Thermal
The radiation of heat.
See Also: Energy, Chemical, Electrical, Nuclear, Electromagnetic, Thermal Shock, Thermal Test, Infrared
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Capacitors - DC Floating/RF Bypass Mounting
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Macom Technology Solutions Holdings Inc.
MACOM’s Mounting Capacitors are designed for transient protection for MICs and FETs. Since the capacitor substrate is silicon, it provides an optimum match both thermally and mechanically with the device to be mounted. A wide range of sizes and capacitance values are available as standard products. Our design flexibility allows MACOM to offer a variety of size and capacitance options for specific customer requirements.
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Product
Wide Range Vacuum Gauge
HVG-2020B
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The HVG-2020B wide range, dual sensor vacuum gauge takes measurement to the next level. With a Piezo based sensor and a thermal based Pirani sensor accurately and confidently measure pressures across seven decades. The Piezo sensor is media isolated, gas composition independent, and periodically zeroed by the Pirani sensor. An ambient thermal sensor enables the instrument to adjust for temperature and therefore better accuracy.
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Product
Lighting Reliability
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LED/OLED package lifetime is highly dependent on thermal management, and LED lamp performance can be dependent on the luminaire in which it is installed. Lighting reliability test system for LED/OLED Products are widely used for normal /accelerated aging, lumen maintenance measuring, lifetime evaluation and temperature characteristic testing for LED/OLED products including LED package, array, module, OLED module and luminaires.
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Product
Carbon-Fiber Reinforced-Polymer Optical Breadboards And Benches
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Advanced Photonic Sciences LLC
Carbon fiber optical breadboards provide a similar thermal stability to Super Invar but at a lower cost and are inherently non-magnetic. For ages, steel breadboards have been the only choice; however, structures made from carbon fiber reinforced polymer (CFRP) have been used in the aerospace and space industries for many years due to their low weight, high strength, excellent thermal stability and low resonant frequencies. APS now brings this advanced technology to the world of photonics in the United States and Canada with carbon fiber breadboards from CarbonVision. Four grades of carbon fiber breadboard are offered: the economic EC-Series, the advanced AD-Series, the all-carbon AC-Series, and the slim SL-Series.
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IP66 Rated Mass Flow Controllers
I-Series
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I-Series Thermal Mass Flow Controllers are designed specifically for mass flow controller applications in harsh environments to protect against water and dust. The IP66-rated enclosure for I-Series Mass Flow Controllers protect it from direct water spray as well as dusty environments.
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Product
Test Equipment For IEC 62133
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designed for the battery thermal abuse test for IEC62133-8.2.2. The fire-proof dual-chamber has dimension 10" x 10" x 8", which can be heated up to 180°C via an independent temperature controller with +/- 1°C accuracy.
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Product
Moisture Meter and Thermal Imager with MSX®
FLIR MR265
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The FLIR MR265 is a professional pin and pinless moisture meter with thermal imaging designed to show you exactly where to investigate issues related to moisture, air leaks, and insulation voids. Featuring IGM™ (Infrared Guided Measurement) and MSX® (Multi-Spectral Dynamic Imaging enhancement) technology, the MR265 helps you quickly scan and target problem areas, visually guiding you to the spot where you can confidently take measurements, analyze readings, and ensure that problems are fixed. Using FLIR Thermal Studio™, you can then create and share professional reports that include findings and proof of repairs – giving your clients peace of mind that mold, rot, or moisture challenges have been resolved.
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Product
Differential Scanning Calorimeter
DSC-L600
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The Differential Scanning Calorimeter (DSC-L600) is a powerful thermal analysis instrument that measures the heat flow of a sample as a function of time or temperature. The DSC-L600 has been designed to be a cost-effective instrument that is well suited for research or QC applications. The instrument communicates with the PC via a RS232/USB connection. The specially designed heat flux plate has demonstrated more than twice the sensitivity than other heat flow type DSC’s on the market. The reproducibility is excellent, and the noise level is virtually unnoticeable due to a precision high gain, low noise differential amplifier
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Audio Line Drivers and Receivers
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Analog Devices audio line driver and receiver solutions feature differential-output buffer amplifiers and differential input buffer amplifiers to support a wide range of applications. By using low noise thermally matched thin film resistors and high slew rate amplifiers, these parts maintain the sonic quality of audio systems by eliminating power line hum, RF interference, voltage drops, and other externally generated noise commonly encountered with long audio cable runs. Applications involving this product portfolio include ADC drivers, high performance audio, sine/cosine encoders, and other professional and consumer uses.
