Integrated Development Environment
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Product
Integrated Leeb Hardness Tester
TIME®510D
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Beijing TIME High Technology Ltd.
TIME®510D is an updated version of TIME5120 Leeb Hardness Tester, the cheapest and most popular leeb hardness tester manufacturer by TIME. It is portable and integrated with universal impact device D. Compared to TIME5120, the new product offers significant improvements in both outlook and performance.
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Product
Time Delay and Integration (TDI) Line Scan Camera
Piranha HS
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The Piranha HS cameras provide an alternative to traditional line scan imaging. They enable you to meet the line rates and responsivity necessary for your high performance applications and allow you to reduce the number of cameras in your system. When you use fewer cameras, you use fewer framegrabbers, lenses, computers and cables. The Piranha HS family delivers the lowest price/pixel TDI system solution ever offered by Teledyne DALSA. Lighting costs can also be reduced. With TDI imaging, you can use LED lights, helping you to optimize system up-time and productivity.
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Product
Integration Spheres
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Offers a wide range of integration spheres (0.25m to 3 m diameter) and spectrometer options, application-specific modules as well.
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Product
LED Tester0.3m-2m Integrating Sphere
CX-8000
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Shenzhen Chuangxin Instruments Co., Ltd.
Measure Luminous Flux, Luminous efficacy, radiant power, Spectral Power Distribution, Chromaticity Coordinate, Correlated Color Temperature, Peak Wavelength, Dominant Wavelength, Spectral Half Width, Color Rendering Index, Colorimetric Purity, red ratio, Standard deviation of color matching(SDCM), voltage, current, power, power factor, harmonics, and etc. It meets the requirements of CIE standards.
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Product
Universal Development Board For The PCAN-MicroMod CPU
PCAN MicroMod Evaluation Kit
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As a plug-in module, the PCAN-MicroMod represents a simple way of providing electronic circuits with I/O functionality and CAN connection. The configuration is carried out with a Windows program that transfers the configuration data to the module via CAN. Several modules can be configured independently of one another on a CAN bus.
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Product
Lifecycle Support for Custom Product Development
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The parts and components that are rooted in idea generation and product development are the ones that are most likely to succeed. Electri-Cord’s lifecycle support for the production and manufacturing of custom wiring harnesses, cable assemblies, power cords, and high-level assemblies incorporates a four-stage approach that covers the lifespan of the product. This custom product development process includes everything from design prototyping to end-of-life processes.
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Product
Integrated Solution for Digital Switching & Fiber Optics Operational Verification
VERTA
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When incorporated into defense/aerospace ATE, Verta enables reliable, error-free bus communication and interoperability tests to verify performance of high-speed, optically networked military weapon assemblies.
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Product
Built For Demanding Environments, The AIM-77S Rugged Case Delivers Reliable Protection With Drop Resistance Up To 120 Cm Onto Plywood.
AIM-77S Rugged Case
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Operating Temperature: 0°C ~ 40°C (32°F ~ 104°F)Storage Temperature: -10°C ~ 60°C (14°F ~ 140°F)Humidity: 90% @40°C (non-condensing)Drop Protection: up to 120cm onto plywood
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Product
Built-in MOSFET Integrated SiP
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Renesas Electronics offers SiP products with integrated MOSFETs to enable easy configuration of high-performance multi-phase power supplies. They combine in a single package either controller, driver, and MOSFETs or driver and MOSFETs. These products make it easy to build a high-performance DC/DC converter while reducing stray capacitance and inductance, and achieving higher mounting density.
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Product
12/13/14th Gen Intel® Core™ Processor LGA1700 NVIDIA Quadro MXM GPU Integration
AIMB-288E B1
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12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport NVIDIA Quadro Embedded MXM GPUUp to 96GB DDR5 5600 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 22.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Product
Compact & Flexible Test Systems for FCT,ICT, ISP and Boundary Scan Designed for Easy Integration
LEON Rack
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The LEONRack test system is a flexible test system that could be installed in automation or handling solutions. It is highly flexible and available in three different chassis sizes from low pin count to high pin count test systems. As part of the LEON Family, LEONRack is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
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Machine Setup & Integration
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Realize the true ROI of integrating pressure-mapping capabilities into your machine design.
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Product
Development Board
SOM-DH7000
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Development Board for COM-HPC® Extension Modules. COM-HPC® Extension Size E, RunBMCv1.5 260pin socket interface (A2). 1 PCIe x1 reserved for BMC add-in card (A1) Rich extension: 4 x PCIe x16, 1 PCIe x8, 1 PCIe x4, 2 PCIex1 (Gen 5).
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Product
Integrated Vision System
In-Sight 7000
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In-Sight 7000 FeaturesYou will find so many machine vision applications for the award-winning In-Sight 7000 series of vision systems. These completely integrated smart cameras feature autofocus, fast image capture, integrated lighting and lens with powerful vision tools for inspection, color, OCR applications and more. They also have the capability to power and control a range of external lightingall in a compact, industrial IP67 package.
