Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Cryogenic Temperature Sensors
Cernox®
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Cernox® thin film resistance cryogenic temperature sensors offer significant advantages over comparable bulk or thick film resistance sensors. The smaller package size of these thin film sensors makes them useful in a broader range of experimental mounting schemes, and they are also available in chip form. They are easily mounted in packages designed for excellent heat transfer, yielding a characteristic thermal response time much faster than possible, with bulk devices requiring strain-free mounting. Additionally, Cernox sensors have been proven very stable over repeated thermal cycling and under extended exposure to ionizing radiation.
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Product
Precision Curve Tracer
CurveMasterTM
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The CurveMasterTM delivers new price/performance efficiency to curve tracing and Failure Analysis. Curve trace has been a standard feature in our full-power chip tester for years, so the CurveMasterTM is built with today’s components and technology. With all new high-accuracy DC Parametrics, you’ll enjoy the most powerful curve tracer you have ever used.
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Product
SMARC
ROM-7421
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ROM-7421 Qseven Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be Linux support ready. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Product
Video Signal Generator
MSPG-6100L
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MSPG-6100L is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV9NTSC, PAL), as well as V-Chip (Violence Chip) function to block the violence and sex, etc. bad program to protect a person under age through the regulation grade.
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Product
4G SO-DDR3-1600 512X8 1.35V SAM -40~85C
AQD-SD3L4GN16-SGW
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30u" Gold Plating Thickness, Anti-sulfurization resistance, Samsung original chip, Wide Temp. -40C to +85C, 100% tested for stability, compatibility and performance.
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Product
IC Test Clips
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Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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Product
16G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃
AQD-SD4U16GN32-SE1
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Lithography Systems
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When it comes to shaping what a chip can do, lithography systems lead the way by transferring intricate circuit designs onto substrates with unmatched precision. From prototyping to high-volume manufacturing, these tools define the geometry of modern microchips, as well performance.
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Product
JTAG (and IJTAG) Environment Tool Suite
SAJE
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SAJE is the SiliconAid Suite of JTAG related standards focused tools for chip development, verification, validation and patterns generation of ATE, Board, and System Test. Each tool can be used as a point tool by itself to compliment other tools in your flow. However, the SAJE Tool Suite used together in a flow can provide a total solution that also leveraging previous steps for debug and analysis.
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Product
Receiver Conformance Test Application for IEEE 802.3ck
M8091CKCA
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Designed to assist and simplify the stress signal calibration used for testing the inputs of IEEE 802.3ck Draft 3.3 chip-to-chip (C2C) and chip-to-module (C2M) electrical interfaces using Keysight M8040A 64Gbaud Higher Performance BERT or an M8050A 120Gbd High-Performance BERT together with Keysight Digital Communication Analyzer (DCA) Oscilloscope or Infiniium UXR real-time Oscilloscope.
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Product
High Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Generates Test Cases on ICE
TrekSoC-Si
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TrekSoC-Si automatically generates self-verifying C test cases to run on the embedded processors in SoCs in in-circuit emulation (ICE), FPGA prototyping, and production silicon. This verifies your chips more quickly and more thoroughly than hand-written diagnostics or running only production code on the processors. TrekSoC-Si's generated test cases target all aspects of full-SoC verification and work in a variety of different environments. TrekSoC-Si is a companion to TrekSoC, which generates test cases for simulation and acceleration. TrekSoC-Si extends the benefits of TrekSoC into hardware platforms.
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Product
Structural Test ICP® Accelerometers
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Conventional structural test data systems use few to several hundred sensors. Cables bundles can be complex and confusing resulting in setup errors. Sensors with TEDS (Transducer Electronic Data Sheet) allow for an internal sensor digital chip to store sensor information. This information contains descriptive identifiers that when connected to a TEDS compatible signal conditioner or data system, reads the descriptive information and automatically aligns the data system. Human error is minimized, reducing time consuming data verification or re-test. The Series 333 ICP® accelerometers, and their accessories, are designed to address the needs of multi-point modal and structural test measurement applications. This equipment was developed in conjunction with the world renowned University of Cincinnati Structural Dynamics Research Laboratory and proven in real-world testing situations. The PCB 333 Series accelerometers delivers rapid system setup, reduces human documentation errors, maintains calibration data of each sensor, allows for “Plug-and-Play” installation, reduces overall test time lowering project test costs.
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Product
DDR3 SODIMM
SQR-HS3I
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Original Samsung/Micron IC chips adapted, Heatsink attached. Data transfer rate: 1600 MT/s, Operating temperature: -40 °C ~ 85 °C, 3years longevity, Fixed BOM, Lifetime warranty.
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Product
RF/Microwave Assembly Capability
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Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Product
O2/N2 Analyzers
GNL-2100 Series
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
GNL-2100 analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%. It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation.
