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Product
SODIMM DDR4
SQR-SD4N
Dual In-Line Memory Module (DIMM)
Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
Interposer
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Product
Memory Tester for DDR4 DIMMS
RAMCHECK LX
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USBWith the RAMCHECK LX DDR4 memory tester package (part number INN-8686-DDR4) you can quickly test and identify DDR4 DIMMs that comply with JEDEC standards. Tests are fast, reliable and easy to do. The RAMCHECK LX DDR4 package includes the RAMCHECK LX base tester and 288-pin DDR4 DIMM adapter. (This package is also available with the DDR4 DIMM Pro adapter, featuring a very rugged test socket).
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Product
DDR4 RUGGED DIMM
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A Rugged DIMM (Dual In-line Memory Module) is a specialized type of computer memory module designed to operate reliably in harsh, demanding environments that would cause standard commercial RAM to fail.
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
DDR4 MSO Probes
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The DDR4 DIIM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR4 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR4 signals for convenient analog probing. The user can then easily observe both the digital and analog representation of the DDR4 Address, Command and Control bus. Solder down N5541A analog probes purchased separately from Keysight Technologies.
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Product
Dual LGA3647-P0 Intel® Xeon® Scalable EATX Server Board with 24 DDR4, 5 PCIe x16 + 1 PCIe x8, 10 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-935
Server Board
- EATX server board with dual Xeon Scalable processors- DDR4 2933 MHz RDIMM up to 3TB, support Intel Optane DC Persistent Memory- Five PCIe x16 (Gen3) and one PCIe x8 (Gen3) for three double-deck cards- Intel® X557-AT2 dual 10GbE ports- Ten SATA3.0 and six USB3.0 ports- One M.2 2280 (SATA / PCIe compatible)- 0 ~ 40 °C ambient operating temperature range
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Product
LGA 3647-P0 Intel® Xeon® Scalable ATX Server Board with 6 DDR4, 5 PCIe x8 or 2 PCIe x16 and 1 PCIe x8, 8 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-815
Server Board
- ATX server board with Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 768GB, support Intel Optane DC Persistent Memory- Five PCIe x8 or two PCIe x16 and 1 PCIe x8- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and one M.2 connectors (SATA / PCIe compatible)- 0 ~ 60 °C ambient operating temperature range
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Product
15" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-315
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Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMMCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with 5-wire resistive touch control and IP66-rated front panelSupports expansion via Full-size Mini PCIe and NVMeDiverse system I/O and isolated digital I/O via iDoor technologySupports fieldbus protocols via iDoor technology
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Product
15" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-315
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Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Supports expansion via Full-size Mini PCIe and NVMe.Diverse system I/O and isolated digital I/O via iDoor technology.Supports fieldbus protocols via iDoor technology.
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
Server Board
- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
Ultra Grade SODIMM DDR4 2666/3200
SQR-SD4E
Dual In-Line Memory Module (DIMM)
Ultra Wide temperature natively support -40~125C, Micron original Ultra High grade IC adopted. An underfill technique to stronger PCB and IC structural, 30u" Golden finger & Locked BOM components list. Exclusive SQ Manager software to monitor and deliver real time information.
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Product
LGA 1200 Intel® Xeon® W & 10th Gen.Core™ Proprietary Server Board with 4 x DDR4, 1 x PCIeX16, 2 x PCIeX4, 5 x USB 3.2, 3 x SATA 3, Quad LANs and IPMI
ASMB-610
Server Board
- Proprietary server board with LGA 1200 Intel® Xeon® W & 10th Gen. - Core™ i9/i7/i5/i3 processors- Compatible with HPC-61 series chassis- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 slot or two PCIe x8 slots support FH/10.5" Length Cards- Two PCIeX4 slots support low profile expansion cards- 3x SATA 3 ports and 5x USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Quad LAN with Intel I350- Flexible IO board design
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Product
Analyzer Probes
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The following probes are available for the MA51x0 and MA41x0 series analyzers. These probes are designed for low-voltage and high-speed midbus probing or probing with an interposer. The following JEDEC memory standards are widely used by these probes: DDR5 (JESD79-5), DDR4 (JESD79-4), DDR3 (JESD79-3), LPDDR5 & LPDDR5X (JESD209-5), LPDDR4 & LPDDR4X (JESD209-4), and LPDDR3 (JESD209-3).
