Discrete Semiconductor
semiconductor typically having one circuit.
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Product
Meters For Contact Angle And Surface Tension + Semiconductor Technology, Micro Scriber
SURFTENS HL Automatic
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Optik Elektronik Gerätetechnik GmbH
Fully automatic contact angle meter for silicon wafers up to 12 inch The contact angle measuring system SURFTENS HL automatic is designed for use in semiconductor industry and research, in particular for process control of wafer coating and in the photolithographic process.
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Product
Semiconductor Power Amplifiers : Solid State Power Amplifiers (SSPA) For Indoor (rack-mount) And Outdoor (hub-mount) Settings
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Insight Product Company is proud to offer state-of-the-art semiconductor (solid state) power amplifiers that are compact, rugged, and deliver immense power, and expectional frequency stability and minimal phase noise. These solid state power amplifiers are ideal for indoor, rack-mount, or outdoor, hub-mount, applications. We offer S-band, C-band, X-band, and Ku-band amplifiers, with output power of upto 1,000 Watts (varies based on frequency band).
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Product
Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
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Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Product
Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test
GATS-3200
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* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
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Product
Spread Resistance For Slanting Polished Sample Of Semiconductor By Tow Kinematically-mounted Probe Contacting .
SRS-2010
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*Resitivity map along with depth direction, thickness of epitaxial , depth of PN junctin and carier density profiles
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Product
ITA, 9050, 50 Module, VXI and Discrete Wiring, Double Tier
410104538
ITA
The 50 module ITA can be used in a number of applications to accomplish the required connection to the Unit Under Test (UUT). You can mount a VPC front or rear mount enclosure or customize your own fixture to be attached on the frame. A wide range of ITA modules are available separately for user configuration.
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Product
RTM Discrete Signal Conditioning Board
MS 3632I
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CPCI Rear IO Discrete Signal Conditioning Board is a signal conditioning and interface board for CPCI based Advance Compute & IO Module (MS3639i). This board primarily focusing on signal conditioning of TTL/CMOS DIO levels to required type of discrete input and output interface. Digital IO from ACIO board to discrete IO at Rear IO interface. Board takes 144 DIO from ACIO and does Open/Ground, 28V/Open, 28V/Ground configuration. In addition it shall generate additional 32 discrete input / output signals with signal conditioning and all IO interfaces are brought to two 96 Pin Euro Connector.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
Module Retainer Block Set, For Discrete Wiring, 2 Positions
510109117
Mounting Kit
These module retainer blocks are used to attach modules directly to the inner frame of a VXI receiver for discrete wiring. These modules hinge down with the receiver to provide easy access to wiring.
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Product
300 Mm Semiconductor Processes
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With the Center Nanoelectronic Technologies (CNT), the Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the field of FEoL and BEoL we offer the following technology developments and services at Ultra Large Scale Integration level (ULSI):
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Product
Accelerate Semiconductor Development With IP-Centric Design
MethodicsIPLM
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Methodics IPLM provides a scalable IP lifecycle management platform that tracks IP and its metadata across projects, providing end-to-end traceability and enabling effortless IP reuse. Learn more by connecting with an IP expert today.
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Product
Design-for-Test And Semiconductor Data Analytics
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Mentor’s comprehensive solution for IC test, including best-in-class design-for-test tools and test data analytics that help ensure the highest test coverage, accelerate yield ramp and improve the quality and reliability of manufactured parts.
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Product
Receiver, G18, 18 Module For Discrete Wiring
310120101
Receiver
The lightweight and rugged 18 module Receiver provides a solution that will accommodate larger ATE chassis’ (PXI, VXI, SCXI). It allows immense versatility by affording space for up to an 18 slot PXI chassis.
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Product
Semiconductor / FPD Inspection Microscope
MX61L
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Motorized Microscope for 300mm dia. Wafer/17 inch Glass Substrate use Reflected/Transmitted Illumination.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Semiconductor Device Parameter Analyzer/Semiconductor Characterization System Mainframe
B1500A
Analyzer
Current-voltage (IV) measurement capabilities of spot, sweep, sampling and pulse measurement in the range of 0.1 fA - 1 A / 0.5 V - 200 VAC capacitance measurement in multi frequency from 1 kHz to 5 MHz and Quasi-Static Capacitance-Voltage (QS-CV) measurement capabilitiesAdvanced pulsed IV and ultra-fast IV measurement capability from minimum 5 ns sampling interval (200 MSa/s)Up to 40 V high voltage pulse forcing for non-volatile memory evaluation
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Product
32-CH Discrete Input Modules with U Profile
HSL-DI32-UD
Digital Input Module
HSL U series is designed as compact & horizontal-placed slave module. For I/O module, ADLINK adopts three types of connectors to meet different users' requirements & habits. Compared with past models, U series brings compact size, easier-to-wire and cost-effective advantages for users. DI/O, AI/O and motion control module are supported
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Product
Conduction Cooled XMC Interface Board with PCI Express Host Interface, Supporting up to 4 PX Modules, 2 RTx 5 Channel Modules, 1 Discrete & 1 Serial Module
EXC-8000ccXMC
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The EXC-8000ccXMC is part of Excalibur’s 8000 family of multiprotocol boards. This conduction cooled XMC interface board has a PCI Express host interface and supports up to 4 Px modules, 2 RTx 5 channel modules, 1 Discrete and 1 Serial module. Due to the constraints of the XMC specification the modules are integrated onto the board itself rather than as physically separate modules.The EXC-8000ccXMC supports Direct Memory Access (DMA), which enables the board to access system memory for reading and writing independently of the computer’s CPU. This results in faster data transfer to and from modules that support DMA, with much less CPU overhead than when not using DMA.
