Wafer Level Reliability
-
Product
Probe Card
VC43™/VC43EAF™
-
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
-
Product
Probe Card
VC20E Series
-
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
-
Product
Multisite Probe Card
T300 ButtonTile™
-
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
-
Product
Probe Card
T90™ Series
-
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
-
Product
MPI Automated Probe Systems
-
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
-
Product
Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
-
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
-
-
Product
Production Wafer Level Burn-in
-
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
-
Product
MultiSite Test sockets and Wafer Level
-
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
-
Product
System to Handle Wafer Levels
AMI AW Series
-
Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
-
Product
Reliability And Durability Testing
-
Underwriters Laboratories Inc.
Our reliability and durability testing services provide an accurate assessment of how your product may perform under expected and unusual use. We can help you meet regulatory requirements, gain actionable knowledge about the anticipated life cycle of your products and identify design flaws that have adverse effects on a product’s reliability and durability.
-
Product
Wafer Level Test Handler
Kronos
-
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
-
Product
Wafer Manufacturing
-
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
-
Product
Wafer Level Test
-
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
-
Product
Wafer Test
-
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
-
Product
Reliable Evaluation of Damping Materials and Composites
Carrousel
-
Carrousel measures the dynamic vibration properties of coated or non-coated materials. The method is based on the classic "Oberst" procedure where Autoneum has improved both the measurement procedure itself and the mathematical model used to evaluate the results. The Carrousel software automatically calculates the damping loss factor at various conditions and temperatures as well as controlling both the Carrousel apparatus and the all-important temperature when measuring in a temperature chamber.
-
Product
Silicon & Compound Wafers
-
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
-
Product
Level Transmitters
-
NOSHOK industrial submersible level transmitters are designed to withstand harsh applications. Our offering includes a small diameter (0.97") submersible level transmitter designed for hydrostatic level measurement for use in applications including bore holes and wells with small diameters. This sensor provides low power output signals for battery-powered applications, and an optional temperature output available. We also provide a cage-protected level transmitter ideal for harsh environments including sludge, slurries, tank monitoring, water & wastewater.
-
Product
Level Detectors
-
Becker Nachrichtentechnik GmbH
Becker Nachrichtentechnik offers selective RF level detectors for air interface monitoring. The detectors are especially designed for frequencies used in e.g. electron accelerators. Due its mechanical design, the modules are compatible to cable route mounting systems. The detection of unintentional RF radiation is a main application field.
-
Product
Reliability & Enviromental Testing
-
NCEE Labs has been providing industry-standard reliability and environmental testing for 20 years. Our experienced testing staff can assist you in determining the type or level of reliability/environmental testing you require for your products!
-
Product
Level Monitoring
-
Magnetic level switches are used for the monitoring and control of liquid level in tanks. These level switches are specifically manufactured to customer specifications. The float switches are manufactured with a hermetically sealed contact which is located within the guide tube. The float sliding on the tube contains a ring magnet which activates the sealed contact in a non-contacting fashion. The sealed contacts are available as SPST (N/O or N/C) or SPDT (N/O + N/C). The float sliding up and down on the guide tube is the only moving part on the M-series magnetic float switches.
-
Product
Inline Wafer Testing
IL-800
-
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
-
Product
Level Measurement
-
Omega provides contact and non-contact instruments for liquids, and non-contact instruments for solids. Choose from continious measurement or point level measurement with one of our level switches.
-
Product
Wafer Testing
Trio Vertical
-
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
-
Product
Wafer Probe Heads
-
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
-
Product
Contactless Wafer Geometry Gauge
MX 20x series
-
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
-
Product
Wafer Test Solutions
-
Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
-
Product
Wafer Internal Inspection System
INSPECTRA® IR Series
-
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
-
Product
Laser Levels
-
Shenzhen UYIGAO Electronic Technology Co., Ltd
UYIGAO laser level is a construction tool which measures levelness by projecting a red or green light beam onto a flat surface. Laser levels are used to deduct how level or straight a surface is by projecting a light beam across or around it.
-
Product
Wafer Chucks
-
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