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Product
Expandable Embedded Box IPC With 10th Gen Intel® CPU
UNO-348
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Intel® 10th Gen socket type processor with DDR4 memoryScalable CPU, RAM selectionCompact, rugged and fanless design for harsh embedded environmentFlexible expansion with up to 3 x PCIe/PCI slots, 1 x M.2 (B-key), 1 x mPCIe & 2 x 2.5" SSDOptional iDoor expansionRemote out-of-band (OOB) power management with Advantech’s iBMC technologyBuilt-in TPM2.0 for hardware-based security
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX
Model 5550
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- Now available in RFSoC Gen 3 with the Model 5553- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development ChassisPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Intel® Core™ I3, N Series And Atom® X7000E/x7000RE Series Processor
AIMB-219
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Intel® Core™ i3, N series and Atom® x7000E/x7000RE SeriesUp to 32GB DDR4 3200MT/s SODIMMTriple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMTHIN Mini-ITX low profile I/O stack design, fanless thermal solutionExtend operating temperature: -20C~70°C (-4 ~ 158 °F)
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Product
Small-Size Integrated DIN-Rail IPC With Intel® Atom® X6413E And X6425RE
UNO-137 V2
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Intel® Atom® x6413E (1.5 GHz) and x6425RE (1.9GHz) processor with 8GB DDR4 memoryWide operating temperature range (-40 ~ 70 °C/-40 ~ 158 °F) and wide power input range (10 ~ 36 VDC)Port isolation for 8 x DI, 8 x DO, 2 x COMDP++ ensures HDMI/DVI compatibilityDual storage: 1 xM.2 M-key 2242 PCIe/NVMe or SATA/SSD and 1 x mSATAOnboard TPM 2.0 provides hardware-based securityModular design for optional iDoor extensionRuggedized DIN-rail kitCompliant with IEC 61010-1 safety requirements
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ MicroATX Server Board with 4 DDR4, 4 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-586
Server Board
- LGA 1151 Intel® Xeon® E and 8th/9th generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 128GB- One PCIe x16, two PCIe x4 and one PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- 0 ~ 60° C ambient operating temperature range
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Product
LGA 4094 AMD® EPYC™ 7003 ATX Server Board with 8x DDR4, 5x PCIe 4.0 x16 + 2x PCIe 4.0 x8, 9x SATA 3, 5x USB 3.0, Dual 10GbE, and IPMI
ASMB-830
Server Board
- LGA 4094 (Socket SP3) ATX server board with AMD EPYC™ 7003 processor- DDR4 3200 MHz RDIMM up to 128GB per DIMM- Features 5x PCIe 4.0 x16, 2x PCIe 4.0 x8- Intel® X550 dual 10GbE ports- Eight (via SFF-8643 connector) + one SATA 3 and two M.2 connectors (SATA/PCIe 4.0 compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
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Product
Mini PC
DS-410
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Palm-sized mini PC designed for hospitality and signage applications. Stylish Aluminum Die-cast Design with Intel Atom® J6412 processor. Optimized GFX performace by on board 4GB/8GB DDR4 (3777Mhz). Support HDMI 2.0 up to 4K(3840 x 2160), and VGA up to Full HD.
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Product
DDR4 SODIMM
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Small Outline Dual In-line Memory Module) is a compact type of RAM designed for devices with limited space, specifically laptops, mini-PCs, and embedded systems.
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Product
1-Ch. 6.4 GHz or 2-Ch. 3.2 GHz A/D, 2-Ch 6.4 GHz D/A Kintex UltraScale - 3U VPX
Model 54141A
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Exceptional dynamic range and analog signal integrity- Xilinx® Kintex® UltraScale™ FPGAs- Compatible with several VITA standards including: VITA 66.5 and VITA 67.3C- Supports VITA 49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/Ds- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- uSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available- Navigator® BSP for software development- Navigator® FDK for custom IP development- SPARK® fully-integrated development system
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Product
3-Ch 200 MHz A/D with DDC & 2-Ch 800 MHz D/A with DUC, Kintex UltraScale - 6UVPX
Model 57821
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Three 200 MHz 16-bit A/Ds- Three multiband DDCs (digital downconverters)- One DUC (digital upconverter)- Two 800 MHz 16-bit D/As- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43
Motherboard
The ADLINK IMB-M43 is industry's first 6th/7th Gen Intel Core i7/i5/i3 Processor (formerly codenamed Skylake/Kabylake) based industrial ATX motherboard in the LGA1151 package with Intel Q170 Express chipset. The ADLINK IMB-M43 supports high-speed data transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz memory up to 64 GB in four DIMM slots.
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Product
8-Channel 250 MHz A/D with DDC, Kintex UltraScale FPGA - XMC
Model 71131
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Powerful Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SFF
Model 6350
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- Now available in RFSoC Gen 3 with the Model 6353- Small form factor rugged enclosure- Conduction-cooled- Designed to the IP67 specification for dust and water immersion- Sealed military-grade circular connectors- Incorporates Xilinx® Zynq® UltraScale+" RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- Optional dual 100 GigE UDP optical interface- Optional fan cooling for benchtop use- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Extended ATX Industrial Motherboard
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The C62EX server-class motherboard supports the 3rd Gen Intel Xeon Scalable processors, achieving high-performance and power efficiency, and is optimized for storage, security, and communications applications.3 PCIe x16 and 2 PCIe x8 slots allow ample room for add-on cards, and the slimline and OCP connectors give you a multitude of storage and communications options. Dual processor support, and 16 DDR4 ECC memory slots make sure enough performance is available at your fingertips.
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Product
8-Channel 250 MHz A/D with Multiband DDC, Kintex UltraScale FPGA - 6U VPX
Model 57132
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight wideband DDCs (digital downconverters)- 64 multiband DDCs- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- PCI Express (Gen. 1, 2, &3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available





























