Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
64 Channel Multihit TDC
VX1190B-2eSST
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The VX1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
CMOS Cameras
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A digital still or video camera that uses a CMOS-based image sensor chip rather than a CCD to record the picture.
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Product
Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Product
Electronic Ballast Analyzer
WT3000
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• It has 8 windows to display each parameter of input and output characteristics • Frequency response for testing input current up to 1MHz, suitable for precise testing of various kind of electronic ballast • WT3000 has expanding analysis for envelope wave. • Symmetry analysis for envelope wave’s crest factor of lamp current • Sampling at ultra-high speed, dynamic analysis single frequency curve, highest sampling frequency is up to 10MHz • Portable with built-in chip micro-processor, particular suitable for development and spot production • RS-232C standard interface can be connected to PC, English version software can run in WinXP or Win7
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Product
Manual Label-Free Molecular Interaction Analysis Machine, Flexible Research Platform
OpenPleX
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Designed to meet the demands of biologists, biochemists and biophysicists, the OpenPlex is a flexible surface plasmon resonance imaging system.OpenPlex is your companion for the development of label-free and multiplexed bio-assays and molecule detection. It is a robust and compact system designed for simple use and high versatility. Its open format, dedicated sensor chips and manual operation enable numerous types of experiments to be explored without compromise, covering chemistry, biochemistry, physico-chemistry and biomolecular interactions.
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Product
TRA-300 LED Thermal Resistance Structure Analyzer
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Hangzhou Everfine Photo-E-Info Co., LTD
The TRA-300 accurately measures the thermal resistance, junction temperature, optical power, voltage, current and other parameters of LED packaging products.The heating and cooling curves of LED can also be obtained, and the integral and differential thermal structure functions can be obtained by establishing the finite element model.Through the structural function analysis of the TRA-300 special software, the fine thermal resistance structure of the LED (from the chip to the thermal resistance value of each package structure) can be obtained, so as to objectively evaluate the heat dissipation quality and thermal management level of the LED package products, and provide the best verification for the heat dissipation design of the LED.
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Product
Electronic Ballast Production Line Tester
UI2000-OK
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• Eight windows for displaying input characteristics, output characteristics, convenient for comparison and analysis. • Frequency response for testing input current up to 1 MHz, suitable for precise testing of various kind of electronic ballast. • High speed testing, finish testing input and output characteristics within 1 minute. • Portable with built-in chip micro-processor, particular suitable for development and spot production. • Parameters, waves and curves of input, output and startup can be printed. • Communicating with PC, special software provided and both Chinese version and English version available. Run in WINDOWS3.2, WINDOW95 or WINDOWS98, nice interface between people and computer, easy to operate.
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Product
4-20mA Current Loop D/A Converters
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ADI integrated solutions combine both the D/A converter and driver in one chip to provide the required output directly from the digital domain. Analog Devices’ portfolio of leading industrial D/A converters and drivers provides a range of programmable output ranges from standard 4 mA to 20 mA for current loop communication to ±10 V for actuator control. ADI industrial converters offer considerable control functionality and advanced on-chip diagnostics to maximize system uptime, as well as eliminate the need for costly calibration routines needed by some traditional discrete architectures.
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Product
Universal Counter (225MHz - 9GHz)
S43131
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S43131 series universal counter is the high-precision frequency and time measuring instrument developed by Saluki Technology. It adopts the high-performance single chip microcomputer as the core to conduct function control, survey time sequence control, data processing and result display. Adopt the countdown counting technique and digital interpolation technique to realize high-precision measurement within the whole range.S43131 series universal counter has stable performance, complete function, wide measurement range, high sensitivity, large dynamic range, high precision, small volume and convenient and reliable use. It has wide application in industrial production, scientific research and measurement and other fields, and is the ideal upgraded and renewed product of the traditional electronic counter.
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Product
Signal Integrity Products
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Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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Product
Microelectro Mechanical Systems And MEMS Sensors
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NevadaNano has spent a decade integrating multiple, complementary chemical sensors on a single silicon chip. We call it the Molecular Property Spectrometer™ (MPS™). The MPS Gas Sensor works together to measure a variety of thermodynamic and electrostatic molecular properties of sampled vapors, liquids, and particles. In less than a second, the chip creates a large, rich dataset of chemical information. Then, Custom MPS software identifies the types of molecules present in an unknown sample.
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Product
KV CAPS
500 V
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Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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Product
Capacitors - MNS Series
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Macom Technology Solutions Holdings Inc.
MACOM's chip capacitors are used extensively in commercial and aerospace and defense applications. Our capacitors are designed for long-term reliability and repeatable performance in a variety of hybrid microwave circuit applications operating up through the Ku-band frequency. MACOM’s capacitors have the distinct advantage of higher capacitance per unit area, resulting in smaller chips for a given capacitance.
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Product
Motion Control Solutions
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DDC offers a complete line of Synchro/Resolver instrument-grade cards and test equipment including angle position indication and simulation, plus a variety of hardware and software to meet today’s civil, military, and COTS/MOTS requirements. DDC is a leading supplier of Synchro/Resolver-to-Digital and Digital-to-Synchro/Resolver components—the smallest, most accurate synchro/resolver-to-digital and digital-to-synchro/resolver converters available today. Most of these single chip and hybrid converters are based on ASIC designs, yielding the most reliable and affordable converters ever offered, and are the building blocks for DDC’s card-level products.
