Thermal Imaging
The creation of a visible representation of detected heat signatures.
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Product
IEC60884 Fig38 Thermal Compression Test Device For Plug Testing
IEC60884 fig38
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Shenzhen Chuangxin Instruments Co., Ltd.
IEC60884 fig38 thermal compression test device for plug testingUsed to evaluate the pressure resistance of electrical accessories and wall mounted mounting boxes under heatStandard: GB2099.1-2008 Articles 24.19 and 25.4 and Figure 38, IEC60884-1 Figure 38, etc.
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Preclinical Imaging
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Bruker offers advanced preclinical imaging solutions for a broad spectrum of application fields, such as oncology, neurology, cardiology, inflammation, infectious diseases, cancer research, functional and anatomical neuroimaging, orthopedics, cardiac imaging and stroke models.
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CMOS Image Sensor, Global Shutter, 8.8 Mp (4k / UHD resolution)
XGS 8000
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The XGS 8000 is a 8.8 Mp (4096 x 2160) 4k / UHD resolution Global Shutter CMOS image sensor in 1/1.1 inch optical format, supporting up to 120 frame per second readout at full resolution. The device provides high resolution, global shutter imaging with high readout speed for industrial imaging customers. A compact package design and low power footprint make the device compatible with a 29 x 29 mm2 camera footprint. Two speed grades are available to match device output to key computer interfaces and application requirements.
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Liquid Thermal Conductivity Instruments
THW-L1
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The Transient Hot Wire (THW-L1) Liquid Thermal Conductivity Meter is an advanced measurement system for direct determination of the thermal conductivity, thermal diffusivity, and specific heat instrument for measurement of liquids and pastes in accordance with ASTM D7896-19. The THW-L1 was designed with speed and operational simplicity in mind. With a single measurement of 1 second in duration, small volumes of liquids and pastes can be accurately and precisely measured for thermal conductivity, thermal diffusivity, and specific heat. The THW-L1 utilizes a non-stationary measurement approach and rapid test times to limit convective effects for samples with a wide range of viscosities. The THW sensor consists of a thin heating wire 40 mm in length and is completely inserted into the sample to be tested.
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Handheld UV Imaging Solution
UVCorder™
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The compact unit is designed for viewing scenes in the near-UV waveband in real time on a 3.5-inch LCD display and for acquiring near-UV digital video and stills quickly and easily. Oculus Photonics' ultraviolet camera module (UVM) features enhanced ultraviolet response in the 300-400nm range, with a peak response at 370nm, and excellent rejection of visible and infrared light.
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192 X 1 Or 96 X 2 cPCI Low Thermal Relay Scanner Module
DP-cPCI-4032
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DP-cPCI-4032, is a hot swappable high density 192x1 or 96x2 relay scanner module. DP-cPCI-4032 is implemented as a 6U cPCI module.The 96 channel scanner is divided into six banks of 16x2 scanner. The banks are isolated from each other using tree switches. Six tree switches are used, one tree switch for each bank. A common tree switch is used to group all the six banks. Depending on the application requirement, it can be configured as 96 x 2 or 192 x 1 scanner. For short circuit protection, resistors are provided for all the common terminals.
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Product
TRA-300 LED Thermal Resistance Structure Analyzer
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Hangzhou Everfine Photo-E-Info Co., LTD
The TRA-300 accurately measures the thermal resistance, junction temperature, optical power, voltage, current and other parameters of LED packaging products.The heating and cooling curves of LED can also be obtained, and the integral and differential thermal structure functions can be obtained by establishing the finite element model.Through the structural function analysis of the TRA-300 special software, the fine thermal resistance structure of the LED (from the chip to the thermal resistance value of each package structure) can be obtained, so as to objectively evaluate the heat dissipation quality and thermal management level of the LED package products, and provide the best verification for the heat dissipation design of the LED.
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Scientific CCD Image Sensors
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Our front and backside illuminated (BSI) and backthinned Charge Coupled Devices (CCDs) are seen as the gold standard for scientific and quantum imaging in applications in spectroscopy, microscopy, In vivo, x-ray and astronomy. We understand that every imaging application is unique and requires our engineers and scientists to work closely with our customers providing highly tailored imaging solutions.
