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Product
9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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Product
8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-286EF
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Supports Intel® 8th/9th Gen Core™ i processor (LGA1151) with Intel H310 chipsetOne 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAMSupports PCIe x 16 (Gen 3), 1 M.2 B key, 1 M.2 E key, 2 COM, 4 USB 3.0 and 3 SATA IIISupports dual display of DP/HDMI/LVDS(or eDP)Supports TPM 1.2 / 2.0 (optional)THIN Mini-ITX with 12V DC InputSupport Windows10 LTSC, Ubuntu 20.04 LTS, SUSI API, and WISE-DeviceOn
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Product
Pocket-Size Edge IoT Gateway With Intel® Celeron®N6210/Pentium® N6415
UNO-2271G V2
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Intel® Celeron® Dual core N6210/ Pentium® Quad core N6415 processor with 4GB/8GB DDR4 onboard memoryPocket-size, robust, fanless and cable-free system with high stabilityOptional second stack for increasing functionality including POE, COM, wireless connectivity or iDoor expansionSupport Windows 11 IoT Enterprise LTSC, Win10, Ubuntu Classic and Ubuntu Core 20Microsoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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Product
1-Ch. 6.4 GHz or 2-Ch. 3.2 GHz A/D, 2-Ch 6.4 GHz D/A Kintex UltraScale - 3U VPX
Model 52141
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/D- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- µSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x4- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-279
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12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR4 3200MHz, max. 64GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power InputWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Product
System on Module Microsemi PolarFire
SoM3-MPF300T
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Sundance Multiprocessor Technology Ltd.
The SoM3-MPF300T is a small footprint System On Module (SoM) with 40x50mm dimensions. It has a low power, highly secure FPGA from the PolarFire family from Microsemi. It comes with 4GB of DDR4 memory, Ethernet PHY, and FLASH. This SoM is ideal for being used in complex hardware designs, and is compatible with Sundance SoM carriers SE215 and EMC2-DP-V2.
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Product
PCIe FPGA Carrier For FMC, Virtex UltraScale™
PCI595
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The PCI595 is based on the Xilinx XCVU440 Virtex UltraScale FPGA, which provides 2,880 DSP slices, 88.6 Mb RAM and 5,541,000 logic cells. The FPGA interfaces directly to the FMC DP 0-9 and all FMC LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 modules. It also has interface to one DDR4, 64-bit wide, with 8 GB total memory. This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 Processor
IMB-M45H
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ADLINK IMB-M45H ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 processor in the LGA1151 package, and the Intel H310 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe Gen3, USB 3.1 Gen1 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz memory up to 64 GB in two DIMM slots.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
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8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
4-Channel 200 MHz A/D with DDC, Kintex UltraScale FPGA - 6U VPX
Model 57861
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Four 200 MHz 16-bit A/Ds- Four multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Industrial Memory
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Advantech SQRAM Industrial Memory solutions offer an extensive portfolio of industrial grade DRAM solutions, such as UDIMM, SODIMM, ECC-DIMM, RDIMM, and LRDIMM designed according to the JEDEC standards and cover all technologies including DDR, DDR2, DDR3, DDR4 in wide temp ranges (-40 to 85°C).
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Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
1-Ch 3.6 GHz or 2-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - PCIe
Model 78841
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Ideal radar and software radio interface solution Supports Xilinx Kintex UltraScale FPGAs One-channel mode with 3.6 GHz, 12-bit A/D Two-channel mode with 1.8 GHz, 12-bit A/D Programmable one- or two-channel DDC (Digital Downconverter) 5 GB of DDR4 SDRAM µSync clock/sync for multiboard synchronization PCI Express (Gen. 1, 2 & 3) interface up to x8
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Product
JadeFX Kintex UltraScale Processor and FMC Carrier - 3U VPX
Model 5983
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family BrochureVITA-57.4 HSFC FMC+ site offers access to a wide range of possible I/O- Supports Xilinx Kintex UltraScale FPGAs- 9 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- LVDS connections to the Kintex UltraScale FPGA for custom I/O- Optional optical interface for backplane gigabit serial interboard communication- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
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Product
SOM Module
TEO820-ZU4EV
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784EZU4, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)