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Product
USB Solutions
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Arasan Chip Systems provides a complete suite of USB-compliant IP including low speed, high speed and super speed USB products. Arasan became a member of the USB-IF standards body in 1996 and delivered its first USB 1.0 IP product in that year. The offering expanded to USB 2.0 products in 2000 and USB 3.0 products in 2009. Arasan's customer base includes many major systems and SoC companies in variety of industries.
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
Digital I/O Board
P104-DIO-96
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Each I/O line of this card is buffered and capable of sourcing 32mA, or sinking 64mA. The board simulates Programmable Peripheral Interface chips (PPI) to provide a computer interface to digital I/O lines. Each PPI supports two 8-bit ports (A, B) and two 4-bit ports (Chi, Clow). Each port can be configured to function as either input or output latches. The I/O line buffers (types 74ABT240 and 74ABT245) are configured automatically by hardware logic for input or output according to the PPI Control Register direction software assignment.
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Product
128 Channel Multihit TDC
VX1190A-2eSST
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The VX1190A-2eSST is a 128 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
Laser Diode
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Is a Polarization Maintaining CWDM Coaxial DFB-LD for CWDM analog communication, CATV return-path, laboratory instrument, and R&D applications. This cost-effective, high reliability DFB laser chip has a selectable wavelength with range between 1270 nm to 1610 nm. The versatile DFB-CWDM also features a built-in InGaAsP monitor photodiode, built-in optical isolator and 4-pin coaxial- pigtailed package, single mode coupling, and an FC/APC connector. Contact Optilab for more information.
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Product
MIPI Video Devices
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The abundance of the MIPI® interface in mobile applications has driven its proliferation into other application areas such as the automotive and broader consumer environments. Analog Devices, an established provider of video products, offers a range of MIPI video devices that provide interfaces to the latest generations of system on chip (SoC) processors. Typical applications for MIPI video devices include the rear-view camera function in the automotive environment and HDMI® output from portable devices featuring a MIPI-capable SoC. The MIPI video device portfolio offers a variety of solutions.
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Product
High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
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The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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Product
Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
On-Chip Debugging Emulator
E2 Emulator
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The new E2 emulator is an advanced on-chip debugging emulator and flash programmer developed based on a concept of "improvement of development efficiency". The download speed is up to twice as fast as the E1 emulator. Moreover, new solutions contributing to reduction in development time will be available.
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Step Recovery Diodes
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SemiGen’s SSR series of Step Recovery Diodes are epitaxial silicon varactors which provide high output power and efficiencies in harmonic generator applications. Using custom epitaxial wafers, our process ensures high reproducibility. The silicon dioxide passivation process assures greater stability and low leakage currents over temperature. Uniform capacitance ensures repeatability from device to device. These diodes are available in chip or packaged form.
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Product
Power Management and System Basis ICs
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ST provides a large selection of Power Management ICs and System Basis Chips (SBC) specifically designed for automotive electronic systems.
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Product
Radar Core Chips
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Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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Product
Structural Test ICP® Accelerometers
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Conventional structural test data systems use few to several hundred sensors. Cables bundles can be complex and confusing resulting in setup errors. Sensors with TEDS (Transducer Electronic Data Sheet) allow for an internal sensor digital chip to store sensor information. This information contains descriptive identifiers that when connected to a TEDS compatible signal conditioner or data system, reads the descriptive information and automatically aligns the data system. Human error is minimized, reducing time consuming data verification or re-test. The Series 333 ICP® accelerometers, and their accessories, are designed to address the needs of multi-point modal and structural test measurement applications. This equipment was developed in conjunction with the world renowned University of Cincinnati Structural Dynamics Research Laboratory and proven in real-world testing situations. The PCB 333 Series accelerometers delivers rapid system setup, reduces human documentation errors, maintains calibration data of each sensor, allows for “Plug-and-Play” installation, reduces overall test time lowering project test costs.
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Product
Cost-Effective ATE System
PRO RACK ATE
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Qmax Test Technologies Pvt. Ltd.
Pro-Rack is a cost effective ATE System, which comes with Modular Structure provision option to improvise and enhance much instrumentation based on the user’s requirements. Basically it is designed to cater to the needs of PCB test and repair depots, keeping in mind the changing PCB technology and the challenges in testing them off-line. It can provide complete PCB test and diagnostic functions for any kind of PCB including the latest very high density complex PCBs with high pin count PQFP, FPGA VLSI chips. AC /DC parametric tests enables testing of the DC parametric of device pins on the edge connector for input bias current, Fan out capacity ,Tri-state leakage currents, AC parametric measurements such as Input / Output Propagation delay Rise time / Fall time to further enhance fault coverage. Pro-Rack is designed with VPC Mass Interconnect adapter with 16 bit fixture ID interface to the UUT through simple clips and probes or through card edge or through a bed of nail test fixture.