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Product
High-Resolution Thermographic Camera
Ceres T 640 Series
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The Ceres T 640 series is based upon the Dione 640 OEM thermal imaging core with 640×480 pixels and 12 µm pixel pitch and NETD of less than 50 mK. The camera offers superior on-board thermographic performance (accuracy, stability) in the temperature range up to 400 °C.The Ceres T 640 camera outputs full frame images at 60 Hz via either a CameraLink or GigE Vision interface – all GenICam compliant.The compact size and excellent thermographic stability and accuracy, and GenICam compliant interfacing allow for easy integration in demanding industrial thermography applications.The camera offers one standard option of lens and thermal calibration pack.The compact Ceres T 640 series find application in process monitoring, medical and scientific and advanced research.Benefits & Features• Compact size and high-performance• Superior on-board thermographic performance (stability, accuracy)• GenICam compliant• Uncooled operation
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Microbolometer Sensors
Calibir GX Family
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The Calibir GX camera family features our latest microbolometer sensor, designed, fabricated, and packaged in our own foundry. With great sensitivity in longwave infrared range (8-12 µm), it features both shutter and shutterless operation and rapid image output on power up while delivering uniform response over the entire operating temperature range, making it an ideal component for thermal imaging systems requiring uninterrupted image acquisition. The GX series also offers our own advanced 21-bit ADC design for unparalleled intra-scene dynamic range without the need for a gain reduction, allowing for the best possible NETD over a vast range of temperature (>600C).
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Ultra Compact, Uncooled Thermal Imaging Core
Dione 1280 OEM Series
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The Dione 1280 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 1280 × 1024 resolution. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35 x 35 x 23.5 mm3 and weight is 27 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 1280 versions have the same SAMTEC ST5 connector and are GenICam compliant. The ultra-compact Dione 1280 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
TRA-300 LED Thermal Resistance Structure Analyzer
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Hangzhou Everfine Photo-E-Info Co., LTD
The TRA-300 accurately measures the thermal resistance, junction temperature, optical power, voltage, current and other parameters of LED packaging products.The heating and cooling curves of LED can also be obtained, and the integral and differential thermal structure functions can be obtained by establishing the finite element model.Through the structural function analysis of the TRA-300 special software, the fine thermal resistance structure of the LED (from the chip to the thermal resistance value of each package structure) can be obtained, so as to objectively evaluate the heat dissipation quality and thermal management level of the LED package products, and provide the best verification for the heat dissipation design of the LED.
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Optical Design and Simulation Services
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The key area of expertise and the basis for all developments at the Fraunhofer IOF is optical and mechanical design as well as the simulation and analysis of optical and opto-mechanical systems inclusive of thermal and thermo-optical effects. Extensive design and modeling tools enable the simulation and optimization of systems for the THz to X-ray range - from micro-optics to astronomical telescopes.
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Product
5-slot ATX-supported PICMG 1.3 Bus Passive Backplane
FAB110
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The FAB110 offers one PCIe x16 slot, one PCIe x4 slots and two 32bit/33MHz PCI slots as well as the PICMG 1.3 slot for the SHB (system host board). The onboard 24-pi ATX power connector and 8-pin connector for thermal detected board are featured. Furthermore, the backplane supports two high speed USB 2.0 ports. The FAB110 is designed for the 6-slot industrial chassis, such as Axiomtek's AX60501 and AX6052.
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Thermal Imaging Monoculars
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Thermal monoculars are tailored to outdoor lovers, designed with convenience and ease of use in mind. This series is also ergonomic and lightweight, with excellent imaging, making it a perfect tool for hunting and nightsighting.
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Product
Climatic Test Chamber
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Before anything reaches out for market distribution, you would need to determine its exact quality and performance to that follows to the point with readings. Thermal and environment testing are some of the most positive aspects to get your materials tested for their underlying performance capacity and reliability in quality.
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Thermal Neutron Detector
TN15
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The TN15 high sensitivity thermal neutron detector utilizes a state-of-the-art silicon photomultiplier (SiPM) and offers world-leading specification in a compact form. The TN15 surpasses the performance of a 100mm long 13mm3 He tube at 4 atmospheres and does not need cooling but operates at room temperature.