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New Link system Control and Image Capture Software
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New uncluttered and intuitive user interfaceLive display of current status for easy monitoringFull control of heating and cooling rate, limit and hold time of up to 100 rampsRow by Row control of Vacuum, Humidity, Tensile Force and Shear modes controllable and synchronised with TemperatureParameters of connected Linkam sensors displayed and stored - e.g. Vacuum, Humidity, Force, XY position and Pressure (dependent on connected stage type)Real Time chart of temperature and other measured parametersTrigger I/O for synchronisation with other equipmentTriggers recorded and plotted row by rowAutomatic setup of controls and parameter limits based on stage type connectedFull five point temperature calibrationUSB 2.0 to T96 and CSS450 ControllersOptional modules including Linkam Imaging Systems with high performance camerasIncludes .NET Components for easy integration into 3rd party applications e.g. LabViewNative 64 bit application
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4D Imaging Radar Chipset Solution
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Through enhanced FMCW technology, Arbe’s chipset technology transmits and receives signals from multiple antennas. By converting information from time to frequency domains (FFT), Arbe provides a 4D image with unparalleled element density in high azimuth and elevation resolution while simultaneously sensing the environment in long range with a wide field of view in real time. Additionally, Arbe technology reduces sidelobe occurrence levels close to zero, resolving range-doppler ambiguities and avoiding interference from other radars.
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Profile Imaging Modules
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The Opto profile imaging modules are characterized by the U-shaped all-aluminum housing, which is only 40mm wide.
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Customized Thermal Management Test Bench Solutions
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Our IPEtec test bench engineering business unit plans and provides customized test bench solutions for the development and validation of automotive AC components. We offer a full range of test benches and media-supply modules for the automotive developer’s thermal management needs. Moreover, we support the development of new cooling systems for hybrid power trains, for battery and engine cooling. New hybrid power trains are opening up additional fields of heat-pump technology development aimed at optimizing the energy balance of automotive air conditioning.
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Create Topographic Profiles from SPM Images
TopoStitch
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topoStitch™ offers the easiest and most accurate way to stitch topographic or greyscale images from Scanning Probe Microscopes (SPM’s), profilers, interferometers, confocal microscopes or any other instrument type. All images are placed automatically according to stage position coordinates when stored in the image files. Otherwise, the Grid Layout Wizard helps to lay out images in seconds. topoStitch™ even offers advanced snapping and semi transparent rendering, which makes it easy to place and adjust images manually.
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Product
Thermal Shock Chamber
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Allows for the rapid transfer of products between temperature extremes, or the alternating heating and cooling of test articles in cyclical manner.
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Imaging Colorimeter
FW-Series
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RayClouds Photoelectric Technology Co.,Ltd.
FW-Series Imaging Colorimeter is equipped with scientific grade CCD sensor and multi-filter, cooperated with ProICM professional analysis software to detect and analyze the optical characteristics of two-dimensional imaging screen. Improving measurement efficiency to ensure manufacturers maximize the production of high visual quality products.
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Thermal Data Logger
51101 Series
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It is a general requirement to record temperatures, voltages, currents, and many physics quantities during research, product development, productions, and quality assurance processes. The number of record channels can be a simple one to several complicated set of hundreds. Thermal/multi-function data loggers are prefect solutions to serve for these measurement and tracking needs.
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Thermal Microscope Stage For Petri Dish
TS-4SMP
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With our TS-4SMP Thermal Stage for Petri Dish, a specimen on a microscope slide or culture dish can be maintained at any temperature between -20°C and +60°C. Setup is easy, takes little time, and the controller will regulate the stage temperature to within +/-0.1°C. The collar on the stage is designed to accommodate a 35mm 'Nunc' petri dish. The collar may also be removed for use with slides.
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Thermal Control Products
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Scanning Thermal Microscopy Module
VertiSense™
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SThM module for thermal conductivity contrast and a temperature contrast imaging. Supports Contact, Tapping™ and Peak Force Tapping modes. Plug-in module, compatible with most commercial AFMs. Real temperature measurements up to 700° C. Ultra-low noise, high speed amplifier. Innovative probe design.