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Product
Development Switch
TTEMonitoring Switch, 1 Gbit/s, 12 Ports
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To complement the existing offering of development products, the TTEMonitoring Switch 1 Gbit/s 12 +1 Ports supports the fast online-mirroring of real-time data streams going through the 12 +1 operational ports of the switch. This switch provides 12 + 1 x 1 Gbit/s full duplex ports which can be equipped with small form-factor pluggable (SFP) modules. Electrical (1000 Base-TX) and optical (1000 Base-SX) SFPs are available.
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Product
COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
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Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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Product
CANdo Software Development Kit
SDK
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The CANdo SDK (Software Development Kit) is designed to provide a quick & easy way of integrating the CANdo Interface into any Windows program, written in a programming language that supports Windows DLLs. Example projects are provided written in C, C++, C#, VB & Delphi.
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Product
Constant Temperature Integrating Sphere
IS-*MT
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According to requirement of IEC standards, the standard test temperature is 25℃, but high power lamps such as HID lamps and LED outdoor luminaires will produce a lot of heat during the test, thus the temperature inside the integrating sphere can not meet the requirements of IEC standards. Lisun Group designed the Constant Temperatured Integrating Sphere which allows the lamp was tested in a constant air temperature.
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Product
I-Pi SMARC Development Kit based on Qualcomm® Robotics RB5 Platform
I-Pi SMARC RB5
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The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit harnessing ADLINK LEC-RB5, powered by the Qualcomm® QRB5165 SoC with Qualcomm® Kyro™ 585 octa-core CPU (8x Arm Cortex-A77), and Qualcomm® AI Engine.
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Multi-Band Quad-Channel Receiver/Combiner, 4U Rack Mount System with Integral Tracking Receivers and Bit Syncs
LS-28-QRS
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Lumistar offers the LS-28 series of high performance multi-band multi-mode RF Receiver/Combiners in several different versions including rack mount, portable and modular formats. Complete solutions from RF to bits and/or RF to UDP data broadcast in Chapter 10 format are available. Available at any frequency range from 215 MHz to 6000 MHz, data rates to 50 Mbps.
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High Performance Embedded Development Kit
TySOM EDK
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The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.
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Product
Sound and Light Controlled Environment
SmartChamber
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SmartChamber provides a sound isolated, ventilated and light controlled environment to perform high performance ultrasonic vocalization experiments. The chamber can be provided with a built-in Sonotrack ultrasonic microphone and has an interior which effectively removes sound echo's, external noise and sounds and magnetic fields. SmartChamber can be seamlessly integrated with our product Sonotrack
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Product
Test & Test Development for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions performs comprehensive testing at the CCA and system level assembly. Teledyne AES can perform testing developed by the customer or develop a complete test strategy for the customer’s products.- Bed of Nails FixtureIn-Circuit Test (Bed of Nails) or Flying Probe Testing for rapid feedback on CCAs- Functional testing of CCAs or complete systems- Environmental testing to include vibration, thermal cycling, HASS, etc.- CCA and system level test development- High frequency testing – currently to 40 GHz- High power system testing – currently to 4kW
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Integration testing
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Integration testing primarily focuses on verifying data communication among different modules of the software project. Integration tests determine the effectiveness and performance of different software modules when they are connected to each other.
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Integrated Two-Stage Current Sensors
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If ultra-low noise performance is required, our integrated two stage devices are the number one choice. With input inductances from 24 nH to 1.8 µH and a flux-noise level as low as 0.8 µPhi0/sqrt(Hz) an energy resolution of about 45 h is attained. The devices consist of a 16 SQUID series array as amplifier stage and a single front-end SQUID.
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Integrated Solution for Control and Automation
One
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Building new machines for today’s smart factories requires sophisticated control and automation that can only be delivered through multiple solutions and components – including a PLC, HMI, I/Os and motion components such as AC Servo systems and VFDs. As all components must be integrated, selecting the right combination is crucial to the efficiency and success of any project.
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Product
Software Development Projects
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Precision Development Consulting Inc
Automation of new process tool prototype in startup environment, Complex R&D Gasbox Automation, Semiconductor System Control Software, Wafer Transfer Control Software, 300mm Factory Automation, Complete port of Spectrometer software to windows, HSMS Protocol
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Photo Detector with Integrated Transimpedance Amplifiers
ADN3010-11
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Analog Devices optoelectronic amplifiers include a range of germanium photodiodes that, through a proprietary process, have been monolithically integrated with silicon transimpedance amplifiers and limiting amplifiers. This process eliminates the need for bond wires connecting the photodiode to the transimpedance amplifier, which leads to improved performance and greater manufacturing reliability. Our portfolio of products also supports the growing need for optical and electrical interface miniaturization.
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Integrated Frequency to Voltage Converter
FV
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The FV6 Frequency to Voltage Module provides a convenient method of converting up to six frequency signals to analog voltages that can be fed into common data acquisition equipment.
