal
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DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
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Product
16GB ECC SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GE56-SB
Memory Module
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Probing Machines
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Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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Product
16 Channel Multihit TDC
VX1290N-2eSST
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The VX1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs.
