3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Time-of-Flight 3D Camera with IP67 Protection Class, Sub-Millimeter Precision
LUCID Helios2
Time-of-flight camera with IP67 protection class;Dust and water resistant; HDRmodel available ! Sony DepthSense IMX556 CMOS sensor; Resolution 0.3 MP 640 x 480; Frequency: 30 frames / s; Price: $ 1,645.00.
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Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
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Inline Wafer Electrical quality Inspection
ILS-W2
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Installation of Visual Inspection of the Inner Surface of Hollow Cylindrical Parts
Create an installation that allows visual inspection of the inner surface of hollow cylindrical parts with the ability to display the resulting image on a personal computer monitor with its subsequent saving in the JPEG format.
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Automatic Double-Sided Bare PCB Final Inspection AVI System
FI-18 Series
InScan Limited (SIP) Co., Ltd.
InScan FI-18 is a compact and high performance fully automatic double sided AVI system for Final Inspection of PCB boards.The setup is based on golden board and CAD data which greatly simplifies the setup process. The FI-18 series inspects and processes a double sided board sized 210X300 mm 5.5 sec. Superior interline high resolution CCD sensor.
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Magnetic Particle Inspection
Shanghai Xianda Denshijiki Industry Co.,Ltd
Using the "leakage magnetic flux" phenomenon generated from the scratches, the magnetic powder (or fluorescent magnetic powder) of the ferromagnetic material scattered on the surface by magnetizing the specimen is adsorbed to the scratch. Observe this and detect scratches.
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Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
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Open-Frame Collet Socket with Solder Tail Pins
Series 518
Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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Real-time X-ray Inspection Systems
Ultra-Compact™
Glenbrook Technologies redefines X-ray Inspection with our smallest JewelBox Micro focus x-ray system yet. With dimensions of just 22”W x 26”L, it’s small enough to fit on a standard desk, in an office or small lab. But it’s big in capabilities with >500x magnification , 5 axis manipulator and advanced image processing. To view our product video, please click below the product image to the right.
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Fiber Inspection Probe
FIP-920
FIP-920 Fiber Optic Inspection Probe combines a 3.5” high definition TFT LCD display, provides a detailed image of fiber end-face, zoom in/out feature make it easy to identify the smallest particles, scratches. With the attached SD card memory, you can capture/record the live end-face image, the image file can be reviewed/transferred via SD card reader or USB cable. Up to 8hrs battery working make it possible to inspect the fiber end-face at any time and any place.
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Wireless Inspection Cameras
General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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GPR Bridge Inspection Equipment
BridgeScan
Geophysical Survey Systems, Inc.
BridgeScan™ is a complete, affordable GPR system that is an effective tool for quickly determining the condition of aging bridge decks, parking structures, balconies and other concrete structures. The system is also used to obtain accurate concrete cover depth on new structures.
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Real-time X-ray Inspection Systems
JewelBox Series
JewelBox x-ray inspection systems feature ultra-high resolution, powerful microfocus x-ray tubes, five-axis, and positioners. The JewelBox Series is divided into three broad categories: JewelBox 70-T, JewelBox 90-T and Ultra Compact each of which can be customized for specific applications.
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Portable gear inspection- and 3D-measuring systems
ultimate independent measurement - on the production machine or on the shop-floor without rotary table
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X-Ray Inspection
MXI Jade Plus
Restrictions in manufacturing materials and ever increasing expectations for reliability mean ensuring quality product manufacture is more important than ever. Jade Plus enables you to Prove Your Quality and reduce product returns from the field, and the associated cost and damage to reputation.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Handheld 3D Scanner
Peel
Accurate handheld 3D scanner for fast and easy data collection. A next-generation companion to Verisurf software for digitizing/reverse engineering & high volume pointcloud inspection.
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Automated Optical Inspection (AOI)
TR7700 SIII
TR7700 SIII is the newest generation of TRI's AOI solutions, delivering precise multi-phase inspection at full speed. By combining an ultra-fast camera, intelligent auto conveyor, and new GUI, the TR7700 SIII offers a powerful and easy to use AOI solution with fast programming, optimized board loading, production line integration and support for offline programming. TRI's new color algorithm combined with multiple lighting phases increase defect coverage and help deliver highly accurate inspection results with a minimum of false calls.
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LED Inspection
Indicates which LEDs are not working. Checks if all diodes are placed in the correct places. Independently configures a test program for each new LED panel. Fast and effective – 1000 LED panel test takes up to 3 seconds.
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Cutting-edge 3D GPR array solution for efficient subsurface imaging cart solutions
Raptor
The Raptor system covers a wide range of applications and can be configurated with 450 MHz or 800 MHz antennas. Raptor 3D Arrays are based on Real-Time sampling (RTS) technology and the unique antenna design is a milestone in the evolution of the GPR. A Raptor Antenna can be arranged in different ways, which allows for both standard and more advanced GPR measurements. These include common mid-point (CMP), wide-angle reflection and refraction (WARR) and Tomography.
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Micro Coax, Two Piece Contact, Receiver, PCB Vertical Mount, Solder
610140109
For vertical PCB terminations. Used with standard 50 and 120 Pin Micro Coax Modules.Up to 10GHz transmission speeds (PCB design dependent). Two-piece contact that allows for pin replacement, field repairable. Mates to all existing Micro Coax contacts.
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Ensenso 3D Cameras
X Series
Imaging Development Systems GmbH
The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.
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Drone Inspection Software
Qii.AI
Qii.AI automates the detection and analysis of defects. It is the only enterprise AI platform that combines drone inspection software with an AI labeling tool, AI-assisted computer vision, and machine learning.
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GPR System for Concrete Inspection
StructureScan Mini XT
Geophysical Survey Systems, Inc.
The StructureScan Mini XT is GSSI’s newest generation of our very popular all-in-one GPR systems. The StructureScan Mini XT offers a 2.7 GHz antenna for superior target resolution and can reach depths of 20 inches (50 cm). Ideal for locating rebar, conduits, post-tension cables, voids, and real time determination of concrete slab thickness.
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37-Pin D-Type Female Solder Bucket
92-960-037-F
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Fiber End-Face Inspection Interferometer
CLEAVEMETER 3D
The CLEAVEMETER 3D™ is a non-contact interferometer designed for inspecting the end-faces of cleaved or polished optical fibers with cladding diameters of 125 µm to 1200 µm. It gives immediate and precise information on important end-face properties such as flatness, perpendicularity, hackles and dust. Based on the NYFORS CLEAVEMETER 3D™ design, in addition to producing sharp fringe patterns it also generates three-dimensional images of the cleaved fiber end.
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High Energy Industrial CT X-Ray Inspection System
MeVX Series
The most advanced industrial DR & CT systems in the world are now available with Linear Accelerators. Offered with energies up to 9MeV, the MeVX series of systems provide the same ease of use as our low energy systems in a high energy format. Utilizing our current efX software platform along with the superior service, support & training that we are known for puts these systems in a class of their own.
