Thermal Imaging
The creation of a visible representation of detected heat signatures.
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Product
Near-Field Detection Module for Imaging
Reflection
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Reflective AFM-tip illuminationDetection optimized for high-performance near-field imagingEnables optical amplitude and phase resolved near field measurementsNear-field spectroscopy possible via sequential imaging (Requires tunable illumination unit)Patented background-free detection technologySuited for visible & infrared wavelength range (0.5 20 m)Version for infrared & THz wavelength range (5 300 m) availableSupported AFM scan-speed: up to 20 m/s @ highest spatial resolution
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Thermal Abuse Test Chamber
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Guangdong Bell Experiment Equipment Co.,Ltd
DGBELL Thermal abuse test chamber protect for short circuit caused by incorrect operation of the operator and battery electrode, battery positive and negative connection, etc
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Product
1.3 Million Pixel CMOS Image Sensor
Sapphire 1.3M
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This 1.3 million pixel Sapphire CMOS image sensor, designed on Teledyne e2v’s proprietary Eye-On-Si CMOS imaging technology, is ideal for diverse applications where superior performance is required. The innovative pixel design offers excellent performance in low-light conditions with both electronic rolling shutter and electronic global shutter, with a high-readout speed of 60 fps in full resolution. Novel industrial machine vision application features such as multi ROI and histogram output are embedded on-chip. Very low power consumption enables this device to be used in battery powered applications.
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Solino Imaging Module 10x12
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The Opto solino imaging module is a complete "computational imaging" vision sensor that uses Opto's own solino™ technology to display object anomalies as an image for digital or statistical processing.
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Product
Thermal Test Vehicles
TTV
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Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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IR Thermal Camera
AMG8833
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This is the Thermal Camera FeatherWing: thanks to the Panasonic AMG8833 8x8 GridEYE sensor, it adds heat-vision to any Feather main board. Using our Feather Stacking Headers or Feather Female Headers you can connect a FeatherWing on top of your Feather board and let the board take flight!This part will measure temperatures ranging from 0°C to 80°C (32°F to 176°F) with an accuracy of +- 2.5°C (4.5°F). can detect a human from a distance of up to 7 meters (23) feet.
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Product
Thermal Test Chip
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Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Preclinical Imaging Modalities and Solutions
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Bruker offers advanced preclinical imaging solutions for a broad spectrum of application fields, such as oncology, neurology, cardiology, inflammation, infectious diseases, cancer research, functional and anatomical neuroimaging, orthopedics, cardiac imaging and stroke models. Our range of techniques includes MRI (Magnetic Resonance Imaging) , PET (Positron Emission Tomography), SPECT (Single Photon Emission Computed Tomography) micro-CT (Micro Computed Tomography), optical imaging and magnetic particle (MPI) imaging.
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SWIR Imagers
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SWIR imagers (short wavelength infrared) are an important group of surveillance electro-optical imagers due several reasons. First, advances in InGaAs technology enabled design of relatively low cost SWIR imagers. Second, InGaAs imagers are very sensitive and can generate images of observed scenery even at dark nights. Third, SWIR imagers are less vulnerable to bad atmospheric conditions than TV/LLLTV cameras working in visible/near infrared band. Fourth, SWIR imagers can generate hi-res images even if they are built using much smaller optics than used for design of thermal imagers.
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Product
Thermal Quad Scanner
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Thermal Quad Scanner has the Highest Isolation of any 4-Terminal Scanner and operates at up to 1000V. With a Guildline model 6664C scanner and software, hard-to-make high ohm measurements (up to 100 GΩ) can be automated and scheduled at any time that is convenient to the metrologists, even at night and over the weekends.
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Thermal Cycling Test Equipment
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Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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Thermal Conductivity Analyzers
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Teledyne Analytical Instruments
Thermal Conductivity Analyzers by Teledyne Analytical Instruments
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Compact Imaging Modules
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The Opto compact M imaging modules are characterized by the only 40mm wide 90° angled all-aluminum housing.
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Product
LXI EMR Low Thermal EMF Matrix 14x33
60-511-004
Matrix Switch Module
This high density 1-pole matrix has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix.
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Product
Liquid Thermal Conductivity Instruments
THW-L1
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The Transient Hot Wire (THW-L1) Liquid Thermal Conductivity Meter is an advanced measurement system for direct determination of the thermal conductivity, thermal diffusivity, and specific heat instrument for measurement of liquids and pastes in accordance with ASTM D7896-19. The THW-L1 was designed with speed and operational simplicity in mind. With a single measurement of 1 second in duration, small volumes of liquids and pastes can be accurately and precisely measured for thermal conductivity, thermal diffusivity, and specific heat. The THW-L1 utilizes a non-stationary measurement approach and rapid test times to limit convective effects for samples with a wide range of viscosities. The THW sensor consists of a thin heating wire 40 mm in length and is completely inserted into the sample to be tested.