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Product
MAX31855 J-Type Thermocouple Sensor Breakout
SEN-30003-J
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Breakout board for the MAX31855J digital thermocouple interface ICs by Maxim. Measured temperature range is -210C-1200C with known thermal characteristics and output resolution of 0.25C. This sensor supports a larger operating range (specifically in the negative range) than its predecessors, the MAX6674 and MAX6675, though it is not pin-pin compatible. This board is interfaced with a 0.1" 2x5 pin header (8-pins used), has four vertical mini thermocouple connectors and four mounting holes for standoffs and 4-40 screws. The SEN-30003 is interfaced via 3 or 4-wire SPI with a data-ready output for specific operating modes. An LDO and a high-speed level shifter are included to allow interfacing with microcontroller devices between 3.0V and 5V (all Arduinos, Raspberry PI, etc) without sacrificing device performance (many other level shifters reduce data rates to below 500 kHz).
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Smoke Detection Sensor - CE Approved
ENVIROMUX-SDS-CE
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For warning of smoke. Photoelectric smoke detector. Smoke sensitivity: 0.08-0.14 dB/m. Built-in 135° F (57° C) thermal heat sensor. Includes mounting hardware. Connect to RJ45 or digital input sensor ports. Supports CAT5/5e/6 UTP or STP cables. Screw terminal. To connect to the RJ45 inputs use CAT5/5e/6 cable terminated at one end with RJ45 connector. Connect the un-terminated end to the sensor screw terminal. Operating temperature: 14 to 122°F (-10 to 50°C). Maximum cable length: 1,000 ft (305 m). Powered by ENVIROMUX-2D/5D/16D. Regulatory approvals: CE, RoHS.
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Product
40-CH 100G Thermal AWG
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Flyin’s 40 channel 100G Thermal AWG(100G TAWG) is designed for use within the C -band release of DWDM system. To decrease the power dissipation of the devices in different environmental conditions, the TAWG package is special designed with selection of reliable thermal plastic with low thermal conduction, and the TAWG operating temperature is controlled by using foil resist heater or Peltier TEC with thermistor temperature sensor. Different input and output fibers, such as SM fibers, MM fibers and PM fiber can be selected to meet different applications. We can also offer different product packages, including special metal box and 19” 1U rackmount.
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Electrical Heat Shrink Tubing Solutions
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TE Connectivity produces Raychem Electrical heat shrink tubing that sets extremely high standards in areas such as insulation, protection, and element proofing. Raychem shrink tubing uses a duplication process that involves a cross-linked material design ensuring cable system's performance. This cross-linked design creates an impenetrable barrier from the elements while simultaneously binding cables and insulating them. The heat shrink process involves tubing that utilizes a thermal influence that causes it to tightly shrink and adhere to a cable. This tight seal is not only ultra-protective, but also flexible, abrasion resistant, and easy to use. This flexible tubing can fit a huge range of cable sizes and specifications. Perfect for various different operations and industrial applications. This includes cables, wires, and even joints.
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Product
SSD
MSATA SSD (iSLC) 3IE4 Series
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Innodisk mSATA 3IE4 is SATA III 6.0 Gb/s flash-based disk, which adopts the latest Marvell NAND controller with Innodisk’s exclusive L³ FW architecture. The upgraded L³ FW architecture, combining Innodik signature 4K mapping algorithm L² FW architecture with powerful LDPC technology, makes 3IE4 series have outstanding high IOPS, better data integrity, and extended lifespan by reducing the occurrence of bad block numbers. Built-in thermal sensor and iData Guard ensure data integrity and reliability of mSATA 3IE4 for industrial applications.
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Thermal Shock Chambers
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Shanghai Morningtest Environmental Chambers Co.,Ltd.
Thermal Shock Chambers are designed for the safe, efficient, and accurate environmental testing of electronics and consumer products, and aerospace, telecommunications, and military and defense components.
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Product
Package Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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AI Developer Kit Based On NVIDIA Nova Orin
MIC-732D-AO
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Open-frame carrier design with thermal solution. Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS. Supports 1 x 10GbE, 1 x 2.5GbE, 3 x USB 3.2 Gen 2 (10 Gbit/s). Supports 2 x CANbus, 1 x mPCIe, 2 x Nano SIM slots.
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Flat-plate Thermal Conductivity Tester
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TESTEX Testing Equipment Systems Ltd.
Flat-plate Thermal Conductivity Tester, to determine the thermal conductivity of various fabrics, quilting products, and other heat insulation materials.
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Ultra sensitive heat flux plate
HFP03
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Hukseflux Thermal Sensors B.V.
HFP03 is an ultra sensitive sensor for heatflux measurement of small heat fluxes through soil, walls and building envelopes. By using a ceramics-plastic composite body the total thermal resistance is kept small.