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Thermal Resistance Spectroradiometeric System for LED
TRS-1000
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Thermal parameter is the key index to evaluate the quality of LED. Different temperature will have significant different effects on optical parameters, color parameters, electricity parameters and life of LED. Therefore, design and control of the thermal dissipation are the most important thing for the manufacturers and users. Referring to the relative international standard, TRS-1000 could conduct integration testing on optic, color, electricity and thermal, meanwhile record the changing curve of the parameters at real time.
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Small size non-steady-state probe for thermal conductivity measurement
TP08
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Hukseflux Thermal Sensors B.V.
TP08 is a probe that offers the possibility to perform a practical and fast measurement of the thermal conductivity (or thermal resistivity) of the medium in which it is inserted at a high accuracy level. It works in compliance with the ASTM D 5334-00, D 5930-97 and IEEE 442-1981 standards. The TP08 is a small version of type TP02, made for situations where the length of the TP02 poses a problem. The standard TP08 probe has proven its suitability for soils, thermal backfill materials, sediments, foodstuff, powders, sludges, paints, glues and various other materials.
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Thermal Vacuum Data Acquisition and Control Software
TVAC 7000
Data Acquisition Module
Equipment used in space applications needs to go through stringent environmental tests in order to prove that it can survive the extreme conditions experienced during launch and while in space. Some of the key environmental tests include vibration, thermal vacuum, and electromagnetic compatibility. Thermal vacuum test is crucial to confirm the equipment is able to operate under the space vacuum condition.
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Intelligent Thermal Traffic Sensor
TrafiData
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TrafiData is an intelligent thermal sensor capable of counting and classifying vehicles, bicyclists, and pedestrians, in addition to travel-time for comprehensive congestion analysis. Integrated Wi-Fi technology allows simultaneous thermal-based data collection, while calculating travel-times and origin-destination by securely, and anonymously, tracking MAC addresses as people move throughout the traffic network. Since the TrafiData relies on thermal energy, rather than light, it offers 24/7 traffic monitoring and can detect road users at night, through glare, and in harsh weather conditions.
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Thermal Software
ThetaCalc
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Thermal Engineering Associates, Inc.
A tool designed to provide a quick estimate of the temperature and thermal resistance from a heat source to a reference heat sink. It also shows the temperature and thermal resistance value of each layer in the heat flow path. The program can accomodate up to ten layers of different materials of varying dimensions between the heat source and sink. The heat spreading angle can be set independently for each layer to a value between 0 and 45 degrees; the tool will automatically determine if heat flow reaches the layer edge and then convert to columnar flow.
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Infrared Process Imaging Systems
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Fully integrated infrared thermal imaging systems for glass processing, plastic extrusion coating, thermoforming machine control, kiln shell monitoring, gypsum wallboard production and more.
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Instrument Systems Imaging Photometers And Colorimeters
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Konica Minolta Sensing Americas, Inc
Interest has never been higher in imaging colorimeters and imaging photometers, especially when tasks call for quick measurements of colorimetric and photometric quantities with spatial resolution.
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Ultrasonic Imaging System
USPC 3010
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Ingenieurbüro Dr. Hillger Ultrasonic-Techniques
Detects internal defects in new materials and metals. The wide frequency range up to 35 MHz enables highestresolution. A-, C-, and D-scans can be recorded. The imaging in B-scans is an option.
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Ultrasonic Imaging with Molecular Analysis
MOLECULUS
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MoleculUS is a dual-modality ultrasound and photoacoustic data acquisition unit that allows the simultaneous collection of ultrasound and photoacoustic channels sharing the same probe elements. The analog signal path of MoleculUS is split into PA and US paths. PA and US modes operate sequentially in time with support for US preview mode and continuous on-fly multiplexing between modes.
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IEC60884-1 Low Temperature Thermal Shock Test Device
CX-DWC
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Shenzhen Chuangxin Instruments Co., Ltd.
IEC60884-1 Uses: It is used to evaluate the impact resistance of electrical accessories under low temperature conditions, and also to evaluate the low temperature impact resistance of wire and cable.
