Thermal Imaging
The creation of a visible representation of detected heat signatures.
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Intelligent Thermal Traffic Sensor
TrafiData
TrafiData is an intelligent thermal sensor capable of counting and classifying vehicles, bicyclists, and pedestrians, in addition to travel-time for comprehensive congestion analysis. Integrated Wi-Fi technology allows simultaneous thermal-based data collection, while calculating travel-times and origin-destination by securely, and anonymously, tracking MAC addresses as people move throughout the traffic network. Since the TrafiData relies on thermal energy, rather than light, it offers 24/7 traffic monitoring and can detect road users at night, through glare, and in harsh weather conditions.
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CMOS SoC for mmWave 3D Imaging Sensor
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Vayyar chip covers imaging and radar bands from 3GHz-81GHz with 72 transmitters and 72 receivers in one chip. Enhanced by an integrated, high-performance DSP with large internal memory, Vayyar’s sensor does not need any external CPU to execute complex imaging algorithms.
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Thermal Sensitive Parameter Selector
UI9600
Parameter measured under normal temperature:1) β (0-99)2) Switching time T (0.01μs-99.9μs), including Tr, Ts, Tf3) VCES (0-2V), VBE (0-2V)4) Leakage current ICEO (0.01μA-99.9mA)5) Withstand voltage BVCEO (50V-650V)• Parameter measured under high temperature: VBE, β, ICEO
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NIR Hyperspectral Imaging
Specim
Push broom imaging is a technique that enables acquiring hyperspectral images or hyperspectral imaging. Each pixel of the image will thus contain an NIR or visible spectrum. This technology uses one dimension of a 2D sensor for measuring a line of the sample (x dimension).
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Thermal Conductivity Analyzer
TCi
The default C-Therm TCi Thermal Conductivity Analyzer employs the Modified Transient Plane Source (MTPS) technique in characterizing the thermal conductivity and effusivity of materials.
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Oxygen/Nitrogen by Inert Gas Fusion Infrared and Thermal Conductivity Detection
736 Series
The ON736 Oxygen/Nitrogen Elemental Analyzer is designed for wide-range measurement of oxygen and nitrogen content of inorganic materials, ferrous and nonferrous alloys, and refractory materials using the inert gas fusion technique.
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SPD AC & DC Thermal Stability Test Equipment
Shanghai Guantu Technology Co., Ltd.
1. Computer control measurement, PLC control;2. Equipped with sudden voltage capability, suitable for thermal stability tripping test under high current conditions;3. Increase the high-power resistance box;4. The interface is friendly and beautiful, and can reflect the running status of the system in real time; .5. Automatically draw voltage, current and temperature curves;6. The system performs multi-point temperature detection in real time;7. Timing sampling and recording function, which is convenient for users to view temperature values at different times and compare data;8.2 times Uc leakage current test function to check the tripping reliability of the product;9. Built-in test box;10. RS232 communication interface, can realize remote control.
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Static Image Analysis System Particle Size
PSA300
The HORIBA PSA300 is a state of the art turn-key image analysis solution. Seamless integration of Clemex's powerful particle characterization software and an automated microscope with high-resolution camera creates an intuitive, easy-to-use imaging workstation. Addressing a need in the field of particle characterization, the PSA300 is a versatile particle size and particle shape analysis tool that can be used in a wide range of applications in the pharmaceutical industries and material science. It is a turn-key solution for labs that want to maintain an analytical microscopy environment with minimum intervention by the operator yet still yield maximum detail in the results.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Electron Multiplication (EM) Standard Image Sensors
EM (Electron Multiplication) is a technology that uses on-chip gain in the charge domain to effectively eliminate read noise from an image sensor. This enables advanced ultra-low light applications that require extreme sensitivity at fast frame rates. Examples include life science applications such as single molecule detection, super resolution microscopy and spinning disk confocal microscopy along with physical science applications such as nanotechnology imaging, Bose Einstein condensates and soft X-ray spectroscopy, and astronomy applications such as adaptive optics and lucky imaging. The inclusion of an additional conventional output allows further flexibility for applications such as true 24 hour surveillance.
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Charge Coupled Device (CCD) Image Sensors for Space and Ground-Based Astronomy
(CCDs) for Space science, Ground-based Astronomy, and Earth observation applications with an impressive record of successful deliveries to a wide range of customers over 40 years.All Teledyne e2v devices can be supplied partially or fully customised to fit the application and achieve the best possible system performance. CCD image sensor design, manufacture, test and characterisation are carried out in-house enabling control from start to finish. Multi-polysilicon, multi-metal and back-illumination options are available for high resolution, high sensitivity and very low noise.
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Thermal Machine Vision Camera
FLIR A615
The FLIR A615 is an easy-to-control, affordable, and compact thermal imaging camera for condition monitoring, process control/quality assurance, and fire prevention. This camera can be fully controlled by a PC, and is Plug and Play with third-party machine vision software such as National Instruments, Cognex, Matrox, MVtec, and Stemmer Imaging.