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High-Performance, Compact 9" Airborne Imaging System
Talon® MMS
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Forged from special operations targeting sensors, the TALON MMS is a compact, lightweight EO/IR surveillance system. Complete with thermal imager, color daylight optics, and eyesafe laser rangefinder, the TALON MMS delivers high reliability, performance, and mission critical imagery day or night with low-light and image blending. Battle-proven and AWR qualified, the TALON MMS is deployed with a range of customers, including the US Army where it flies on UH60s.
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Thermal Security Camera
Elara™ FC-Series O
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The Elara™ FC-Series O thermal security camera is one of FLIR’s premium thermal security cameras for perimeter protection. The Elara FC-Series O integrates with external video analytics devices, such as FLIR’s TRK or third party solutions, to classify human or vehicular intrusions. The Elara FC-Series O also offers a wide range of high-performance lenses, with a choice of resolutions, offering greater flexibility for tailoring security systems to specific site conditions.
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Constant Temperature Anemometry (CTA) - Hot-Wire Anemometry - Thermal Anemometry
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Constant Temperature Anemometry (CTA), also known as Thermal Anemometry, is a technique for the measurement of turbulence in 1, 2 or 3-dimensional gas and liquid flows, using hot-wire or hot-film probes inserted in the flow. CTA is particularly suitable for the measurement of flows with very fast fluctuations at a point (high turbulence) and the study of flow micro structures, where there is a need to resolve small flow eddies down to the order of tenths of a mm.
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Product
Thermal Load Boards
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Thermal Engineering Associates, Inc.
A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.
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Product
Imaging Station
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Standard upright microscopes were not designed to work with temperature controlled stages. Microscopes are optimized to get the best possible image for a number of different techniques (phase contrast, DIC, polarized etc...) Unfortunately due to the confines of the standard microscope frame, it is not easy to get samples under the objective lens and into the stage.
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Instrument Systems Imaging Photometers And Colorimeters
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Konica Minolta Sensing Americas, Inc
Interest has never been higher in imaging colorimeters and imaging photometers, especially when tasks call for quick measurements of colorimetric and photometric quantities with spatial resolution.
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2-Zone and 3-Zone Vertical Thermal Shock Chambers
FS
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Originally developed for testing microelectronic devices for use in military and aerospace electronic systems, Bemco Vertical Thermal Shock Chambers are widely used for screening and quality evaluation of smaller electronic parts.
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AI-Powered Thermal Traffic Sensor
TrafiSense AI
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Designed to reliably detect and classify road users, TrafiSense AI is an intelligent thermal imaging sensor for traffic monitoring in complex urban environments. Featuring AI algorithms built on 25+ years of traffic detection and best-in-class thermal imaging, TrafiSense AI delivers continuous vision and data collection for safer, more efficient cities. Capable of tracking multiple objects in any lighting condition, the advanced edge-based AI technology effectively controls intersections, helps protect vulnerable road users, and gathers detailed traffic data for better city planning decisions.
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832x600 Pixel High Resolution Time-of-Flight (ToF) CMOS Image Sensor
Hydra3D+
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Hydra3D+ is a 832 x 600 pixel resolution Time-of-Flight (ToF) CMOS image sensor, designed with Teledyne e2v’s proprietary CMOS technology, and is tailored for versatile 3D detection and measurement.
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Visible / Infrared / Imaging Test System
System 1808
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Testing Low-voltage CCDs and IR FPAs; Military, science-grade and medical CCDs or IR FPAs; CMOS ROICs and multiplexers; CMOS sensors. Whether your application is characterizing a massive mosaic of CCDs for the next great observatory, designing a faster FLIR for a weapons-guidance system, or production-testing a CMOS image sensor for a digital camera, Pulse Instruments can supply you with a fully-integrated test system that allows you to focus on your your device, not on your test system.
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Product
10 MHz To 67 GHz LAN Thermal Vacuum Compliance Power Sensor
L2067XT
Power Sensor
Accurately measure any modulated signal with the Keysight Technologies, Inc. U/L2050/60 X-Series wide dynamic range power sensors. The USB/LAN connectivity models come with a wide dynamic range, covering -70 to +26 dBm. This sensor offers very accurate and repeatable power measurements for any modulated signal and comes with a super-fast measurement speed of 50,000 readings/sec, which enables higher manufacturing throughput. Users can also save time and reduce measurement uncertainty with the internal zero and calibration function. The U/L2050/60 X-Series is supported by the Keysight BenchVue software. BenchVue makes it easy to control your power meter to log data and visualize measurements in a wide array of display options without any programming. Simply connect the sensor to your PC installed BenchVue BV0007B Power Meter/Sensor Control and Analysis app to perform average power measurement and analysis.
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Failure Analysis And Magnetic Imaging Services
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Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
