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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
Memory Module
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
1U Rackmount Network Appliance With Intel Atom® P5300 Processor For UCPE/SD-WAN And NGFW. Ideal For SD-WAN Deployments And Universal CPE Applications.
FWA-2013
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Intel Atom® P5300, up to 24 Cores2 x DDR4 DIMM slots, up to 128GB8 x GbE RJ-45, 2 x 2.5GbE RJ-45, 4 x 10GbE SFP+ slots with 2 pairs of LAN bypassIntel® QAT with up to 100G crypto supportIPMI v2.0 compliant BMC with web interfaceHot-swap redundant PSU1 x Advantech network module expansion
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Product
SOM Module
TEO820-ZU3EG
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784EZU3EG (optional ZU5EV) 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Product
COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
Software Development Kit
Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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Product
15" Fanless Panel PC With Intel® Celeron® J6412 Processor
PPC-315 EHL
Panel PC
Industrial-grade 15" XGA TFT LCD with 70K backlight lifetimeDurable true-flat touchscreen with 5-wire resistive/projected capacitive touch controlIntel® Celeron® J6412 quad-core, 2.0 GHz, processorUp to 32 GB DDR4 SDRAM1 x RS-232, 1 x RS-232/422/485, 2 x USB 2.0, and 2 x USB 3.1Compact, fanless design with solid aluminum alloy enclosure and IP66-rated front panelSupports E-key for wireless moduleSupports expansion via M.2 slotSupports Windows Embedded Linux and Android OS
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Product
Logic Analyzer Module With State Mode Up To 4Gb/s
U4164A
Logic Analyzer
The U4164A logic analyzer provides industry’s highest data rate state mode (up to 4 Gb/s), highest deep trace timing mode (up to 10 GHz), and deepest memory (up to 400 Mb), enabling validation and debug of DDR4 or LPDDR4 at data rates over 3.5 Gb/s.
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Product
8-Channel 250 MHz A/D with Multiband DDC, Kintex UltraScale FPGA - PCIe
Model 78132
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight wideband DDCs (digital downconverters)- 64 multiband DDCs- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- PCI Express (Gen. 1, 2, &3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized version available
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
Box PC
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
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- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
32G SO-DDR4-3200 2GX8 1.2V SAM -20~85℃
AQD-SD4U32GN32-SB2
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43H
Motherboard
IMB-M43H is an ATX motherboard supporting the Desktop 6th/7th Generation Intel Core i7/i5/i3 Processors with Intel H110 Chipset, providing the most cost-competitive solution anywhere in embedded computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB in two DIMM slots for industrial automation applications, the ADLINK IMB-M43H carries significant competitive advantage in the market. This leading, rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.
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Product
COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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Product
Dual-Band RF Tuner and 4-Ch 400 MHz A/D with Kintex UltraScale FPGA - 6U VPX
Model 58891
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Accepts RF signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to + 10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Four 400 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously- Four FPGA-based multiband DDCs (digital downconverters)- Two Xilinx® Kintex® UltraScale™ FPGA- 10 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- PCI Express interface (Gen. 1, 2 & 3) up to x8- Clock/sync bus for multimodule synchronization- Optional LVDS and gigabit serial connections for FPGA for custom I/O- Navigator BSP® for software development- Navigator FDK® for custom IP development- Spark® fully-integrated development system- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Xeon® E3 Processor LGA1151
AIMB-586
Motherboard
Supports Intel® 8th/ 9th Gen Xeon/ Core™ i7/i5/i3 processor with Q370/C246/H310 chipsetFour U-DIMM sockets support up to 128GB DDR4 2400/2666 MHz SDRAMSupports HDMI2.0a(option),2 DP++,eDP/LVDS(option) displaySupports Intel AMT 12.0 and Intel vPro competentSupports PCIE Gen3, 4 USB3.1, 10 x USB2.0/USB 3.0, upto 4 x SATAIII and quad GbE LAN, M.2(M-key),M.2(E-key)Supports Software RAID 0, 1, 5, 10, TPM 1.2/2.0 (optional)Supports SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-506
Motherboard
Supports Intel® 8th/9th Gen Core i7/i5/i3 processor with H310 chipsetSupports up to 14 COM, 8 USB 3.0, 12 USB 2.0, TPM 1.2/2.0 (optional)Supports Dual display of VGA, DP, DVI, eDP, LVDS (optional) and two GbE LANTwo DIMM sockets support up to 64 GB DDR4 2666 MHz SDRAMSupports WISE PaaS/Device-On, McAfee, Acronis, Edge AI Suite and Embedded Software APIs
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Product
Space Radiation Tolerant 4GB DDR4
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This 4GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications.
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Product
1-Ch 3.6 GHz or 2-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - 6U VPX
Model 57841
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- One-channel mode with one 3.6 GHz, 12-bit A/D- Two-channel mode with two 1.8 GHz, 12-bit A/D- Programmable DDCs (Digital Downconverter)- 5 GB of DDR4 SDRAM- µSync clock/sync for multiboard synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
Intel® 6th/7th Generation Core™ I3/i5/i7 Performance Embedded PC
EPC-B2205
Embedded PC
Supports Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170/H110 chipset.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of VGA/DP/DVI.One expansion slot (low profile).Two Shock Resistant 2.5" drive bays.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly codenamed Skylake)
CMx-SLx
Single Board Computer
The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.
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Product
1U Rackmount Network Appliance With Intel® Xeon® Processor D Family For VE-CPE And Network Applications, 2 NMC Slots
FWA-3260
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Intel® Xeon D-1500 Processors, up to 16 Cores with 2 x 10G MAC4 x DDR4 ECC RDIMM slots4 x 1GbE RJ-45, 2 x 10GbE SFP+ slots with 2 pairs of LAN bypass1 x PCIe x8 slot on rear, supports FH/HL add-on cardsIPMI v2.0 compliant BMC2 x Advantech network module expansions2 x internal 2.5" SATA HDDs/SSDs
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SFF
Model 6350
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The 6350 delivers RFSoC performance in small footprint with a complete system in aruggedized enclosure ideal for deployment in harsh environments. Complementing theRFSoC’s on-chip resources are the 6350’s sophisticated clocking section, a low-noisefront end for RF input and output, 16 GBytes of DDR4, a gigabit serial optical interfacecapable of supporting dual 100 GigE connections, an optional GPS receiver, and generalpurpose I/O signal paths to the FPGA.
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
Industrial Computer
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
1-Ch. 6.4 GHz or 2-Ch. 3.2 GHz A/D, 2-Ch 6.4 GHz D/A Kintex UltraScale - XMC
Model 71141
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/Ds- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- µSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available- Synchronize up to four modules with Model 7192 System Synchronization and Distribution Amplifier - PMC/XMC- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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Product
JadeFX Kintex UltraScale Processor and FMC Carrier - 3U VPX
Model 5983
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family BrochureVITA-57.4 HSFC FMC+ site offers access to a wide range of possible I/O- Supports Xilinx Kintex UltraScale FPGAs- 9 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- LVDS connections to the Kintex UltraScale FPGA for custom I/O- Optional optical interface for backplane gigabit serial interboard communication- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
