Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Chip Obsolescence Solutions
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Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Chip Tester
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Chip aging test is a very important task. It simulates various environmental and stress conditions of the chip during long-term use, evaluates its reliability and life, and provides effective reference and guidance for chip product design and manufacturing. It is necessary to select high-quality chip testers to ensure accurate test data, thereby further improving the reliability and life of chip products.
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Chip Tester
TL2000
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ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
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100μm Large Ceramic IDE Sensor Chip
LSC1
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100 μm large-size ceramic interdigitated electrode (IDE) sensor chip with a 10 × 20 mm sensing area. Designed for gas sensing, humidity monitoring, biosensing, and capacitive sensor research.
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Chip Inductors-Multilayer
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Bourns Miltilayer chip inductors offer high frequency, nickel barrier, monolithic construction for high reliability, and magnetically shielded construction providing low radiation. They are well-suited for DC-DC converters, and prevention of electromagnetic interference to signals on the secondary side of electronic equipment, among many applications.
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Chip Test Adapter
SOJ EDO/FPM
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Our new addition to the RAMCHECK line provides support for common 20 to 42-pin EDO/FPM DRAM SOJ chips of sizes 256Kx16/18, 1Mx16/18, 8Mx8, 16Mx4, 2Mx8, 4Mx4, 16Mx1, 1Mx4, and 4Mx1.
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Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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20μm Transparent Quartz Interdigitated Electrode Chip
TIG1
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20μm transparent quartz IDE chip designed for MEMS, gas sensing, biosensing, electrochemical, and photoelectric applications.
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16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
High Voltage Thick Film Chip Resistors
HVTK (HVR)
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*Highly reliable multilayer electrode construction*Higher component and equipment reliability*Excellent performance at high voltage*Reduced size of final equipment
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6 Chip Detection and Burn Channels
CD1
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The CD1 provides 6 Chip Detect and Fuzz Burn interface(s). A Chip Detector (CD) is a magnetic-electrical device that provides a reliable method of detecting impending failure of bearings and gears.
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16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
Memory Module
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Chip Inductors
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Our range of various chip inductor products contain the very latest in wire-wound technology and Ceramic or Ferrite Core, thus providing the ultimate in performance demanded by today’s Wireless products. The Inductors provide high Q and SRFs in an industry standard size and footprint.
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High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
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The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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SMD/Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of SMD/Chip Resistors including conventional Thick Film and Precision Thick Chip Resistors as well as specialized Resistors such as Thin Film, Metal Film Chip, Current Sense and more.
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32GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V32GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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5μm Transparent Quartz Interdigitated Electrode Chip
TIM1
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5μm transparent quartz IDE chip designed for MEMS, gas sensing, bioelectrochemical, and photoelectric applications.
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5μm Transparent Quartz Interdigitated Electrode Chip
TIF1
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5μm transparent quartz IDE chip designed for MEMS, biosensing, gas sensing, electrochemical, and photoelectric applications.
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Thin Film/Metal Film Chip SMD Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic’s industry leading Thin-Film Chip Resistors features include high reliability at high temperature and high humidity as well as high accuracy, low current noise and excellent linearity. Panasonic’s High Precision Thin Film Resistors are designed for robust applications where long life is crucial in markets such as automotive, appliance or industrial. These Resistors boast a high accuracy of up to 10ppm, 0.05% making them one of the best-in-class Resistors on the market today. Panasonic Thin-Film Resistors are available in case sizes down to 0201. Compliant standards include: IEC 60115-8, JIS C 5201-8, and EIAJ RC-2133B. These Resistors are AEC-Q200 Certified.
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50μm Transparent Quartz Interdigitated Electrode Chip
IEQ1
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50μm transparent quartz IDE chip designed for gas sensing, biosensing, MEMS, and photoelectric applications.
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Automotive System-on-Chip (SoC)
R-Car
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"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
300μm Ceramic Interdigitated Electrode Chip
CIA1
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The CIA1 300um Ceramic Interdigitated Electrode Chip is designed for gas sensing, humidity sensing, biosensing, impedance measurement, and MEMS-related electrochemical or electrical detection research.
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16GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Chip Resistor Networks
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Panasonic Industrial Devices Sales Company of America
Chip Resistor Networks by Panasonic
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4μm Transparent Quartz Interdigitated Electrode Chip
TIA1
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4μm transparent quartz IDE chip designed for MEMS, gas sensing, biosensing, and photoelectric applications.
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SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
Computer on Module
- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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Anti-Sulfurated High Power Wide Terminal Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Metal Foil Llow Resistance Chip Resistor
MFR (Metal foil)
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*Low Resistance / TCR / EMF 9only FOR MnCu) / Inductance*Excellent long term stability*RoHS compliant and halogen free.*Lead free.* High precision current sensing and voltage division.