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Product
Smart Lighting
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The AS721x/AS722x are complete System-on-Chip (SoC) sensor-integrated IoT smart lighting managers for color-tunable white lighting applications. They also support daylight harvesting and color/lumen maintenance lighting applications. 0-10V control and network-enabled high-level command inputs are combined with industry-standard PWM and 0-10V outputs for direct control of LED power systems.
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Product
100 High Speed Programmer
Commander Accelerator
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The Commander High Speed Programmer (HSP) is low overhead system designed to test Flash Memories, PLA's and Micro-controllers. The parallel multi-module architecture provides the flexibility to program and test multiple devices. It's full-featured capabilities support chip erasing and programming, sector erasing and programming, sector protect and unprotect, and data verification functions.
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Product
0 Hz/DC to 14 GHz, Single-Pole, Four-Throw MEMS Switch With Integrated Driver
ADGM1304
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The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small, wide bandwidth, highly linear, low insertion loss switch that is operational down to 0 Hz/dc, making it an ideal switching solution for a wide range of RF applications. An integrated control chip generates the high voltage necessary to electrostatically actuate the switch via a complementary metal-oxide semiconductor (CMOS)-/low voltage transistor-transistor logic (LVTTL)-compatible parallel interface. All four switches are independently controllable. The ADGM1304 is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm lead frame chip-scale package (LFCSP).
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Product
ARM LPC2364 Board
MS 1541
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- 128KB On chip Flash- 16*2 line LCD Module interface- Two CAN channel at 1MPBS- Ethernet interface which supports 10/100 MBPS- Full Modem RS232 interface- RS485 interface- RTC (Real Time Clock)- 2048 bits serial EEPROM with data protect and sequential read.- 24 ULN outputs of 12V level.- Eight 110V DC inputs interface.- Six digital inputs interface- Four on board keys interface- Power delay circuit for external use- ON board inspection circuit
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
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Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
4K UHD Fanless Edge Computer
UBX-110K
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The UBX-110K is a 4K UHD fanless edge computer powered by an Intel® N97 or Core™ i3-N305 processor. Built-in an Intel® N97 or Core™ i3-N305 processor, Built-in a TPM 2.0 chip for data encryption enhancement. Supports triple displays to expand the visible range and provide detailed video content. Supports two M.2 2280 SATA SSD expansions.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
SparkFun USB To Serial Breakout
FT232RL
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This is the SparkFun USB to Serial Breakout for the FT232RL, a small board with a built in USB to serial UART interface. This little breakout is built around the FT232RL IC from FTDI, with an internal oscillator, EEPROM, and a 28-pin SSOP package this is a serious little chip.
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Product
Registered DIMM
SQR-RD5N
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Registered DIMM DDR5 4800/5600/6400, Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB, 100% Screening Test. Compatible with server platform, Original IC chip adopted.
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Product
High Speed High Mix Pick And Place
MC389
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The MC389 sets new standards for SMT pick and place speed, precision, and flexibility. Based on the MC Series’ durable ball-screw and rotary-encoded drive train, its three heads and on-the-fly vision allow accurate placement of any SMD (including 01005 chips, µBGAs, and 12-mil pitch QFPs). With an enormous placement area of 650 mm x 460 mm (25.6" x 18.1") and a capacity for up to 160 Smart Tape and Stick Feeders, the MC389 can easily be configured for virtually any high-mix project.
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Product
PC/104 Single Board Computer with Vortex86DX3 System-on-Chip
CM1-86DX3
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The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. Two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, two USB 2.0 host controller to handle the communication with external devices. There are PS/2 connectors for keyboard and mouse. A first generation SATA interface allows the connection of hard disk or CD drive. CFast is also available. System expansion can easily be realized over the PC/104 bus connectors.
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Product
64 Channel Multihit TDC
V1190B-2eSST
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The V1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
RF Signal Generators
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The G6 VSG from Transcom Instruments is a Vector Signal Generator that operates from 10 MHz to 6 GHz. It can simulate GSM, EDGE, CDMA, TD-SCDMA, WCDMA, CDMA2000, TD-LTE, FDD-LTE, NB-IoT, and LoRa base station signals for production and calibration of UE, chips. The signal generator has a dynamic range (power range) from -100 to 10 dBm and an in-built automatic gain control function. It is available in a module that measures 180 x 50 x 290 mm and is ideal for educational practices, wireless monitoring, mobile communication, aerospace and national defense industry in terms of research, manufacturing, testing and measurement, and electronic countermeasure.
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Product
PCIe Gen 4 Switch Adapter
P411W-32P
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The Broadcom P411W-32P is the industry’s first fully managed Gen 4.0 NVMe switch adapter, providing enterprise class options for NVMe solid state drive (SSD) attach requirements. The P411W-32P leverages Broadcom’s world-class board design, PEX88048 PCIe Gen 4.0 switch chip, and solid firmware expertise, to provide advanced features not available using traditional NVMe drive attach methods. Similar to Broadcom HBAs, the P411W-32P adapter is supplied with fully validated and supported firmware and standards based out of band manageability features.