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192 X 1 Or 96 X 2 cPCI Low Thermal Relay Scanner Module
DP-cPCI-4032
DP-cPCI-4032, is a hot swappable high density 192x1 or 96x2 relay scanner module. DP-cPCI-4032 is implemented as a 6U cPCI module.The 96 channel scanner is divided into six banks of 16x2 scanner. The banks are isolated from each other using tree switches. Six tree switches are used, one tree switch for each bank. A common tree switch is used to group all the six banks. Depending on the application requirement, it can be configured as 96 x 2 or 192 x 1 scanner. For short circuit protection, resistors are provided for all the common terminals.
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Create Topographic Profiles from SPM Images
TopoStitch
topoStitch™ offers the easiest and most accurate way to stitch topographic or greyscale images from Scanning Probe Microscopes (SPM’s), profilers, interferometers, confocal microscopes or any other instrument type. All images are placed automatically according to stage position coordinates when stored in the image files. Otherwise, the Grid Layout Wizard helps to lay out images in seconds. topoStitch™ even offers advanced snapping and semi transparent rendering, which makes it easy to place and adjust images manually.
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Image Sensor/Fingerprint-on-Display Testing
Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Cutting-edge 3D GPR array solution for efficient subsurface imaging cart solutions
Raptor
The Raptor system covers a wide range of applications and can be configurated with 450 MHz or 800 MHz antennas. Raptor 3D Arrays are based on Real-Time sampling (RTS) technology and the unique antenna design is a milestone in the evolution of the GPR. A Raptor Antenna can be arranged in different ways, which allows for both standard and more advanced GPR measurements. These include common mid-point (CMP), wide-angle reflection and refraction (WARR) and Tomography.
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Universal Imaging System
Laboratory 29 megapixel full spectrum imaging camera package for fingerprint work. A complete digital imaging system providing image capture, image enhancement, and image comparison.
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CMOS Imaging Sensors
CMOS imaging sensors from ams feature global and rolling shutter capability, low noise, high dynamic range and high frame rates.
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Thermal Shroud
BC8-55/150C
When combined with a thermal conditioner such as the Bemco PCL3L-III or PCL3M-III, this shroud converts a 24 inch inside diameter by 30 inch high vacuum only vertical bell jar into a 19 inch inside diameter by 20 inch high thermal vacuum testing system. With a convenient clam shell door, test objects are easily loaded by simply raising the bell jar above the top of the door opening.
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Thermal Dispersion Level Switches
ABB's Thermal Dispersion products can be used for flow, level or temperature detection. One switch can be field configured to detect one of these three process conditions.
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SWaP-C Single LRU HD EO/IR Imaging
Star SAFIRE® 380-HDc
The Star SAFIRE® 380-HDc delivers unparalleled stabilized HD multi-spectral imaging in a compact, low-profile package. It’s designed to maximize ground clearance in rotary aircraft without sacrificing capability and performance. Low power demand of 225W and lighter weight of only 65 pounds (29.5 kg) round out the incomparable SWaP-C advantages. This system also provides 2x-4x greater magnification than other lightweight systems in its class.
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Thermal Shock Testing
Quest Engineering has the capability that you've been seeking to perform thermal shock on a wide array of units. Using our specially designed Thermal Shock Chamber which works like a turnstile to shuttle units between extreme hot and extreme cold conditions.
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Professional Thermal Monocular
Scion PTM
Built to equip law enforcement professionals with superior thermal surveillance, the FLIR Scion™ PTM packs high-performance thermal imaging into a rugged, IP67-rated handheld monocular. Capable of geotagged video recording and live video transmission, the Scion PTM can instantly stream encrypted thermal footage of any pursuit, evidence recovery, or search and rescue effort to the command center via wireless network. A smooth 60 Hz refresh rate and picture-in-picture zoom capture minute details from a distance and maintain peripheral awareness for constant thermal supervision of suspects, team members, and standbys.
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Thermal Vision for ADAS and AV Developers
FLIR ADK™
The FLIR ADK is a cost-effective way to develop the next generation of automotive thermal vision for advanced driver assistance systems (ADAS) and autonomous vehicles (AV). Thermal infrared cameras are the best sensor technology for pedestrian detection and provide the critical data needed to improve automated decision making in vehicle safety functions including automatic emergency braking (AEB). The ADK’s rugged, IP67 rated enclosure incorporates a heated window for all-weather driving. With the GMSL, USB, and FBD-Link interfaces and drivers available form Teledyne FLIR, installation and testing is plug-and-play easy. Interested in a thermal vision enhancement system for today’s vehicles, please see PathFindIR II.
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Thermal Voltage Converter
1395D
The 1395D series of TVC's, have Dual Thermal Element technology. The 1395D offers double the output voltage (typically 14 mV instead of 7 mV). This higher output voltage means better resolution and increased accuracy. It can be used to measure AC Voltages between 20 Hz and 100 MHz and it can serve as a primary AC voltage standard and/or standard for calibration of AC calibrators and voltmeters.
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Thermal Control Products
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