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Product
Receiver, 9050, 50 Module, Dual Discrete Wiring Tiers
310104368
Receiver
The 50 Module Receiver is a rugged system devised to accommodate high I/O. With high contact point availability, the 50 Module Receiver is suited for larger test and measurement systems. Both tiers are designed for discrete wiring, and can accommodate individual 9025 ITAs.
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Product
Discrete Switch Cards
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Compatible for use on the VXI, LXI, and GPIB platforms, these switch products were formerly sold under the Racal Instruments brand name.
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Product
Semiconductor Test Equipment
IC Tester
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Equipment to determine the pass/fail of devices in the wafer inspection process and the final inspection process after packaging.
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Product
Semi-automatic Semiconductor Probe Assembly Equipment
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The components of the incoming parts are pre-assembled and preloaded to two packages. We use a high-speed four-axis robot equipped with high-precision multi-sensor grips to grab these pre-assembled subcomponents. Under CCD visual guidance, a set of rotary grab devices is equipped to capture top plunger. The device uses a multi-set CCD visual module to ensure accuracy, and the positioning accuracy of each motion link is controlled within 15um.
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Product
Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
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Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Product
Semiconductor Testing
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Teradyne’s semiconductor test portfolio is transforming the way you test chipsets for automotive, industrial, communications, consumer, smartphones, and computer and electronic game applications. Semiconductor devices span a broad range of functionality, from very simple low-cost devices such as appliance microcontrollers, operational amplifiers or voltage regulators to complex digital signal processors and microprocessors as well as memory devices.
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Product
Semiconductor Memory Tester
T5851
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Advantest Corporation has introduced the T5851 system, designed to provide a cost-effective test solution for high-performance universal flash storage (UFS) devices and PCIe BGA solid-state drives (SSDs) memory ICs in high demand by makers of low-power, mobile applications such as smart phones, tablets and ultra-portable laptops. The flexible T5851 tester is available in both production and engineering models. This allows the system to be used for reliability and qualification testing as well as test-program development or, when equipped with an automated component handler such as Advantest''''s M6242, high-volume production. As a fully integrated, system-level test solution, the T5851 provides multi-protocol support in one tool while its tester-per-DUT architecture and proprietary hardware accelerator allow it to achieve industry-leading test times.
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Product
Semiconductor
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The semiconductor industry faces continuous pressure to reduce device size and costs while improving performance and reliability. Semiconductor, test and assembly automation manufacturers demand the same improvements from the motion technology which drives it. Haydon Kerk Pittman continues to develop new technologies in motors, lead-screws, gears, encoders, actuators, slides, drives and complete sub-systems that increase operational speeds and accuracy while lowering the cost of ownership.
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Product
Comprehensive Suite of Software Tools for Semiconductor Test Applications
ICEasy Test Suite
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Marvin Test Solutions' ICEasy Test Suite is supplied with both the TS-900 and TS-960 semiconductor test platforms and provides a comprehensive set of software tools - facilitating the development and debugging of test programs for semiconductor devices. In addition the suite includes I-V curve and Shmoo plot tools for analyzing a device's DC and AC characteristics. The complete suite of tools interfaces seemlessly with Marvin Test Solutions' ATEasy®, a test executive and test development evironment which is supplied with each TS-900 / TS-960 system.
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Product
Enhanced 24 Discrete I/O Channels (0 to 60 VDC, 500 mA/Ch.)
DT4
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The DT4 module (the enhanced version) features 24 programmable channels for either input (voltage or contact sensing with programmable, on-module pull-up/pull down current sources), or output (current source, sink, or push-pull) up to 500 mA per channel from an applied, external 3 – 60 VCC source. These modules can sense broken input connections and whether an input is shorted to +VCC or to ground. Additional features of the DT4 (Enhanced Version) are listed below.
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Product
Protective Cover, 9050, VXI and Discrete Wiring, ITA
410114298
Protective Cover
Protective Cover, 9050, VXI and Discrete Wiring, ITA.
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Product
32-CH Discrete Output Daughter Board Module
HSL-DO32-DB-N
Digital Output Module
*Slave ID consumption: 2 - N: for 32-CH NPN sinking type outputs*Photo couple isolation voltage: 2500Vrms*Output switching capacity: Single channel 500mA; all channels 60mA at 24VDC*Output response time:ON OFF: 180µs, OFF ON: *1.2µsTerminal Base:HSL-TB64 or HSL-TB32U-DIN
